Kishor V. Desai

Person

Binghamton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optically aligned hybrid semiconductor device and method
- Patent number 10,678,005
- Issue date Jun 9, 2020
- Elenion Technologies, LLC
- David Henry Kinghorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low CTE interposer
- Patent number 10,319,673
- Issue date Jun 11, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically aligned hybrid semiconductor device and method
- Patent number 10,222,565
- Issue date Mar 5, 2019
- Elenion Technologies, LLC
- David Henry Kinghorn
- G02 - OPTICS
Information Patent Grant
Low cost hybrid high density package
- Patent number 9,875,955
- Issue date Jan 23, 2018
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low CTE interposer
- Patent number 9,837,344
- Issue date Dec 5, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically aligned hybrid semiconductor device and method
- Patent number 9,817,197
- Issue date Nov 14, 2017
- Elenion Technologies, LLC
- David Henry Kinghorn
- G02 - OPTICS
Information Patent Grant
Molded glass lid for wafer level packaging of opto-electronic assem...
- Patent number 9,575,266
- Issue date Feb 21, 2017
- Cisco Technology, Inc.
- Kishor Desai
- G02 - OPTICS
Information Patent Grant
Coupling light from a waveguide array to single mode fiber array
- Patent number 9,557,499
- Issue date Jan 31, 2017
- Cisco Technology, Inc.
- Ravinder Kachru
- G02 - OPTICS
Information Patent Grant
Low cost hybrid high density package
- Patent number 9,508,687
- Issue date Nov 29, 2016
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single mode fiber array connector for opto-electronic transceivers
- Patent number 9,435,965
- Issue date Sep 6, 2016
- Cisco Technology, Inc.
- Chris Kiyoshi Togami
- G02 - OPTICS
Information Patent Grant
Low-stress TSV design using conductive particles
- Patent number 9,433,100
- Issue date Aug 30, 2016
- Tessera, Inc.
- Charles G. Woychik
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for placement and alignment of opto-electronic components
- Patent number 9,417,412
- Issue date Aug 16, 2016
- Cisco Technology, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
Low CTE interposer
- Patent number 9,401,288
- Issue date Jul 26, 2016
- Invensas Corporation
- Belgacem Haba
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reduced stress TSV and interposer structures
- Patent number 9,349,669
- Issue date May 24, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale packaging platform for transceivers
- Patent number 9,343,450
- Issue date May 17, 2016
- Cisco Technology, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
Coupling light from a waveguide array to single mode fiber array
- Patent number 9,274,290
- Issue date Mar 1, 2016
- Cisco Technology, Inc.
- Ravinder Kachru
- G02 - OPTICS
Information Patent Grant
Self-aligning optical connector assembly
- Patent number 9,235,019
- Issue date Jan 12, 2016
- Cisco Technology, Inc.
- Kalpendu Shastri
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Releasable fiber connector for opto-electronic assemblies
- Patent number 9,213,152
- Issue date Dec 15, 2015
- Cisco Technology Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
Flow underfill for microelectronic packages
- Patent number 9,196,581
- Issue date Nov 24, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid design to seal optical components of a transceiver module
- Patent number 9,151,950
- Issue date Oct 6, 2015
- Cisco Technology, Inc.
- Kishor V. Desai
- G02 - OPTICS
Information Patent Grant
Molded glass lid for wafer level packaging of opto-electronic assem...
- Patent number 9,052,445
- Issue date Jun 9, 2015
- Cisco Technology, Inc.
- Kishor Desai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer configuration with thermally isolated regions for temper...
- Patent number 9,031,107
- Issue date May 12, 2015
- Cisco Technology, Inc.
- Kalpendu Shastri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced stress TSV and interposer structures
- Patent number 9,000,600
- Issue date Apr 7, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost hybrid high density package
- Patent number 8,963,310
- Issue date Feb 24, 2015
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer configuration with thermally isolated regions for temper...
- Patent number 8,905,632
- Issue date Dec 9, 2014
- Cisco Technology, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
Self-aligning connectorized fiber array assembly
- Patent number 8,876,410
- Issue date Nov 4, 2014
- Cisco Technology, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
Arrangement for placement and alignment of opto-electronic components
- Patent number 8,830,466
- Issue date Sep 9, 2014
- Cisco Technology, Inc.
- Kalpendu Shastri
- G01 - MEASURING TESTING
Information Patent Grant
Wafer scale packaging platform for transceivers
- Patent number 8,803,269
- Issue date Aug 12, 2014
- Cisco Technology, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
Low CTE interposer
- Patent number 8,780,576
- Issue date Jul 15, 2014
- Invensas Corporation
- Belgacem Haba
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reduced stress TSV and interposer structures
- Patent number 8,772,946
- Issue date Jul 8, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICALLY ALIGNED HYBRID SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20190179091
