Kim K Chen

Person

Dunwoody, GA, US

People

Patents Grantslast 30 patents

Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with embedded heat dissipation features
- Patent number 11,133,237
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,037,852
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with embedded heat dissipation features
- Patent number 10,629,510
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,461,009
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package interposer with die cavity
- Patent number 10,446,520
- Issue date Oct 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices
- Patent number 10,332,823
- Issue date Jun 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of cooling packaged semiconductor devices
- Patent number 10,157,818
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages with thermal management features for reduced...
- Patent number 10,062,665
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC package and methods of forming the same
- Patent number 9,985,001
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with embedded heat dissipation features
- Patent number 9,978,660
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packages with heat dissipation structures
- Patent number 9,941,251
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming 3D integrated circuit package with panel type lid
- Patent number 9,859,266
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package interposer with die cavity
- Patent number 9,780,072
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 9,735,082
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with thermal management features for reduced thermal cross...
- Patent number 9,595,506
- Issue date Mar 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with thermal interface material on the sidewalls of stacke...
- Patent number 9,583,415
- Issue date Feb 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packages with heat dissipation structures
- Patent number 9,576,938
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit package processing with panel type lid
- Patent number 9,502,383
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure and method of testing electrical characteristics of...
- Patent number 9,462,692
- Issue date Oct 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D semiconductor package interposer with die cavity
- Patent number 9,385,095
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packages with heat dissipation structures
- Patent number 9,379,036
- Issue date Jun 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with thermal management features for reduced thermal cross...
- Patent number 9,269,694
- Issue date Feb 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 9,224,673
- Issue date Dec 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
3DIC package and methods of forming the same
- Patent number 9,184,128
- Issue date Nov 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packages with heat dissipation structures
- Patent number 9,082,743
- Issue date Jul 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packages with heat sinks attached to heat dissipating rings
- Patent number 9,076,754
- Issue date Jul 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure and method of testing electrical characteristics of...
- Patent number 8,993,432
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packages with heat dissipation structures
- Patent number 8,946,887
- Issue date Feb 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package interposer with die cavity
- Patent number 8,865,521
- Issue date Oct 21, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20210287956
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH EMBEDDED HEAT DISSIPATION FEATURES
- Publication number 20200251398
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20200027809
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices
- Publication number 20190122959
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20190096781
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Embedded Heat Dissipation Features
- Publication number 20180269127
- Publication date Sep 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Semiconductor Package Interposer with Die Cavity
- Publication number 20180026008
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Thermal Management Features for Reduced Thermal Cross...
- Publication number 20170162542
- Publication date Jun 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packages with Heat Dissipation Structures
- Publication number 20170148767
- Publication date May 25, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming 3D Integrated Circuit Package With Panel Type Lid
- Publication number 20170077078
- Publication date Mar 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Package and Methods of Forming the Same
- Publication number 20170062391
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packages with Heat Dissipation Structures
- Publication number 20160284670
- Publication date Sep 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Semiconductor Package Interposer with Die Cavity
- Publication number 20160254249
- Publication date Sep 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Thermal Management Features for Reduced Thermal Cross...
- Publication number 20160133602
- Publication date May 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Cooling Packaged Semiconductor Devices
- Publication number 20160111350
- Publication date Apr 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D INTEGRATED CIRCUIT PACKAGE PROCESSING WITH PANEL TYPE LID
- Publication number 20150262973
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Embedded Heat Dissipation Features
- Publication number 20150262904
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test Structure and Method of Testing Electrical Characteristics of...
- Publication number 20150208504
- Publication date Jul 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3DIC Package and Methods of Forming the Same
- Publication number 20150171006
- Publication date Jun 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Thermal Management Features for Reduced Thermal Cross...
- Publication number 20150162307
- Publication date Jun 11, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20150155218
- Publication date Jun 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Thermal Interface Material on the Sidewalls of Stacke...
- Publication number 20150108628
- Publication date Apr 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packages with Heat Dissipation Structures
- Publication number 20150108631
- Publication date Apr 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packages with Heat Sinks Attached to Heat Dissipating Rings
- Publication number 20150035135
- Publication date Feb 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGES WITH HEAT DISSIPATION STRUCTURES
- Publication number 20150035134
- Publication date Feb 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20140252585
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D Semiconductor Package Interposer with Die Cavity
- Publication number 20140217610
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Semiconductor Package Interposer with Die Cavity
- Publication number 20130252378
- Publication date Sep 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test Structure and Method of Testing Electrical Characteristics of...
- Publication number 20130120018
- Publication date May 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

3DIC packaging with hot spot thermal management features

Package with embedded heat dissipation features

3DIC packaging with hot spot thermal management features

Package with embedded heat dissipation features

3DIC packaging with hot spot thermal management features

3D semiconductor package interposer with die cavity

Packaged semiconductor devices

Methods of cooling packaged semiconductor devices

Semiconductor packages with thermal management features for reduced...

3DIC package and methods of forming the same

Package with embedded heat dissipation features

3DIC packages with heat dissipation structures

Method of forming 3D integrated circuit package with panel type lid

3D semiconductor package interposer with die cavity

3DIC packaging with hot spot thermal management features

Packages with thermal management features for reduced thermal cross...

Packages with thermal interface material on the sidewalls of stacke...

3DIC packages with heat dissipation structures

3D integrated circuit package processing with panel type lid

Test structure and method of testing electrical characteristics of...

3D semiconductor package interposer with die cavity

3DIC packages with heat dissipation structures

Packages with thermal management features for reduced thermal cross...

Packages for semiconductor devices, packaged semiconductor devices,...

3DIC package and methods of forming the same

3DIC packages with heat dissipation structures

3DIC packages with heat sinks attached to heat dissipating rings

Test structure and method of testing electrical characteristics of...

3DIC packages with heat dissipation structures

3D semiconductor package interposer with die cavity

Patents Applicationslast 30 patents

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

3DIC Packaging with Hot Spot Thermal Management Features

PACKAGE WITH EMBEDDED HEAT DISSIPATION FEATURES

3DIC Packaging with Hot Spot Thermal Management Features

Packaged Semiconductor Devices

3DIC Packaging with Hot Spot Thermal Management Features

Package with Embedded Heat Dissipation Features

3D Semiconductor Package Interposer with Die Cavity

Packages with Thermal Management Features for Reduced Thermal Cross...

3DIC Packages with Heat Dissipation Structures

Method Of Forming 3D Integrated Circuit Package With Panel Type Lid

3DIC Package and Methods of Forming the Same

3DIC Packages with Heat Dissipation Structures

3D Semiconductor Package Interposer with Die Cavity

Packages with Thermal Management Features for Reduced Thermal Cross...

Methods of Cooling Packaged Semiconductor Devices

3D INTEGRATED CIRCUIT PACKAGE PROCESSING WITH PANEL TYPE LID

Package with Embedded Heat Dissipation Features

Test Structure and Method of Testing Electrical Characteristics of...

3DIC Package and Methods of Forming the Same

Packages with Thermal Management Features for Reduced Thermal Cross...

3DIC Packaging with Hot Spot Thermal Management Features

Packages with Thermal Interface Material on the Sidewalls of Stacke...

3DIC Packages with Heat Dissipation Structures

3DIC Packages with Heat Sinks Attached to Heat Dissipating Rings

3DIC PACKAGES WITH HEAT DISSIPATION STRUCTURES

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

3D Semiconductor Package Interposer with Die Cavity

3D Semiconductor Package Interposer with Die Cavity

Test Structure and Method of Testing Electrical Characteristics of...