Kim Yam Goh

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 10,658,238
- Issue date May 19, 2020
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 9,824,924
- Issue date Nov 21, 2017
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit device with shaped leads and method of forming t...
- Patent number 9,679,870
- Issue date Jun 13, 2017
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with heat dissipater
- Patent number 9,620,438
- Issue date Apr 11, 2017
- STMicroelectronics (Malta) Ltd.
- Roseanne Duca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package (WLCSP) having edge protection
- Patent number 9,576,912
- Issue date Feb 21, 2017
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) card having an IC module and reduced bond w...
- Patent number 9,449,912
- Issue date Sep 20, 2016
- STMicroelectronics Pte Ltd
- Xueren Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic device including two-step encapsulat...
- Patent number 9,379,034
- Issue date Jun 28, 2016
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount package for a semiconductor integrated device, relate...
- Patent number 9,257,372
- Issue date Feb 9, 2016
- STMicroelectronics (Mala) Ltd
- Roseanne Duca
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and devices for packaging integrated circuits
- Patent number 8,907,465
- Issue date Dec 9, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flip-chip fan-out wafer level package for package-on-package applic...
- Patent number 8,884,422
- Issue date Nov 11, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package manufacturing method using wafer-to-wafer bonding
- Patent number 8,822,267
- Issue date Sep 2, 2014
- STMicroelectronics Pte Ltd
- How Yuan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window clamp top plate for integrated circuit packaging
- Patent number 8,796,826
- Issue date Aug 5, 2014
- STMicroelectronics Pte Ltd
- Xueren Zhang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Offset of contact opening for copper pillars in flip chip packages
- Patent number 8,772,943
- Issue date Jul 8, 2014
- STMicroelectronics Pte Ltd
- Xueren Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin quad flat no-lead (QFN) package
- Patent number 8,642,396
- Issue date Feb 4, 2014
- STMicroelectronics, Inc.
- Kim-yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array to pin grid array conversion
- Patent number 8,637,352
- Issue date Jan 28, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-stacked semiconductor dice scale package structure and method...
- Patent number 8,502,394
- Issue date Aug 6, 2013
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level package for an optical sensor and method of man...
- Patent number 8,466,997
- Issue date Jun 18, 2013
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level package with polymeric layer for high reliability
- Patent number 8,436,255
- Issue date May 7, 2013
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,410,598
- Issue date Apr 2, 2013
- STMicroeletronics Pte. Ltd.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip Scale Package structure with can attachment
- Patent number 8,389,335
- Issue date Mar 5, 2013
- STMicroelectronics Asia Pacific PTE Ltd.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structure with can attachment
- Patent number 8,164,179
- Issue date Apr 24, 2012
- STMicroelectronics Asia Pacific PTE Ltd-Singapore
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin quad flat no-lead (QFN) package
- Patent number 8,018,036
- Issue date Sep 13, 2011
- STMicroelectronics Asia Pacific PTE Ltd.
- Kim-yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Step cavity for enhanced drop test performance in ball grid array p...
- Patent number 7,956,475
- Issue date Jun 7, 2011
- STMicroelectronics Asia Pacific PTE Ltd.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color toner and developer compositions and processes for making and...
- Patent number 7,399,566
- Issue date Jul 15, 2008
- Milliken & Company
- Itipon Padunchwit
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Molded high density electronic packaging structure for high perform...
- Patent number 7,361,995
- Issue date Apr 22, 2008
- Xilinx, Inc.
- Kim Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
- Publication number 20180040514
- Publication date Feb 8, 2018
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODS
- Publication number 20160293512
- Publication date Oct 6, 2016
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE INCLUDING TWO-STEP ENCAPSULAT...
- Publication number 20160190029
- Publication date Jun 30, 2016
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH SHAPED LEADS AND METHOD OF FORMING T...
- Publication number 20160172262
- Publication date Jun 16, 2016
- STMicroelectronics Pte Ltd
- Yiyi MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING COMPONENTS IN COMPONENT RECEIVING CAVIT...
- Publication number 20150332995
- Publication date Nov 19, 2015
- STMicroelectronics Pte Ltd