- Publication date Jun 13, 2019
- Elenion Technologies, LLC
- David Henry Kinghorn
- G02 - OPTICS
Information Patent Application
LOW CTE INTERPOSER
- Publication number 20180082935
- Publication date Mar 22, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICALLY ALIGNED HYBRID SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20180052290
- Publication date Feb 22, 2018
- Elenion Technologies, LLC
- David Henry Kinghorn
- G02 - OPTICS
Information Patent Application
Low cost hybrid high density package
- Publication number 20170077018
- Publication date Mar 16, 2017
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CTE INTERPOSER
- Publication number 20170053857
- Publication date Feb 23, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optically Aligned Hybrid Semiconductor Device and Method
- Publication number 20160291265
- Publication date Oct 6, 2016
- Coriant Advanced Technology, LLC
- David Henry Kinghorn
- G02 - OPTICS
Information Patent Application
ARRANGEMENT FOR PLACEMENT AND ALIGNMENT OF OPTO-ELECTRONIC COMPONENTS
- Publication number 20160209606
- Publication date Jul 21, 2016
- Cisco Technology, Inc.
- Kalpendu SHASTRI
- G02 - OPTICS
Information Patent Application
COUPLING LIGHT FROM A WAVEGUIDE ARRAY TO SINGLE MODE FIBER ARRAY
- Publication number 20160161684
- Publication date Jun 9, 2016
- Cisco Technology, Inc.
- Ravinder KACHRU
- G02 - OPTICS
Information Patent Application
MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEM...
- Publication number 20150277068
- Publication date Oct 1, 2015
- Cisco Technology, Inc.
- Kishor DESAI
- G02 - OPTICS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20150187673
- Publication date Jul 2, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HYBRID HIGH DENSITY PACKAGE
- Publication number 20150171058
- Publication date Jun 18, 2015
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CONFIGURATION WITH THERMALLY ISOLATED REGIONS FOR TEMPER...
- Publication number 20150023377
- Publication date Jan 22, 2015
- Cisco Technology, Inc.
- Kalpendu SHASTRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING CONNECTORIZED FIBER ARRAY ASSEMBLY
- Publication number 20150016784
- Publication date Jan 15, 2015
- Cisco Technology, Inc.
- Kalpendu SHASTRI
- G02 - OPTICS
Information Patent Application
LOW CTE INTERPOSER
- Publication number 20140322864
- Publication date Oct 30, 2014
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SCALE PACKAGING PLATFORM FOR TRANSCEIVERS
- Publication number 20140248723
- Publication date Sep 4, 2014
- Cisco Technology, Inc.
- Kalpendu SHASTRI
- G02 - OPTICS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20140217607
- Publication date Aug 7, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW UNDERFILL FOR MICROELECTRONIC PACKAGES
- Publication number 20140217584
- Publication date Aug 7, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS TSV DESIGN USING CONDUCTIVE PARTICLES
- Publication number 20140201994
- Publication date Jul 24, 2014
- Tessera, Inc.
- Charles G. Woychik
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COUPLING LIGHT FROM A WAVEGUIDE ARRAY TO SINGLE MODE FIBER ARRAY
- Publication number 20140169734
- Publication date Jun 19, 2014
- Cisco Technology, Inc.
- Ravinder KACHRU
- G02 - OPTICS
Information Patent Application
Lid Design to Seal Optical Components of a Transceiver Module
- Publication number 20140043685
- Publication date Feb 13, 2014
- Cisco Technology, Inc.
- Kishor V. Desai
- G02 - OPTICS
Information Patent Application
Interposer Configuration With Thermally Isolated Regions For Temper...
- Publication number 20140003457
- Publication date Jan 2, 2014
- Cisco Technology, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20130328186
- Publication date Dec 12, 2013
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement For Placement And Alignment Of Opto-Electronic Components
- Publication number 20130314707
- Publication date Nov 28, 2013
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
Single Mode Fiber Array Connector For Opto-Electronic Transceivers
- Publication number 20130202255
- Publication date Aug 8, 2013
- Cisco Technology, Inc.
- Chris Kiyoshi Togami
- G02 - OPTICS
Information Patent Application
Packaging Platform For Opto-Electronic Assemblies Using Silicon-Bas...
- Publication number 20130188970
- Publication date Jul 25, 2013
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
Releasable Fiber Connector For Opto-Electronic Assemblies
- Publication number 20130182996
- Publication date Jul 18, 2013
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
Self-Aligning Connectorized Fiber Array Assembly
- Publication number 20130183008
- Publication date Jul 18, 2013
- Kalpendu Shastri
- B82 - NANO-TECHNOLOGY
Information Patent Application
SOLDER INTERCONNECT BY ADDITION OF COPPER
- Publication number 20130149857
- Publication date Jun 13, 2013
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assem...
- Publication number 20130101250
- Publication date Apr 25, 2013
- Kishor Desai
- G02 - OPTICS
Information Patent Application
LOW CTE INTERPOSER
- Publication number 20130063918
- Publication date Mar 14, 2013
- INVENSAS CORP.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Kishor V. Desai

Person

Patents Grantslast 30 patents

Optically aligned hybrid semiconductor device and method

Low CTE interposer

Optically aligned hybrid semiconductor device and method

Low cost hybrid high density package

Low CTE interposer

Optically aligned hybrid semiconductor device and method

Molded glass lid for wafer level packaging of opto-electronic assem...

Coupling light from a waveguide array to single mode fiber array

Low cost hybrid high density package

Single mode fiber array connector for opto-electronic transceivers

Low-stress TSV design using conductive particles

Arrangement for placement and alignment of opto-electronic components

Low CTE interposer

Reduced stress TSV and interposer structures

Wafer scale packaging platform for transceivers

Coupling light from a waveguide array to single mode fiber array

Self-aligning optical connector assembly

Releasable fiber connector for opto-electronic assemblies

Flow underfill for microelectronic packages

Lid design to seal optical components of a transceiver module

Molded glass lid for wafer level packaging of opto-electronic assem...

Interposer configuration with thermally isolated regions for temper...

Reduced stress TSV and interposer structures

Low cost hybrid high density package

Interposer configuration with thermally isolated regions for temper...

Self-aligning connectorized fiber array assembly

Arrangement for placement and alignment of opto-electronic components

Wafer scale packaging platform for transceivers

Low CTE interposer

Reduced stress TSV and interposer structures

Patents Applicationslast 30 patents

OPTICALLY ALIGNED HYBRID SEMICONDUCTOR DEVICE AND METHOD

LOW CTE INTERPOSER

OPTICALLY ALIGNED HYBRID SEMICONDUCTOR DEVICE AND METHOD

Low cost hybrid high density package

LOW CTE INTERPOSER

Optically Aligned Hybrid Semiconductor Device and Method

ARRANGEMENT FOR PLACEMENT AND ALIGNMENT OF OPTO-ELECTRONIC COMPONENTS

COUPLING LIGHT FROM A WAVEGUIDE ARRAY TO SINGLE MODE FIBER ARRAY

MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEM...

REDUCED STRESS TSV AND INTERPOSER STRUCTURES

LOW COST HYBRID HIGH DENSITY PACKAGE

INTERPOSER CONFIGURATION WITH THERMALLY ISOLATED REGIONS FOR TEMPER...

SELF-ALIGNING CONNECTORIZED FIBER ARRAY ASSEMBLY

LOW CTE INTERPOSER

WAFER SCALE PACKAGING PLATFORM FOR TRANSCEIVERS

REDUCED STRESS TSV AND INTERPOSER STRUCTURES

FLOW UNDERFILL FOR MICROELECTRONIC PACKAGES

LOW-STRESS TSV DESIGN USING CONDUCTIVE PARTICLES

COUPLING LIGHT FROM A WAVEGUIDE ARRAY TO SINGLE MODE FIBER ARRAY

Lid Design to Seal Optical Components of a Transceiver Module

Interposer Configuration With Thermally Isolated Regions For Temper...

REDUCED STRESS TSV AND INTERPOSER STRUCTURES

Arrangement For Placement And Alignment Of Opto-Electronic Components

Single Mode Fiber Array Connector For Opto-Electronic Transceivers

Packaging Platform For Opto-Electronic Assemblies Using Silicon-Bas...

Releasable Fiber Connector For Opto-Electronic Assemblies

Self-Aligning Connectorized Fiber Array Assembly

SOLDER INTERCONNECT BY ADDITION OF COPPER

Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assem...

LOW CTE INTERPOSER