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Kimin Jun
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Hillsboro, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Backside contact structures and fabrication for metal on both sides...
Patent number
11,935,933
Issue date
Mar 19, 2024
Intel Corporation
Patrick Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metallization structures for stacked device connectivity and their...
Patent number
11,869,894
Issue date
Jan 9, 2024
Intel Corporation
Aaron D. Lilak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device structures and double-sided electrical te...
Patent number
11,854,894
Issue date
Dec 26, 2023
Intel Corporation
Valluri R. Rao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
Patent number
11,784,165
Issue date
Oct 10, 2023
Intel Corporation
Anup Pancholi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,721,649
Issue date
Aug 8, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked transistors having device strata with different channel widths
Patent number
11,676,966
Issue date
Jun 13, 2023
Intel Corporation
Gilbert W. Dewey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside contact structures and fabrication for metal on both sides...
Patent number
11,658,221
Issue date
May 23, 2023
Intel Corporation
Patrick Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
III-V source/drain in top NMOS transistors for low temperature stac...
Patent number
11,640,961
Issue date
May 2, 2023
Intel Corporation
Gilbert Dewey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional integrated circuits with stacked transistors
Patent number
11,605,565
Issue date
Mar 14, 2023
Intel Corporation
Cheng-Ying Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication and use of through silicon vias on double sided interco...
Patent number
11,594,524
Issue date
Feb 28, 2023
Intel Corporation
Brennen K. Mueller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for revealing a backside of an integrated circuit device...
Patent number
11,594,452
Issue date
Feb 28, 2023
Intel Corporation
Il-Seok Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertical memory cells
Patent number
11,569,238
Issue date
Jan 31, 2023
Intel Corporation
Aaron Lilak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked transistors with dielectric between channels of different d...
Patent number
11,552,104
Issue date
Jan 10, 2023
Intel Corporation
Aaron D. Lilak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transistors on heterogeneous bonding layers
Patent number
11,532,719
Issue date
Dec 20, 2022
Intel Corporation
Kimin Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertically stacked CMOS with upfront M0 interconnect
Patent number
11,482,621
Issue date
Oct 25, 2022
Intel Corporation
Willy Rachmady
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metallization structures for stacked device connectivity and their...
Patent number
11,430,814
Issue date
Aug 30, 2022
Intel Corporation
Aaron D. Lilak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked transistors with Si PMOS and high mobility thin film transi...
Patent number
11,393,818
Issue date
Jul 19, 2022
Intel Corporation
Gilbert Dewey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,393,777
Issue date
Jul 19, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,348,897
Issue date
May 31, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wrap-around source/drain method of making contacts for backside metals
Patent number
11,264,493
Issue date
Mar 1, 2022
Intel Corporation
Patrick Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
Patent number
11,251,158
Issue date
Feb 15, 2022
Intel Corporation
Anup Pancholi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication and use of through silicon vias on double sided interco...
Patent number
11,251,156
Issue date
Feb 15, 2022
Intel Corporation
Brennen K. Mueller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional integrated circuits (3DICs) including bottom gate...
Patent number
11,244,943
Issue date
Feb 8, 2022
Intel Corporation
Cheng-Ying Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside contact structures and fabrication for metal on both sides...
Patent number
11,201,221
Issue date
Dec 14, 2021
Intel Corporation
Patrick Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resonator structure encapsulation
Patent number
11,121,691
Issue date
Sep 14, 2021
Intel Corporation
Kevin Lin
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Techniques for revealing a backside of an integrated circuit device...
Patent number
10,896,847
Issue date
Jan 19, 2021
Intel Corporation
Il-Seok Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structures
Patent number
10,872,820
Issue date
Dec 22, 2020
Intel Corporation
Bruce Block
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming backside self-aligned vias and structures formed...
Patent number
10,797,139
Issue date
Oct 6, 2020
Intel Corporation
Patrick Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside contact structures and fabrication for metal on both sides...
