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Kiyokazu Ikeya

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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device burn-in test socket
    • Patent number 8,388,365
    • Issue date Mar 5, 2013
    • Hideyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket adaptor apparatus
    • Patent number 7,601,008
    • Issue date Oct 13, 2009
    • Sensata Technologies, Inc.
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Contact assembly and socket for use with semiconductor packages
    • Patent number 7,217,140
    • Issue date May 15, 2007
    • Sensata Technologies, Inc.
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket
    • Patent number 6,848,928
    • Issue date Feb 1, 2005
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket for mounting an electronic device
    • Patent number 6,749,443
    • Issue date Jun 15, 2004
    • Texas Instruments Incorporated
    • Hideki Sano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket for removably mounting electronic packages
    • Patent number 6,666,691
    • Issue date Dec 23, 2003
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket apparatus and method for removably mounting an electronic pa...
    • Patent number 6,614,247
    • Issue date Sep 2, 2003
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket apparatus for removably mounting electronic packages with im...
    • Patent number 6,439,897
    • Issue date Aug 27, 2002
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket for removably mounting an electronic part
    • Patent number 6,402,537
    • Issue date Jun 11, 2002
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket for removably mounting electronic parts having a plurality o...
    • Patent number 6,350,138
    • Issue date Feb 26, 2002
    • Texas Instruments Incorporated
    • Takeyoshi Atobe
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Electrical socket apparatus
    • Patent number 6,322,384
    • Issue date Nov 27, 2001
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electrical socket apparatus
    • Patent number 6,287,127
    • Issue date Sep 11, 2001
    • Texas Instruments Incorporated
    • Yasushi Hibino
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket apparatus for IC packages
    • Patent number 6,280,219
    • Issue date Aug 28, 2001
    • Texas Instruments Incorporated
    • Hideki Sano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket apparatus for removably loading electric parts
    • Patent number 6,027,355
    • Issue date Feb 22, 2000
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket
    • Patent number 5,816,828
    • Issue date Oct 6, 1998
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Test socket for detachable IC chip
    • Patent number 5,807,104
    • Issue date Sep 15, 1998
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket apparatus
    • Patent number 5,718,595
    • Issue date Feb 17, 1998
    • Texas Instruments Incorporated
    • Masao Tohyama
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Socket apparatus
    • Patent number 5,690,281
    • Issue date Nov 25, 1997
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Detachable socket for an IC chip
    • Patent number 5,688,128
    • Issue date Nov 18, 1997
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Socket apparatus
    • Patent number 5,658,153
    • Issue date Aug 19, 1997
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Test socket for an integrated circuit
    • Patent number 5,628,635
    • Issue date May 13, 1997
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Socket apparatus for IC package testing
    • Patent number 5,482,471
    • Issue date Jan 9, 1996
    • Texas Instruments Incorporated
    • Ikuo Mori
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket apparatus
    • Patent number 5,462,446
    • Issue date Oct 31, 1995
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket
    • Patent number 5,460,538
    • Issue date Oct 24, 1995
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket
    • Patent number 5,407,361
    • Issue date Apr 18, 1995
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket
    • Patent number 5,364,284
    • Issue date Nov 15, 1994
    • Texas Instruments Incorporated
    • Masao Tohyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket
    • Patent number 5,320,551
    • Issue date Jun 14, 1994
    • Texas Instruments Incorporated
    • Ikuo Mori
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket
    • Patent number 5,139,437
    • Issue date Aug 18, 1992
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Test socket
    • Patent number 5,020,998
    • Issue date Jun 4, 1991
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Test socket with improved contact engagement
    • Patent number 4,846,704
    • Issue date Jul 11, 1989
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • G01 - MEASURING TESTING

Patents Applicationslast 30 patents

  • Information Patent Application

    SOCKET
    • Publication number 20100248518
    • Publication date Sep 30, 2010
    • Hideyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Socket Adaptor Apparatus
    • Publication number 20090017703
    • Publication date Jan 15, 2009
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Application

    Contact assembly and socket for use with semiconductor packages
    • Publication number 20060192264
    • Publication date Aug 31, 2006
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Application

    Socket
    • Publication number 20030100201
    • Publication date May 29, 2003
    • Kiyokazu Ikeya
    • G01 - MEASURING TESTING
  • Information Patent Application

    Burn-in test socket
    • Publication number 20030054676
    • Publication date Mar 20, 2003
    • Hideki Sano
    • G01 - MEASURING TESTING
  • Information Patent Application

    Socket for removably mounting an electronic part
    • Publication number 20020004329
    • Publication date Jan 10, 2002
    • Kiyokazu Ikeya
    • H01 - BASIC ELECTRIC ELEMENTS