Kirby Sand

Person

Corvallis, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer bonding method
- Patent number 8,390,111
- Issue date Mar 5, 2013
- Hewlett-Packard Development Company, L.P.
- Kirby Sand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic device
- Patent number 8,043,880
- Issue date Oct 25, 2011
- Hewlett-Packard Development, L.P.
- Charles C Haluzak
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic device and a fluid ejection device incorporating the same
- Patent number 8,007,078
- Issue date Aug 30, 2011
- Hewlett-Packard Development Company, L.P.
- Charles C. Haluzak
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for forming a fluid ejection device
- Patent number 7,988,264
- Issue date Aug 2, 2011
- Hewlett-Packard Development Company, L.P.
- Charles C. Haluzak
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Microfluidic device and a fluid ejection device incorporating the same
- Patent number 7,828,417
- Issue date Nov 9, 2010
- Hewlett-Packard Development Company, L.P.
- Charles C. Haluzak
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for forming a fluid ejection device
- Patent number 7,766,462
- Issue date Aug 3, 2010
- Hewlett-Packard Development Company, L.P.
- Charles C. Haluzak
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Packaged MEMS device assembly
- Patent number 7,723,811
- Issue date May 25, 2010
- Hewlett-Packard Development Company, L.P.
- Charles C Haluzak
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for providing an anti-stiction coating on a metal surface
- Patent number 7,618,682
- Issue date Nov 17, 2009
- Hewlett-Packard Development Company, L.P.
- Paul Felice Reboa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding interface for micro-device packaging
- Patent number 7,611,919
- Issue date Nov 3, 2009
- Hewlett-Packard Development Company, L.P.
- Kirby Sand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-displays and their manufacture
- Patent number 7,320,899
- Issue date Jan 22, 2008
- Hewlett-Packard Development Company, L.P.
- Charles C Haluzak
- G02 - OPTICS
Information Patent Grant
Wafer bonding method
- Patent number 7,303,976
- Issue date Dec 4, 2007
- Hewlett-Packard Development Company, L.P.
- Kirby Sand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and a method for fluid filling wafer level packages
- Patent number 6,858,466
- Issue date Feb 22, 2005
- Hewlett-Packard Development Company, L.P.
- Bradley Bower
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROFLUIDIC DEVICE AND A FLUID EJECTION DEVICE INCORPORATING THE SAME
- Publication number 20110025782
- Publication date Feb 3, 2011
- Charles C. Haluzak
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR FORMING A FLUID EJECTION DEVICE
- Publication number 20100259583
- Publication date Oct 14, 2010
- Charles C. Haluzak
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Packaged MEMS device assembly
- Publication number 20080272446
- Publication date Nov 6, 2008
- Charles C. Haluzak
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFLUIDIC DEVICE AND A FLUID EJECTION DEVICE INCORPORATING THE SAME
- Publication number 20080259125
- Publication date Oct 23, 2008
- Charles C. Haluzak
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR FORMING A FLUID EJECTION DEVICE
- Publication number 20080199981
- Publication date Aug 21, 2008
- Charles C. Haluzak
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method for providing an anti-stiction coating on a metal surface
- Publication number 20080074771
- Publication date Mar 27, 2008
- Paul Felice Reboa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro-Displays and Their Manufacture
- Publication number 20080068697
- Publication date Mar 20, 2008
- Charles C. Haluzak
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer Bonding Method
- Publication number 20080048313
- Publication date Feb 28, 2008
- Kirby Sand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Controlling bond fronts in wafer-scale packaging
- Publication number 20070090479
- Publication date Apr 26, 2007
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectronic device
- Publication number 20070023890
- Publication date Feb 1, 2007
- Charles C. Haluzak
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer bonding method
- Publication number 20060255454
- Publication date Nov 16, 2006
- Kirby Sand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bonding interface for micro-device packaging
- Publication number 20060237810
- Publication date Oct 26, 2006
- Kirby Sand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro-displays and their manufacture
- Publication number 20060094143
- Publication date May 4, 2006
- Charles C. Haluzak
- G02 - OPTICS

Person

Patents Grantslast 30 patents

Wafer bonding method

Microelectronic device

Microfluidic device and a fluid ejection device incorporating the same

Method for forming a fluid ejection device

Microfluidic device and a fluid ejection device incorporating the same

Method for forming a fluid ejection device

Packaged MEMS device assembly

Method for providing an anti-stiction coating on a metal surface

Bonding interface for micro-device packaging

Micro-displays and their manufacture

Wafer bonding method

System and a method for fluid filling wafer level packages

Patents Applicationslast 30 patents

MICROFLUIDIC DEVICE AND A FLUID EJECTION DEVICE INCORPORATING THE SAME

METHOD FOR FORMING A FLUID EJECTION DEVICE

Packaged MEMS device assembly

MICROFLUIDIC DEVICE AND A FLUID EJECTION DEVICE INCORPORATING THE SAME

METHOD FOR FORMING A FLUID EJECTION DEVICE

Method for providing an anti-stiction coating on a metal surface

Micro-Displays and Their Manufacture

Wafer Bonding Method

Controlling bond fronts in wafer-scale packaging

Microelectronic device

Wafer bonding method

Bonding interface for micro-device packaging

Micro-displays and their manufacture