Kimmo KAIJA

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Patents Grantslast 30 patents

Information Patent Grant
Mechanical support within moulded chip package
- Patent number 11,659,663
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing crosstalk in a mixed-signal multi-chip MEMS device package
- Patent number 10,633,246
- Issue date Apr 28, 2020
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT WITH MOULDED PACKAGE
- Publication number 20230046693
- Publication date Feb 16, 2023
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH METALLIC CAP
- Publication number 20220108930
- Publication date Apr 7, 2022
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL SUPPORT WITHIN MOULDED CHIP PACKAGE
- Publication number 20220110213
- Publication date Apr 7, 2022
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCING CROSSTALK IN A MIXED-SIGNAL MULTI-CHIP MEMS DEVICE PACKAGE
- Publication number 20190359480
- Publication date Nov 28, 2019
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMC PROTECTION OF A SEMICONDUCTOR COMPONENT
- Publication number 20190177159
- Publication date Jun 13, 2019
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING VIBRATION OF A MEMS INSTALLATION ON A PRINTED CIRCUIT BOARD
- Publication number 20190112185
- Publication date Apr 18, 2019
- Murata Manufacturing Co., Ltd.
- Nikolai MANTYOJA
- B81 - MICRO-STRUCTURAL TECHNOLOGY