Kieran H. Harney

Person

Andover, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Techniques for alternate pressure equalization of a sensor
- Patent number 12,013,282
- Issue date Jun 18, 2024
- Invensense, Inc.
- Jeremy Parker
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Techniques for alternate pressure equalization of a sensor
- Patent number 11,467,025
- Issue date Oct 11, 2022
- Invensense, Inc.
- Jeremy Parker
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated temperature sensor in microphone package
- Patent number 10,911,850
- Issue date Feb 2, 2021
- Invensense, Inc.
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transducer with enlarged back volume
- Patent number 10,399,850
- Issue date Sep 3, 2019
- Invensense, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems (MEMS) microphone bias voltage
- Patent number 10,349,170
- Issue date Jul 9, 2019
- Invensense, Inc.
- Kieran Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a packaged microphone
- Patent number 10,257,609
- Issue date Apr 9, 2019
- Invensense, Inc.
- David Bolognia
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microphone module with sound pipe
- Patent number 10,257,610
- Issue date Apr 9, 2019
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Micro-electro-mechanical system microphone with dual backplates
- Patent number 10,206,047
- Issue date Feb 12, 2019
- Invensense, Inc.
- Kieran Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated temperature sensor in microphone package
- Patent number 10,142,718
- Issue date Nov 27, 2018
- Invensense, Inc.
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems (MEMS) microphone bias voltage
- Patent number 10,045,121
- Issue date Aug 7, 2018
- Invensense, Inc.
- Kieran Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Including control data in a serial audio stream
- Patent number 10,031,877
- Issue date Jul 24, 2018
- Invensense, Inc.
- Jerad M. Lewis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transducer with enlarged back volume
- Patent number 9,738,515
- Issue date Aug 22, 2017
- Invensense, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone system for harsh environments
- Patent number 9,681,242
- Issue date Jun 13, 2017
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microphone with built-in speaker driver
- Patent number 9,544,673
- Issue date Jan 10, 2017
- Invensense, Inc.
- Jerad M. Lewis
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wide dynamic range microphone
- Patent number 9,407,996
- Issue date Aug 2, 2016
- Invensense, Inc.
- Olli Haila
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-microphone system
- Patent number 9,338,538
- Issue date May 10, 2016
- Invensense, Inc.
- Jason W. Weigold
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaged microphone with frame having die mounting concavity
- Patent number 9,332,332
- Issue date May 3, 2016
- Invensense, Inc.
- David Bolognia
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectromechanical systems device optimized for flip-chip assem...
- Patent number 9,282,389
- Issue date Mar 8, 2016
- Invensense, Inc.
- Aleksey S. Khenkin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microphone module with sound pipe
- Patent number 9,173,015
- Issue date Oct 27, 2015
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microphone with aligned apertures
- Patent number 9,078,068
- Issue date Jul 7, 2015
- Invensense, Inc.
- Eric Langlois
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wide dynamic range microphone
- Patent number 9,008,323
- Issue date Apr 14, 2015
- Invensense, Inc.
- Olli Haila
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multiple microphone system
- Patent number 9,002,036
- Issue date Apr 7, 2015
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Noise mitigating microphone system and method
- Patent number 8,995,693
- Issue date Mar 31, 2015
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaged microphone with frame having die mounting concavity
- Patent number 8,965,027
- Issue date Feb 24, 2015
- Invensense, Inc.
- David Bolognia
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
MEMS microphone system for harsh environments
- Patent number 8,841,738
- Issue date Sep 23, 2014
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microphone module with sound pipe
- Patent number 8,767,982
- Issue date Jul 1, 2014
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-microphone system
- Patent number 8,477,983
- Issue date Jul 2, 2013
- Analog Devices, Inc.
- Jason W. Weigold
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Noise mitigating microphone system and method
- Patent number 8,351,632
- Issue date Jan 8, 2013
- Analog Devices, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multiple microphone system
- Patent number 8,270,634
- Issue date Sep 18, 2012
- Analog Devices, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wide dynamic range microphone
- Patent number 8,223,981
- Issue date Jul 17, 2012
- Analog Devices, Inc.
- Olli Haila
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
TECHNIQUES FOR ALTERNATE PRESSURE EQUALIZATION OF A SENSOR
- Publication number 20220381605
- Publication date Dec 1, 2022
- InvenSense, Inc.
- Jeremy Parker
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TECHNIQUES FOR ALTERNATE PRESSURE EQUALIZATION OF A SENSOR
- Publication number 20200056934
- Publication date Feb 20, 2020
- InvenSense, Inc.
- Jeremy Parker
- G01 - MEASURING TESTING
Information Patent Application
MICROPHONE MESH NETWORK
- Publication number 20190166424
- Publication date May 30, 2019
- InvenSense, Inc.
- Kieran Harney
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED TEMPERATURE SENSOR IN MICROPHONE PACKAGE
- Publication number 20190052944
- Publication date Feb 14, 2019
- InvenSense, Inc.
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE BIAS VOLTAGE
- Publication number 20180332390
- Publication date Nov 15, 2018
- InvenSense, Inc.
- Kieran Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRANSDUCER WITH ENLARGED BACK VOLUME
- Publication number 20170334715
- Publication date Nov 23, 2017
- InvenSense, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE BIAS VOLTAGE
- Publication number 20170318385
- Publication date Nov 2, 2017
- InvenSense, Inc.
- Kieran Harney
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE WITH DUAL BACKPLATES
- Publication number 20170318395
- Publication date Nov 2, 2017
- InvenSense, Inc.
- Kieran Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROPHONE MODULE WITH SOUND PIPE
- Publication number 20170215001
- Publication date Jul 27, 2017
- InvenSense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INCLUDING CONTROL DATA IN A SERIAL AUDIO STREAM
- Publication number 20160239451
- Publication date Aug 18, 2016
- InvenSense, Inc.
- Jerad M. Lewis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGED MICROPHONE WITH FRAME HAVING DIE MOUNTING CONCAVITY
- Publication number 20160234592
- Publication date Aug 11, 2016
- InvenSense, Inc.
- David Bolognia
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROPHONE WITH BUILT-IN SPEAKER DRIVER
- Publication number 20160182987
- Publication date Jun 23, 2016
- InvenSense, Inc.
- Jerad M. Lewis
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED TEMPERATURE SENSOR IN MICROPHONE PACKAGE
- Publication number 20160165330
- Publication date Jun 9, 2016
- InvenSense, Inc.
- Anthony D. Minervini
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE OPTIMIZED FOR FLIP-CHIP ASSEM...
- Publication number 20160050475
- Publication date Feb 18, 2016
- InvenSense, Inc.
- Aleksey S. Khenkin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROPHONE MODULE WITH SOUND PIPE
- Publication number 20160044409
- Publication date Feb 11, 2016
- InvenSense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS MICROPHONE SYSTEM FOR HARSH ENVIRONMENTS
- Publication number 20150304787
- Publication date Oct 22, 2015
- InvenSense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROPHONE WITH ALIGNED APERTURES
- Publication number 20150271617
- Publication date Sep 24, 2015
- InvenSense, Inc.
- Eric Langlois
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wide Dynamic Range Microphone
- Publication number 20150189445
- Publication date Jul 2, 2015
- InvenSense, Inc.
- Olli Haila
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGED MICROPHONE WITH FRAME HAVING DIE MOUNTING CONCAVITY
- Publication number 20150125007
- Publication date May 7, 2015
- InvenSense, Inc.
- David Bolognia
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROPHONE MODULE WITH SOUND PIPE
- Publication number 20140294221
- Publication date Oct 2, 2014
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Packaged Microphone with Frame Having Die Mounting Concavity
- Publication number 20140233782
- Publication date Aug 21, 2014
- InvenSense, Inc.
- David Bolognia
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS Microphone System for Harsh Environments
- Publication number 20140091406
- Publication date Apr 3, 2014
- InvenSense, Inc.
- Kieran P. Harney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transducer with Enlarged Back Volume
- Publication number 20140001580
- Publication date Jan 2, 2014
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multi-Microphone System
- Publication number 20130236037
- Publication date Sep 12, 2013
- Analog Devices, Inc.
- Jason W. Weigold
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Microphone Module with Sound Pipe
- Publication number 20130129136
- Publication date May 23, 2013
- Analog Devices, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Noise Mitigating Microphone System and Method
- Publication number 20130101151
- Publication date Apr 25, 2013
- Analog Devices, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wide Dynamic Range Microphone
- Publication number 20120321100
- Publication date Dec 20, 2012
- Analog Devices, Inc.
- Olli Haila
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multiple Microphone System
- Publication number 20120207324
- Publication date Aug 16, 2012
- Analog Devices, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Noise Mitigating Microphone System and Method
- Publication number 20100054495
- Publication date Mar 4, 2010
- Analog Devices, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Stacked MEMS Device
- Publication number 20100032268
- Publication date Feb 11, 2010
- Analog Devices, Inc.
- Liam O. Suilleabhain
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Kieran H. Harney

