Kiyotaka Tsukada

Person

Ogakishi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Antiviral substrate, antiviral composition, method for manufacturin...
- Patent number 11,925,180
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Katsutoshi Horino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Antiviral substrate, antiviral composition, method for manufacturin...
- Patent number 11,517,020
- Issue date Dec 6, 2022
- Ibiden Co., Ltd.
- Katsutoshi Horino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Light-emitting element mounting substrate and method for manufactur...
- Patent number 10,319,892
- Issue date Jun 11, 2019
- Ibiden Co., Ltd.
- Takahisa Hirasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting electronic component and method for manufact...
- Patent number 9,781,840
- Issue date Oct 3, 2017
- Ibiden Co., Ltd.
- Naoyuki Nagaya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Printed wiring board with reinforced insulation layer and manufactu...
- Patent number 8,710,374
- Issue date Apr 29, 2014
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and semiconductor module
- Patent number 8,441,806
- Issue date May 14, 2013
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and fabrication method therefor
- Patent number 8,415,791
- Issue date Apr 9, 2013
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,378,231
- Issue date Feb 19, 2013
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with resin complex layer and manufacturing met...
- Patent number 8,327,533
- Issue date Dec 11, 2012
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and production method thereof
- Patent number 8,278,753
- Issue date Oct 2, 2012
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 8,156,646
- Issue date Apr 17, 2012
- Ibiden Co., Ltd.
- Tsutomu Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and manufacturing method thereof
- Patent number 8,148,643
- Issue date Apr 3, 2012
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 7,943,861
- Issue date May 17, 2011
- Ibiden Co., Ltd.
- Tsutomu Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayered printed circuit board
- Patent number 7,832,098
- Issue date Nov 16, 2010
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board
- Patent number 7,786,389
- Issue date Aug 31, 2010
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 7,765,692
- Issue date Aug 3, 2010
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 7,612,295
- Issue date Nov 3, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 7,594,320
- Issue date Sep 29, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having a solder pad and a method for manufactu...
- Patent number 7,568,922
- Issue date Aug 4, 2009
- Ibiden Co., Ltd.
- Takahiro Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed wiring board having a previously...
- Patent number 7,552,531
- Issue date Jun 30, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 7,453,702
- Issue date Nov 18, 2008
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayered circuit board
- Patent number 7,415,761
- Issue date Aug 26, 2008
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 7,339,118
- Issue date Mar 4, 2008
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board
- Patent number 7,312,401
- Issue date Dec 25, 2007
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-film embedded capacitance, method for manufacturing thereof, a...
- Patent number 7,310,238
- Issue date Dec 18, 2007
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 6,986,917
- Issue date Jan 17, 2006
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 6,825,421
- Issue date Nov 30, 2004
- Ibiden Co., Ltd.
- Masaru Takada
Information Patent Grant
Printed-circuit board and method of manufacture thereof
- Patent number 6,809,415
- Issue date Oct 26, 2004
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 6,715,204
- Issue date Apr 6, 2004
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of a multilayered printed circuit board having...
- Patent number 6,591,495
- Issue date Jul 15, 2003
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ANTIVIRAL SUBSTRATE, ANTIVIRAL COMPOSITION, METHOD FOR MANUFACTURIN...
- Publication number 20240251799
- Publication date Aug 1, 2024
- IBIDEN CO., LTD.
- Katsutoshi HORINO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANTIVIRAL SUBSTRATE, ANTIVIRAL COMPOSITION, METHOD FOR MANUFACTURIN...
- Publication number 20230064901
- Publication date Mar 2, 2023
- IBIDEN CO., LTD.
- Katsutoshi HORINO
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
ANTIVIRAL SUBSTRATE, ANTIVIRAL COMPOSITION, METHOD FOR MANUFACTURIN...
- Publication number 20200236946
- Publication date Jul 30, 2020
- IBIDEN CO., LTD.
- Katsutoshi HORINO
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTUR...
- Publication number 20180233644
- Publication date Aug 16, 2018
- IBIDEN CO., LTD.
- Takahisa Hirasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WIRING BOARD AND METHOD FOR MANUFACTURING COMPOSITE WIRIN...
- Publication number 20170374742
- Publication date Dec 28, 2017
- IBIDEN CO., LTD.
- Takahisa HIRASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTUR...
- Publication number 20170222112
- Publication date Aug 3, 2017
- IBIDEN CO., LTD.
- Takahisa HIRASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD, ELECTRONIC DEVICE HAVING FLEXIBLE PR...
- Publication number 20170223816
- Publication date Aug 3, 2017
- IBIDEN CO., LTD.
- Takahisa HIRASAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...
- Publication number 20160135302
- Publication date May 12, 2016
- IBIDEN CO., LTD.
- Naoyuki NAGAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120125680
- Publication date May 24, 2012
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20110121450
- Publication date May 26, 2011
- IBIDEN CO., LTD.
- Kiyotaka TSUKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF
- Publication number 20110121448
- Publication date May 26, 2011
- IBIDEN CO., LTD.
- Kiyotaka TSUKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR MODULE
- Publication number 20110080714
- Publication date Apr 7, 2011
- IBIDEN CO., LTD.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100027228
- Publication date Feb 4, 2010
- IBIDEN CO., LTD.
- Kiyotaka TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20090285980
- Publication date Nov 19, 2009
- IBIDEN CO., LTD.
- Tsutomu IWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD WITH RESIN COMPLEX LAYER AND MANUFACTURING MET...
- Publication number 20090236128
- Publication date Sep 24, 2009
- IBIDEN CO., LTD.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD WITH REINFORCED INSULATION LAYER AND MANUFACTU...
- Publication number 20090229868
- Publication date Sep 17, 2009
- IBIDEN CO., LTD.
- KIYOTAKA TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090019693
- Publication date Jan 22, 2009
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Wiring Board and Method for Manufacturing Printed Wiring Board
- Publication number 20080264681
- Publication date Oct 30, 2008
- IBIDEN CO., LTD.
- Tsutomu Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080189943
- Publication date Aug 14, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080173473
- Publication date Jul 24, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD
- Publication number 20080115963
- Publication date May 22, 2008
- IBIDEN CO., LTD.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin-film embedded capacitance, method for manufacturing thereof, a...
- Publication number 20070030627
- Publication date Feb 8, 2007
- IBIDEN CO., LTD.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Wiring Board and Method for Manufacturing The Same
- Publication number 20060202344
- Publication date Sep 14, 2006
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board
- Publication number 20060169484
- Publication date Aug 3, 2006
- IBIDEN CO., LTD.
- Takahiro Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible printed wiring board
- Publication number 20060068613
- Publication date Mar 30, 2006
- IBIDEN CO., LTD.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board
- Publication number 20060049509
- Publication date Mar 9, 2006
- IBIDEN, CO., LTD.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20060042824
- Publication date Mar 2, 2006
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered printed circuit board and manufacturing method therefor
- Publication number 20040025333
- Publication date Feb 12, 2004
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20030203170
- Publication date Oct 30, 2003
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20030150644
- Publication date Aug 14, 2003
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kiyotaka Tsukada

