King L. Tai

Person

Berkeley Heights, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated passive devices
- Patent number 7,259,077
- Issue date Aug 21, 2007
- Sychip Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing integrated circuits
- Patent number 7,061,258
- Issue date Jun 13, 2006
- Sychip Inc.
- Yinon Degani
- G01 - MEASURING TESTING
Information Patent Grant
Membrane test method and apparatus for integrated circuit testing
- Patent number 6,867,607
- Issue date Mar 15, 2005
- Sychip, Inc.
- Yinon Degani
- G01 - MEASURING TESTING
Information Patent Grant
Air isolated crossovers
- Patent number 6,683,384
- Issue date Jan 27, 2004
- Agere Systems Inc.
- Dean Paul Kossives
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing and constructing monolithic multi-chip modules
- Patent number 6,680,212
- Issue date Jan 20, 2004
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance multi-chip IC package
- Patent number 6,678,167
- Issue date Jan 13, 2004
- Agere Systems Inc.
- Yinon Degani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for testing integrated circuits
- Patent number 6,560,735
- Issue date May 6, 2003
- Agere Systems Inc.
- Louis Nelson Ahlquist
- G01 - MEASURING TESTING
Information Patent Grant
Circuit and method for providing interconnections among individual...
- Patent number 6,465,336
- Issue date Oct 15, 2002
- Agere Systems Guardian Corp.
- Thaddeus John Gabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip ball grid array IC packages
- Patent number 6,437,990
- Issue date Aug 20, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging micromechanical devices
- Patent number 6,433,411
- Issue date Aug 13, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnecting micromechanical devices
- Patent number 6,396,711
- Issue date May 28, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging silicon on silicon multichip modules
- Patent number 6,369,444
- Issue date Apr 9, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of tuning a planar filter with additional coupling created b...
- Patent number 6,313,719
- Issue date Nov 6, 2001
- Avaya Technology Corp.
- Ron Barnett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit and method for providing interconnections among individual...
- Patent number 6,281,590
- Issue date Aug 28, 2001
- Agere Systems Guardian Corp.
- Thaddeus John Gabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile integrated circuit packages
- Patent number 6,251,705
- Issue date Jun 26, 2001
- Agere Systems Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating high-Q RF components
- Patent number 6,232,047
- Issue date May 15, 2001
- Agere Systems Inc.
- Robert Charles Frye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for recessed flip-chip package
- Patent number 6,175,158
- Issue date Jan 16, 2001
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Translator for recessed flip-chip package
- Patent number 6,160,715
- Issue date Dec 12, 2000
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bonding printed circuit boards
- Patent number 6,100,475
- Issue date Aug 8, 2000
- Lucent Technologies, Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling multichip modules
- Patent number 6,077,725
- Issue date Jun 20, 2000
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitors and process for making them
- Patent number 6,075,691
- Issue date Jun 13, 2000
- Lucent Technologies Inc.
- Salvador Duenas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MCM with high Q overlapping resonator
- Patent number 6,075,427
- Issue date Jun 13, 2000
- Lucent Technologies Inc.
- King Lien Tai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Self-contained memory apparatus having diverse types of memory and...
- Patent number 6,029,224
- Issue date Feb 22, 2000
- Lucent Technologies Inc.
- Abhaya Asthana
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder bonding printed circuit boards
- Patent number 6,013,877
- Issue date Jan 11, 2000
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaging of memory chips
- Patent number 5,990,564
- Issue date Nov 23, 1999
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film tantalum oxide capacitors and resulting product
- Patent number 5,936,831
- Issue date Aug 10, 1999
- Lucent Technologies Inc.
- Ratnaji Rao Kola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF IC package
- Patent number 5,869,894
- Issue date Feb 9, 1999
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming fine patterns on printed circuit b...
- Patent number 5,834,160
- Issue date Nov 10, 1998
- Lucent Technologies Inc.
- Alan E. Ferry
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multi-chip modules with isolated coupling between modules
- Patent number 5,747,982
- Issue date May 5, 1998
- Lucent Technologies Inc.
- Douglas John Dromgoole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curbside circuitry for interactive communication services
- Patent number 5,699,105
- Issue date Dec 16, 1997
- Lucent Technologies Inc.
- Howard Zehua Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Integrated passive devices
- Publication number 20090218655
- Publication date Sep 3, 2009
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated passive devices
- Publication number 20070262418
- Publication date Nov 15, 2007
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cellular/Wi-Fi combination devices
- Publication number 20060217102
- Publication date Sep 28, 2006
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency integrated circuits
- Publication number 20060197182
- Publication date Sep 7, 2006
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated passive devices
- Publication number 20050253255
- Publication date Nov 17, 2005
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Testing integrated circuits
- Publication number 20050088194
- Publication date Apr 28, 2005
- Yinon Degani
- G01 - MEASURING TESTING
Information Patent Application
High frequency integrated circuits
- Publication number 20040075170
- Publication date Apr 22, 2004
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Testing integrated circuits
- Publication number 20030137315
- Publication date Jul 24, 2003
- Yinon Degani
- G01 - MEASURING TESTING
Information Patent Application
Method of testing and constructing monolithic multi-chip modules
- Publication number 20020081755
- Publication date Jun 27, 2002
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit and method for providing interconnections among individual...
- Publication number 20010030361
- Publication date Oct 18, 2001
- Thaddeus John Gabara
- H01 - BASIC ELECTRIC ELEMENTS

King L. Tai

Person

Patents Grantslast 30 patents

Integrated passive devices

Testing integrated circuits

Membrane test method and apparatus for integrated circuit testing

Air isolated crossovers

Method of testing and constructing monolithic multi-chip modules

High performance multi-chip IC package

Methods and apparatus for testing integrated circuits

Circuit and method for providing interconnections among individual...

Multi-chip ball grid array IC packages

Packaging micromechanical devices

Interconnecting micromechanical devices

Packaging silicon on silicon multichip modules

Method of tuning a planar filter with additional coupling created b...

Circuit and method for providing interconnections among individual...

Low profile integrated circuit packages

Fabricating high-Q RF components

Interposer for recessed flip-chip package

Translator for recessed flip-chip package

Solder bonding printed circuit boards

Method for assembling multichip modules

Thin film capacitors and process for making them

MCM with high Q overlapping resonator

Self-contained memory apparatus having diverse types of memory and...

Solder bonding printed circuit boards

Flip chip packaging of memory chips

Thin film tantalum oxide capacitors and resulting product

RF IC package

Method and apparatus for forming fine patterns on printed circuit b...

Multi-chip modules with isolated coupling between modules

Curbside circuitry for interactive communication services

Patents Applicationslast 30 patents

Integrated passive devices

Integrated passive devices

Cellular/Wi-Fi combination devices

High frequency integrated circuits

Integrated passive devices

Testing integrated circuits

High frequency integrated circuits

Testing integrated circuits

Method of testing and constructing monolithic multi-chip modules

Circuit and method for providing interconnections among individual...