Person

Patents Grantslast 30 patents

Techniques for alternate pressure equalization of a sensor

Techniques for alternate pressure equalization of a sensor

Integrated temperature sensor in microphone package

Transducer with enlarged back volume

Microelectromechanical systems (MEMS) microphone bias voltage

Method of forming a packaged microphone

Microphone module with sound pipe

Micro-electro-mechanical system microphone with dual backplates

Integrated temperature sensor in microphone package

Microelectromechanical systems (MEMS) microphone bias voltage

Including control data in a serial audio stream

Transducer with enlarged back volume

MEMS microphone system for harsh environments

Microphone with built-in speaker driver

Wide dynamic range microphone

Multi-microphone system

Packaged microphone with frame having die mounting concavity

Microelectromechanical systems device optimized for flip-chip assem...

Microphone module with sound pipe

Microphone with aligned apertures

Wide dynamic range microphone

Multiple microphone system

Noise mitigating microphone system and method

Packaged microphone with frame having die mounting concavity

MEMS microphone system for harsh environments

Microphone module with sound pipe

Multi-microphone system

Noise mitigating microphone system and method

Multiple microphone system

Wide dynamic range microphone

Patents Applicationslast 30 patents

TECHNIQUES FOR ALTERNATE PRESSURE EQUALIZATION OF A SENSOR

TECHNIQUES FOR ALTERNATE PRESSURE EQUALIZATION OF A SENSOR

MICROPHONE MESH NETWORK

INTEGRATED TEMPERATURE SENSOR IN MICROPHONE PACKAGE

MICROELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE BIAS VOLTAGE

TRANSDUCER WITH ENLARGED BACK VOLUME

MICROELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE BIAS VOLTAGE

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE WITH DUAL BACKPLATES

MICROPHONE MODULE WITH SOUND PIPE

INCLUDING CONTROL DATA IN A SERIAL AUDIO STREAM

PACKAGED MICROPHONE WITH FRAME HAVING DIE MOUNTING CONCAVITY

MICROPHONE WITH BUILT-IN SPEAKER DRIVER

INTEGRATED TEMPERATURE SENSOR IN MICROPHONE PACKAGE

MICROELECTROMECHANICAL SYSTEMS DEVICE OPTIMIZED FOR FLIP-CHIP ASSEM...

MICROPHONE MODULE WITH SOUND PIPE

MEMS MICROPHONE SYSTEM FOR HARSH ENVIRONMENTS

MICROPHONE WITH ALIGNED APERTURES

Wide Dynamic Range Microphone

PACKAGED MICROPHONE WITH FRAME HAVING DIE MOUNTING CONCAVITY

MICROPHONE MODULE WITH SOUND PIPE

Packaged Microphone with Frame Having Die Mounting Concavity

MEMS Microphone System for Harsh Environments

Transducer with Enlarged Back Volume

Multi-Microphone System

Microphone Module with Sound Pipe

Noise Mitigating Microphone System and Method

Wide Dynamic Range Microphone

Multiple Microphone System

Noise Mitigating Microphone System and Method

Stacked MEMS Device