Patent number
10,784,358
Issue date
Sep 22, 2020
Intel Corporation
Patrick Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer silicon/gallium nitride semiconductor
Patent number
10,763,248
Issue date
Sep 1, 2020
Intel Corporation
Sansaptak W. Dasgupta
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...
Publication number
20240154011
Publication date
May 9, 2024
Intel Corporation
Patrick MORROW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...
Publication number
20240063147
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES
Publication number
20240063180
Publication date
Feb 22, 2024
Intel Corporation
Kimin Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063178
Publication date
Feb 22, 2024
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMP...
Publication number
20240063071
Publication date
Feb 22, 2024
Intel Corporation
Jeffery Bielefeld
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE...
Publication number
20240063076
Publication date
Feb 22, 2024
Intel Corporation
Mohammad Enamul Kabir
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...
Publication number
20240063183
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER
Publication number
20240063120
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS
Publication number
20240063132
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063179
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...
Publication number
20240063202
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES
Publication number
20240063072
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
Publication number
20240063091
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET
Publication number
20240063143
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MONOLITHIC CHIP STACKING USING A DIE WITH DOUBLE-SIDED INTERCONNECT...
Publication number
20240030188
Publication date
Jan 25, 2024
Intel Corporation
Anup Pancholi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MONOLITHIC CHIP STACKING USING A DIE WITH DOUBLE-SIDED INTERCONNECT...
Publication number
20230411356
Publication date
Dec 21, 2023
Intel Corporation
Anup Pancholi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF ATOMIC DIFFUSION HYBRID BONDING AND APPARATUS MADE FROM SAME
Publication number
20230299040
Publication date
Sep 21, 2023
Intel Corporation
Jay Prakash Gupta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...
Publication number
20230275135
Publication date
Aug 31, 2023
Intel Corporation
Patrick MORROW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED GROUP III-NITROGEN AND SILICON TRANSISTORS ON THE SAME DIE
Publication number
20230197732
Publication date
Jun 22, 2023
Intel Corporation
Marko Radosavljevic
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH PATTERNED THROUGH-DIELECTRIC VIAS AND R...
Publication number
20230187362
Publication date
Jun 15, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH INTERMEDIATE ROUTING LAYERS
Publication number
20230178513
Publication date
Jun 8, 2023
Intel Corporation
Kimin Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED PACKAGING ARCHITECTURE WITH SOLDER AND NON-SOLDER INTERC...
Publication number
20230170327
Publication date
Jun 1, 2023
Intel Corporation
Jin Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIGITALLY CONTROLLED LITHOGRAPHICALLY-DEFINED MULTI-FREQUENCY ACOUS...
Publication number
20230091766
Publication date
Mar 23, 2023
Intel Corporation
Ved V. Gund
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING BACKSIDE DIE-TO-PACKAGE INTERCONN...
Publication number
20230073026
Publication date
Mar 9, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT TECHNOLOGY WITH MULTI-LAYE...
Publication number
20230069054
Publication date
Mar 2, 2023
Intel Corporation
Souvik GHOSH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GALLIUM NITRIDE (GAN) EPITAXY ON PATTERNED SUBSTRATE FOR INTEGRATED...
Publication number
20230066336
Publication date
Mar 2, 2023
Intel Corporation
Pratik KOIRALA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BILAYER MEMORY STACKING WITH COMPUTER LOGIC CIRCUITS SHARED BETWEEN...
Publication number
20230064541
Publication date
Mar 2, 2023
Intel Corporation
Abhishek A. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GALLIUM NITRIDE (GAN) LAYER TRANSFER AND REGROWTH FOR INTEGRATED CI...
Publication number
20230054719
Publication date
Feb 23, 2023
Intel Corporation
Pratik KOIRALA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACK-SIDE REVEAL FOR POWER DELIVERY TO BACKEND MEMORY
Publication number
20220415904
Publication date
Dec 29, 2022
Intel Corporation
Abhishek A. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INDUCTOR AND TRANSFORMER SEMICONDUCTOR DEVICES USING HYBRID BONDING...
Publication number
20220415555
Publication date
Dec 29, 2022
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS