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Kinya YAMASHITA
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor test apparatus and semiconductor test method
Patent number
11,624,767
Issue date
Apr 11, 2023
Mitsubishi Electric Corporation
Yasushi Takaki
G01 - MEASURING TESTING
Information
Patent Grant
Evaluation apparatus including a plurality of insulating portions s...
Patent number
10,539,607
Issue date
Jan 21, 2020
Mitsubishi Electric Corporation
Akira Okada
G01 - MEASURING TESTING
Information
Patent Grant
Evaluation apparatus and evaluation method
Patent number
10,436,833
Issue date
Oct 8, 2019
Mitsubishi Electric Corporation
Akira Okada
G05 - CONTROLLING REGULATING
Information
Patent Grant
Semiconductor device and method for testing same
Patent number
10,228,412
Issue date
Mar 12, 2019
Mitsubishi Electric Corporation
Hajime Akiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and electrical contact structure thereof
Patent number
10,192,797
Issue date
Jan 29, 2019
Mitsubishi Electric Corporation
Hajime Akiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor evaluation apparatus and semiconductor evaluation method
Patent number
9,720,014
Issue date
Aug 1, 2017
Mitsubishi Electric Corporation
Akira Okada
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor evaluation apparatus
Patent number
9,678,143
Issue date
Jun 13, 2017
Mitsubishi Electric Corporation
Akira Okada
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device assessment apparatus
Patent number
9,551,745
Issue date
Jan 24, 2017
Mitsubishi Electric Corporation
Hajime Akiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor testing jig and semiconductor testing method performe...
Patent number
9,347,988
Issue date
May 24, 2016
Mitsubishi Electric Corporation
Hajime Akiyama
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor evaluating device and semiconductor evaluating method
Patent number
9,335,371
Issue date
May 10, 2016
Mitsubishi Electric Corporation
Hajime Akiyama
G01 - MEASURING TESTING
Information
Patent Grant
Wafer suction method, wafer suction stage, and wafer suction system
Patent number
9,312,160
Issue date
Apr 12, 2016
Mitsubishi Electric Corporation
Hajime Akiyama
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Semiconductor testing jig and transfer jig for the same
Patent number
9,257,316
Issue date
Feb 9, 2016
Mitsubishi Electric Corporation
Akira Okada
G01 - MEASURING TESTING
Information
Patent Grant
Inspection apparatus
Patent number
9,207,257
Issue date
Dec 8, 2015
Mitsubishi Electric Corporation
Akira Okada
G01 - MEASURING TESTING
Information
Patent Grant
Inspection apparatus
Patent number
9,188,624
Issue date
Nov 17, 2015
Mitsubishi Electric Corporation
Akira Okada
G01 - MEASURING TESTING
Information
Patent Grant
Probe card
Patent number
9,157,931
Issue date
Oct 13, 2015
Mitsubishi Electric Corporation
Akira Okada
G01 - MEASURING TESTING
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
9,117,880
Issue date
Aug 25, 2015
Mitsubishi Electric Corporation
Hajime Akiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Test apparatus and test method
Patent number
8,980,655
Issue date
Mar 17, 2015
Mitsubishi Electric Corporation
Akira Okada
G01 - MEASURING TESTING
Information
Patent Grant
Inspection apparatus and inspection method
Patent number
8,981,805
Issue date
Mar 17, 2015
Mitsubishi Electric Corporation
Akira Okada
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
Publication number
20240355664
Publication date
Oct 24, 2024
Mitsubishi Electric Corporation
Kinya YAMASHITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANU...
Publication number
20240178048
Publication date
May 30, 2024
Mitsubishi Electric Corporation
Yasushi TAKAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
Publication number
20230197476
Publication date
Jun 22, 2023
Mitsubishi Electric Corporation
Masaki UENO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR TEST APPARATUS AND SEMICONDUCTOR TEST METHOD
Publication number
20220128616
Publication date
Apr 28, 2022
Mitsubishi Electric Corporation
Yasushi TAKAKI
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR PICK-UP APPARATUS
Publication number
20190109026
Publication date
Apr 11, 2019
Mitsubishi Electric Corporation
Kinya YAMASHITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EVALUATION APPARATUS AND EVALUATION METHOD
Publication number
20180180660
Publication date
Jun 28, 2018
Mitsubishi Electric Corporation
Akira OKADA
G05 - CONTROLLING REGULATING
Information
Patent Application
EVALUATION APPARATUS AND SEMICONDUCTOR DEVICE EVALUATION METHOD
Publication number
20180088170
Publication date
Mar 29, 2018
Mitsubishi Electric Corporation
Akira OKADA
G01 - MEASURING TESTING
Information
Patent Application
CONTACT-PROBE TYPE TEMPERATURE DETECTOR, SEMICONDUCTOR DEVICE EVALU...
Publication number
20160377486
Publication date
Dec 29, 2016
Mitsubishi Electric Corporation
Kinya YAMASHITA
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20160343627
Publication date
Nov 24, 2016
Mitsubishi Electric Corporation
Hajime AKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR TESTING SAME
Publication number
20160334458
Publication date
Nov 17, 2016
Mitsubishi Electric Corporation
Hajime AKIYAMA
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR EVALUATION APPARATUS AND SEMICONDUCTOR EVALUATION METHOD
Publication number
20160116501
Publication date
Apr 28, 2016
Mitsubishi Electric Corporation
Akira OKADA
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR EVALUATION APPARATUS
Publication number
20150115989
Publication date
Apr 30, 2015
Mitsubishi Electric Corporation
Akira OKADA
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR TESTING JIG AND TRANSFER JIG FOR THE SAME
Publication number
20150091599
Publication date
Apr 2, 2015
Mitsubishi Electric Corporation
Akira OKADA
G01 - MEASURING TESTING
Information
Patent Application
TEST APPARATUS AND TEST METHOD
Publication number
20150044788
Publication date
Feb 12, 2015
Mitsubishi Electric Corporation
Akira OKADA
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR DEVICE ASSESSMENT APPARATUS
Publication number
20140347081
Publication date
Nov 27, 2014
Mitsubishi Electric Corporation
Hajime AKIYAMA
G01 - MEASURING TESTING
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20140342544
Publication date
Nov 20, 2014
Mitsubishi Electric Corporation
Hajime AKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR EVALUATING DEVICE AND SEMICONDUCTOR EVALUATING METHOD
Publication number
20140210500
Publication date
Jul 31, 2014
Mitsubishi Electric Corporation
Hajime AKIYAMA
G01 - MEASURING TESTING
Information
Patent Application
INSPECTION APPARATUS
Publication number
20140015554
Publication date
Jan 16, 2014
Mitsubishi Electric Corporation
Akira OKADA
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR TESTING JIG AND SEMICONDUCTOR TESTING METHOD PERFORME...
Publication number
20140009183
Publication date
Jan 9, 2014
Mitsubishi Electric Corporation
Hajime AKIYAMA
G01 - MEASURING TESTING
Information
Patent Application
INSPECTION APPARATUS AND INSPECTION METHOD
Publication number
20130321015
Publication date
Dec 5, 2013
Mitsubishi Electric Corporation
Akira OKADA
G01 - MEASURING TESTING
Information
Patent Application
PROBE CARD
Publication number
20130321019
Publication date
Dec 5, 2013
Mitsubishi Electric Corporation
Akira OKADA
G01 - MEASURING TESTING
Information
Patent Application
INSPECTION APPARATUS
Publication number
20130285684
Publication date
Oct 31, 2013
Akira OKADA
G01 - MEASURING TESTING
Information
Patent Application
WAFER SUCTION METHOD, WAFER SUCTION STAGE, AND WAFER SUCTION SYSTEM
Publication number
20130256964
Publication date
Oct 3, 2013
Mitsubishi Electric Corporation
Hajime AKIYAMA
H01 - BASIC ELECTRIC ELEMENTS