Person

Patents Grantslast 30 patents

Antiviral substrate, antiviral composition, method for manufacturin...

Antiviral substrate, antiviral composition, method for manufacturin...

Light-emitting element mounting substrate and method for manufactur...

Substrate for mounting electronic component and method for manufact...

Printed wiring board with reinforced insulation layer and manufactu...

Circuit board and semiconductor module

Semiconductor device and fabrication method therefor

Semiconductor device and method for manufacturing the same

Printed wiring board with resin complex layer and manufacturing met...

Semiconductor device and production method thereof

Method for manufacturing printed wiring board

Multilayered printed circuit board and manufacturing method thereof

Printed wiring board and method for manufacturing printed wiring board

Method of manufacturing a multilayered printed circuit board

Flexible printed wiring board

Method of manufacturing printed wiring board

Printed wiring board and method for manufacturing the same

Method of manufacturing printed wiring board

Printed wiring board having a solder pad and a method for manufactu...

Method of manufacturing a printed wiring board having a previously...

Printed wiring board

Method of manufacturing multilayered circuit board

Printed wiring board and method for manufacturing the same

Flexible printed wiring board

Thin-film embedded capacitance, method for manufacturing thereof, a...

Printed wiring board and method of manufacturing the same

Printed wiring board and method for manufacturing the same

Printed-circuit board and method of manufacture thereof

Printed wiring board and method for producing the same

Manufacturing method of a multilayered printed circuit board having...

Patents Applicationslast 30 patents

ANTIVIRAL SUBSTRATE, ANTIVIRAL COMPOSITION, METHOD FOR MANUFACTURIN...

ANTIVIRAL SUBSTRATE, ANTIVIRAL COMPOSITION, METHOD FOR MANUFACTURIN...

ANTIVIRAL SUBSTRATE, ANTIVIRAL COMPOSITION, METHOD FOR MANUFACTURIN...

LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTUR...

COMPOSITE WIRING BOARD AND METHOD FOR MANUFACTURING COMPOSITE WIRIN...

LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTUR...

FLEXIBLE PRINTED WIRING BOARD, ELECTRONIC DEVICE HAVING FLEXIBLE PR...

SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF

CIRCUIT BOARD AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD WITH RESIN COMPLEX LAYER AND MANUFACTURING MET...

PRINTED WIRING BOARD WITH REINFORCED INSULATION LAYER AND MANUFACTU...

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Printed Wiring Board and Method for Manufacturing Printed Wiring Board

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

FLEXIBLE PRINTED WIRING BOARD

Thin-film embedded capacitance, method for manufacturing thereof, a...

Printed Wiring Board and Method for Manufacturing The Same

Printed wiring board

Flexible printed wiring board

Printed wiring board

Printed wiring board and method of manufacturing the same

Multilayered printed circuit board and manufacturing method therefor

Printed wiring board and method of manufacturing the same

Printed wiring board and method of manufacturing the same