- Kim-Yong GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH HEAT DISSIPATER
- Publication number 20150235929
- Publication date Aug 20, 2015
- STMicroelectronics (Malta) Ltd.
- Roseanne Duca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-LEAD SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150084171
- Publication date Mar 26, 2015
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20140291782
- Publication date Oct 2, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
- Publication number 20140291812
- Publication date Oct 2, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM IN PACKAGE MANUFACTURING METHOD USING WAFER-TO-WAFER BONDING
- Publication number 20140113410
- Publication date Apr 24, 2014
- STMicroelectronics Pte Ltd
- How Yuan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR INTEGRATED DEVICE, RELATE...
- Publication number 20140091443
- Publication date Apr 3, 2014
- STMicroelectronics Pte Ltd
- Roseanne Duca
- G01 - MEASURING TESTING
Information Patent Application
Information Management System And Device
- Publication number 20130212714
- Publication date Aug 15, 2013
- ST Electronics (Info-Software Systems) Pte Ltd.
- Kim Yam Goh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WINDOW CLAMP TOP PLATE FOR INTEGRATED CIRCUIT PACKAGING
- Publication number 20130161806
- Publication date Jun 27, 2013
- STMicroelectronics Asia Pacific Pte. Ltd.
- Xueren ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET OF CONTACT OPENING FOR COPPER PILLARS IN FLIP CHIP PACKAGES
- Publication number 20130147052
- Publication date Jun 13, 2013
- STMicroelectronics Pte Ltd
- Xueren Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALANCED LEADFRAME PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20130147024
- Publication date Jun 13, 2013
- STMicroelectronics Pte Ltd
- Kim-Yong GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY TO PIN GRID ARRAY CONVERSION
- Publication number 20130127041
- Publication date May 23, 2013
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEADFRAME PAD DESIGN WITH ENHANCED ROBUSTNESS TO DIE CRACK FAILURE
- Publication number 20130093072
- Publication date Apr 18, 2013
- STMicroelectronics Pte Ltd
- Xueren Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE WITH CAN ATTACHMENT
- Publication number 20120178213
- Publication date Jul 12, 2012
- STMicroelectronics Asia Pacific PTE LTD (Singapore)
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST THERMALLY ENHANCED HYBRID BGA AND METHOD OF MANUFACTURING...
- Publication number 20120168929
- Publication date Jul 5, 2012
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN QUAD FLAT NO-LEAD (QFN) PACKAGE
- Publication number 20120028397
- Publication date Feb 2, 2012
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kim-yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FAN-OUT WAFER LEVEL PACKAGE FOR PACKAGE-ON-PACKAGE APPLIC...
- Publication number 20110156250
- Publication date Jun 30, 2011
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGE WITH POLYMERIC LAYER FOR HIGH RELIABILITY
- Publication number 20110157853
- Publication date Jun 30, 2011
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE LARGE DIE FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MANUFA...
- Publication number 20110156240
- Publication date Jun 30, 2011
- STMicroelectronics Asia Pacific Pte. Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGE FOR AN OPTICAL SENSOR AND METHOD OF MAN...
- Publication number 20110157452
- Publication date Jun 30, 2011
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACKED SEMICONDUCTOR DICE SCALE PACKAGE STRUCTURE AND METHOD...
- Publication number 20110156230
- Publication date Jun 30, 2011
- STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEP CAVITY FOR ENHANCED DROP TEST PERFORMANCE IN BALL GRID ARRAY P...
- Publication number 20100148363
- Publication date Jun 17, 2010
- STMicroelectronics, Inc.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE WITH CAN ATTACHMENT
- Publication number 20100148347
- Publication date Jun 17, 2010
- STMicroelectronics, Inc.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-thin quad flat no-lead (QFN) package
- Publication number 20070114641
- Publication date May 24, 2007
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kim-yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Color toner and developer compositions and processes for making and...
- Publication number 20060160009
- Publication date Jul 20, 2006
- Itipon Padunchwit
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Molded high density electronic packaging structure for high perform...
- Publication number 20060087033
- Publication date Apr 27, 2006
- Kim Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS

Kim Yam Goh

Person

Patents Grantslast 30 patents

Semiconductor packages having an electric device with a recess

Semiconductor packages having an electric device with a recess

Integrated circuit device with shaped leads and method of forming t...

Electronic device with heat dissipater

Wafer level chip scale package (WLCSP) having edge protection

Integrated circuit (IC) card having an IC module and reduced bond w...

Method of making an electronic device including two-step encapsulat...

Surface mount package for a semiconductor integrated device, relate...

Methods and devices for packaging integrated circuits

Flip-chip fan-out wafer level package for package-on-package applic...

System in package manufacturing method using wafer-to-wafer bonding

Window clamp top plate for integrated circuit packaging

Offset of contact opening for copper pillars in flip chip packages

Ultra-thin quad flat no-lead (QFN) package

Ball grid array to pin grid array conversion

Multi-stacked semiconductor dice scale package structure and method...

Fan-out wafer level package for an optical sensor and method of man...

Fan-out wafer level package with polymeric layer for high reliability

Semiconductor package and method of manufacturing the same

Chip Scale Package structure with can attachment

Chip scale package structure with can attachment

Ultra-thin quad flat no-lead (QFN) package

Step cavity for enhanced drop test performance in ball grid array p...

Color toner and developer compositions and processes for making and...

Molded high density electronic packaging structure for high perform...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS

ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODS

METHOD OF MAKING AN ELECTRONIC DEVICE INCLUDING TWO-STEP ENCAPSULAT...

INTEGRATED CIRCUIT DEVICE WITH SHAPED LEADS AND METHOD OF FORMING T...

ELECTRONIC DEVICE INCLUDING COMPONENTS IN COMPONENT RECEIVING CAVIT...

ELECTRONIC DEVICE WITH HEAT DISSIPATER

NO-LEAD SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHODS AND DEVICES FOR PACKAGING INTEGRATED CIRCUITS

SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS

SYSTEM IN PACKAGE MANUFACTURING METHOD USING WAFER-TO-WAFER BONDING

SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR INTEGRATED DEVICE, RELATE...

Information Management System And Device

WINDOW CLAMP TOP PLATE FOR INTEGRATED CIRCUIT PACKAGING

OFFSET OF CONTACT OPENING FOR COPPER PILLARS IN FLIP CHIP PACKAGES

BALANCED LEADFRAME PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...

BALL GRID ARRAY TO PIN GRID ARRAY CONVERSION

LEADFRAME PAD DESIGN WITH ENHANCED ROBUSTNESS TO DIE CRACK FAILURE

CHIP SCALE PACKAGE STRUCTURE WITH CAN ATTACHMENT

LOW COST THERMALLY ENHANCED HYBRID BGA AND METHOD OF MANUFACTURING...

ULTRA-THIN QUAD FLAT NO-LEAD (QFN) PACKAGE

FLIP-CHIP FAN-OUT WAFER LEVEL PACKAGE FOR PACKAGE-ON-PACKAGE APPLIC...

FAN-OUT WAFER LEVEL PACKAGE WITH POLYMERIC LAYER FOR HIGH RELIABILITY

RELIABLE LARGE DIE FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MANUFA...

FAN-OUT WAFER LEVEL PACKAGE FOR AN OPTICAL SENSOR AND METHOD OF MAN...

MULTI-STACKED SEMICONDUCTOR DICE SCALE PACKAGE STRUCTURE AND METHOD...

STEP CAVITY FOR ENHANCED DROP TEST PERFORMANCE IN BALL GRID ARRAY P...

CHIP SCALE PACKAGE STRUCTURE WITH CAN ATTACHMENT

Ultra-thin quad flat no-lead (QFN) package

Color toner and developer compositions and processes for making and...

Molded high density electronic packaging structure for high perform...