Kimiharu Kayukawa

Person

Nisshin-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing stator coil for electric rotating machine
- Patent number 9,009,948
- Issue date Apr 21, 2015
- Denso Corporation
- Kimiharu Kayukawa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Capacitive semiconductor sensor
- Patent number 8,156,804
- Issue date Apr 17, 2012
- Denso Corporation
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bump bonding method
- Patent number 7,971,349
- Issue date Jul 5, 2011
- Denso Corporation
- Masaaki Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing device of semiconductor package and manufacturing met...
- Patent number 7,659,127
- Issue date Feb 9, 2010
- Denso Corporation
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having tin-based solder layer and method for m...
- Patent number 7,579,212
- Issue date Aug 25, 2009
- Denso Corporation
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method
- Patent number 7,470,996
- Issue date Dec 30, 2008
- Denso Corporation
- Takao Yoneyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical type semiconductor device and method for manufacturing the...
- Patent number 7,420,246
- Issue date Sep 2, 2008
- Denso Corporation
- Shoji Ozoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having tin-based solder layer and method for m...
- Patent number 7,361,996
- Issue date Apr 22, 2008
- Denso Corporation
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING STATOR COIL FOR ELECTRIC ROTATING MACHINE
- Publication number 20130014381
- Publication date Jan 17, 2013
- DENSO CORPORATION
- Kimiharu KAYUKAWA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Electronic device and method of manufacturing the same
- Publication number 20110042812
- Publication date Feb 24, 2011
- DENSO CORPORATION
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding method
- Publication number 20090241337
- Publication date Oct 1, 2009
- DENSO CORPORATION
- Masaaki Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitive semiconductor sensor
- Publication number 20080093740
- Publication date Apr 24, 2008
- DENSO CORPORATION
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Manufacturing device of semiconductor package and manufacturing met...
- Publication number 20080090313
- Publication date Apr 17, 2008
- DENSO Corporation
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having tin-based solder layer and method for m...
- Publication number 20070176293
- Publication date Aug 2, 2007
- DENSO CORPORATION
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging method
- Publication number 20070023483
- Publication date Feb 1, 2007
- DENSO CORPORATION
- Takao Yoneyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertical type semiconductor device and method for manufacturing the...
- Publication number 20060273351
- Publication date Dec 7, 2006
- DENSO CORPORATION
- Shoji Ozoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having aluminum electrode and metallic electrode
- Publication number 20060081996
- Publication date Apr 20, 2006
- DENSO CORPORATION
- Keiji Shinyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having tin-based solder layer and method for m...
- Publication number 20060049521
- Publication date Mar 9, 2006
- DENSO CORPORATION
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS

Kimiharu Kayukawa

Person

Patents Grantslast 30 patents

Method of manufacturing stator coil for electric rotating machine

Capacitive semiconductor sensor

Bump bonding method

Manufacturing device of semiconductor package and manufacturing met...

Semiconductor device having tin-based solder layer and method for m...

Packaging method

Vertical type semiconductor device and method for manufacturing the...

Semiconductor device having tin-based solder layer and method for m...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING STATOR COIL FOR ELECTRIC ROTATING MACHINE

Electronic device and method of manufacturing the same

Bump bonding method

Capacitive semiconductor sensor

Manufacturing device of semiconductor package and manufacturing met...

Semiconductor device having tin-based solder layer and method for m...

Packaging method

Vertical type semiconductor device and method for manufacturing the...

Semiconductor device having aluminum electrode and metallic electrode

Semiconductor device having tin-based solder layer and method for m...