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Kimitaka Endo
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Kokubunji, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Robust multi-layer wiring elements and assemblies with embedded mic...
Patent number
10,032,646
Issue date
Jul 24, 2018
Tessera, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic interconnect element with decreased conductor spacing
Patent number
9,856,135
Issue date
Jan 2, 2018
Invensas Corporation
Chang Myung Ryu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microelectronic interconnect element with decreased conductor spacing
Patent number
9,524,947
Issue date
Dec 20, 2016
Invensas Corporation
Chang Myung Ryu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Interconnection element with posts formed by plating
Patent number
9,282,640
Issue date
Mar 8, 2016
Tessera, Inc.
Jinsu Kwon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making a microelectronic interconnect element with decrea...
Patent number
8,900,464
Issue date
Dec 2, 2014
Invensas Corporation
Chang Myung Ryu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Structure and method of making interconnect element, and multilayer...
Patent number
8,859,420
Issue date
Oct 14, 2014
Invensas Corporation
Kimitaka Endo
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Method of fabricating an interconnection element having conductive...
Patent number
8,505,199
Issue date
Aug 13, 2013
Tessera, Inc.
Jinsu Kwon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Microelectronic interconnect element with decreased conductor spacing
Patent number
8,461,460
Issue date
Jun 11, 2013
Invensas Corporation
Chang Myung Ryu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Interconnection element for electric circuits
Patent number
8,299,368
Issue date
Oct 30, 2012
Invensas Corporation
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bump structure formed from using removable mandrel
Patent number
8,119,516
Issue date
Feb 21, 2012
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Structure and method of making interconnect element, and multilayer...
Patent number
7,923,828
Issue date
Apr 12, 2011
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System management method, system management device, system manageme...
Patent number
7,617,238
Issue date
Nov 10, 2009
Nippon Telegraph and Telephone Corporation
Jouji Nakayama
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Database access control method, database access controller, agent p...
Patent number
7,454,421
Issue date
Nov 18, 2008
Nippon Telegraph and Telephone Corporation
Takashi Imaeda
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Connecting member between wiring films, manufacturing method thereo...
Patent number
7,238,603
Issue date
Jul 3, 2007
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Connecting member between wiring films, manufacturing method thereo...
Patent number
6,884,709
Issue date
Apr 26, 2005
North Corporation
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING
Publication number
20170096329
Publication date
Apr 6, 2017
Invensas Corporation
Chang Myung Ryu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ROBUST MULTI-LAYER WIRING ELEMENTS AND ASSEMBLIES WITH EMBEDDED MIC...
Publication number
20170018440
Publication date
Jan 19, 2017
Tessera, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING
Publication number
20150087146
Publication date
Mar 26, 2015
Invensas Corporation
Chang Myung Ryu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Making a Microelectronic Interconnect Element With Decrea...
Publication number
20130341299
Publication date
Dec 26, 2013
Chang Myung RYU
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
INTERCONNECTION ELEMENT WITH POSTS FORMED BY PLATING
Publication number
20130286619
Publication date
Oct 31, 2013
Jinsu Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC SUBSTRATE OR ELEMENT HAVING CONDUCTIVE PADS AND MET...
Publication number
20130186944
Publication date
Jul 25, 2013
Tessera Interconnect Materials, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS
Publication number
20130119012
Publication date
May 16, 2013
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER...
Publication number
20110252637
Publication date
Oct 20, 2011
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wiring circuit board, manufacturing method for the wiring circuit b...
Publication number
20100242270
Publication date
Sep 30, 2010
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CHIP CAPACITOR EMBEDDED PWB
Publication number
20100071944
Publication date
Mar 25, 2010
Tessera Interconnect Materials, Inc.
Kimitaka Endo
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Microelectronic substrate or element having conductive pads and met...
Publication number
20100044860
Publication date
Feb 25, 2010
Tessera Interconnect Materials, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic interconnect element with decreased conductor spacing
Publication number
20100009554
Publication date
Jan 14, 2010
Tessera, Inc.
Chang Myung Ryu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Interconnection element for electric circuits
Publication number
20090188706
Publication date
Jul 30, 2009
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Interconnection element with posts formed by plating
Publication number
20090145645
Publication date
Jun 11, 2009
Tessera, Inc.
Jinsu Kwon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Interconnection element with plated posts formed on mandrel
Publication number
20090148594
Publication date
Jun 11, 2009
Tessera, Inc.
Sean Moran
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Process for forming a bump structure and bump structure
Publication number
20090121351
Publication date
May 14, 2009
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Robust multi-layer wiring elements and assemblies with embedded mic...
Publication number
20090115047
Publication date
May 7, 2009
Tessera, Inc.
Belgacem Haba
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer substrate with interconnection vias and method of manufa...
Publication number
20090071707
Publication date
Mar 19, 2009
Tessera, Inc.
Kimitaka Endo
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
FLEXIBLE CIRCUIT BOARD, METHOD FOR MAKING THE SAME, FLEXIBLE MULTI-...
Publication number
20070170598
Publication date
Jul 26, 2007
NORTH CORPORATION
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
System management method, system management device, system manageme...
Publication number
20060190588
Publication date
Aug 24, 2006
NIPPON TELEGRAPH AND TELEPHONE CORP.
Jouji Nakayama
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Database access control method, database access controller, agent p...
Publication number
20060143189
Publication date
Jun 29, 2006
Nippon Telegraph and Telephone Corporation
Takashi Imaeda
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Structure and method of making interconnect element, and multilayer...
Publication number
20060079127
Publication date
Apr 13, 2006
Socketstrate, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Interlayer member used for producing multilayer wiring board and me...
Publication number
20050224256
Publication date
Oct 13, 2005
NORTH CORPORATION
Kenji Osawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Connecting member between wiring films, manufacturing method thereo...
Publication number
20050161804
Publication date
Jul 28, 2005
NORTH CORPORATION
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-layer wiring board, method for producing multi-layer wiring b...
Publication number
20050097727
Publication date
May 12, 2005
Tomoo Iijima
B24 - GRINDING POLISHING
Information
Patent Application
Wiring circuit board, manufacturing method for the wiring circuit b...
Publication number
20040201096
Publication date
Oct 14, 2004
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Connecting member between wiring films, manufacturing method thereo...
Publication number
20030155653
Publication date
Aug 21, 2003
NORTH CORPORATION
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR