Kiyoyuki Hatanaka

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing through hole of substrate
- Patent number 10,863,629
- Issue date Dec 8, 2020
- Fujitsu Limited
- Kiyoyuki Hatanaka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wiring board, electronic apparatus, method for attaching sheet meta...
- Patent number 10,624,216
- Issue date Apr 14, 2020
- Fujitsu Limited
- Nobuo Taketomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, crack prediction device, and crack prediction...
- Patent number 10,605,851
- Issue date Mar 31, 2020
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection method of laminated board, inspection module, and pallet
- Patent number 10,393,797
- Issue date Aug 27, 2019
- Fujitsu Limited
- Mitsunori Abe
- G01 - MEASURING TESTING
Information Patent Grant
Substrate and method of manufacturing the same
- Patent number 10,342,129
- Issue date Jul 2, 2019
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, crack prediction device, and crack prediction...
- Patent number 9,709,619
- Issue date Jul 18, 2017
- Fujitsu Limited
- Shigeo Iriguchi
- G01 - MEASURING TESTING
Information Patent Grant
Substrate with embedded component
- Patent number 9,591,763
- Issue date Mar 7, 2017
- Fujitsu Limited
- Mitsunori Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of repair of electronic device and repair system
- Patent number 8,456,854
- Issue date Jun 4, 2013
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus
- Patent number 7,101,205
- Issue date Sep 5, 2006
- Fujitsu Limited
- Kiyoyuki Hatanaka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING THROUGH HOLE OF SUBSTRATE
- Publication number 20200037452
- Publication date Jan 30, 2020
- Fujitsu Limited
- Kiyoyuki Hatanaka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
WIRING BOARD, ELECTRONIC APPARATUS, METHOD FOR ATTACHING SHEET META...
- Publication number 20190110365
- Publication date Apr 11, 2019
- Fujitsu Limited
- Nobuo Taketomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180310405
- Publication date Oct 25, 2018
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION METHOD OF LAMINATED BOARD, INSPECTION MODULE, AND PALLET
- Publication number 20180059170
- Publication date Mar 1, 2018
- Fujitsu Limited
- Mitsunori ABE
- G01 - MEASURING TESTING
Information Patent Application
PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...
- Publication number 20170285096
- Publication date Oct 5, 2017
- Fujitsu Limited
- Shigeo IRIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
RIGID FLEXIBLE BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170196077
- Publication date Jul 6, 2017
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH EMBEDDED COMPONENT
- Publication number 20160324005
- Publication date Nov 3, 2016
- Fujitsu Limited
- Mitsunori Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...
- Publication number 20140077834
- Publication date Mar 20, 2014
- Shigeo IRIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCT...
- Publication number 20110286188
- Publication date Nov 24, 2011
- Fujitsu Limited
- Ryo KANAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICA...
- Publication number 20110240355
- Publication date Oct 6, 2011
- Fujitsu Limited
- Naoki NAKAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD
- Publication number 20110240352
- Publication date Oct 6, 2011
- Fujitsu Limited
- Naoki NAKAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME...
- Publication number 20110132654
- Publication date Jun 9, 2011
- Fujitsu Limited
- Nobuo TAKETOMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING ELECTRONIC PART UNIT
- Publication number 20100200643
- Publication date Aug 12, 2010
- Fujitsu Limited
- Nobuo Taketomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of repair of electronic device and repair system
- Publication number 20090175010
- Publication date Jul 9, 2009
- FUJITSU LIMITED
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic apparatus
- Publication number 20060073711
- Publication date Apr 6, 2006
- FUJITSU LIMITED
- Kiyoyuki Hatanaka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Kiyoyuki Hatanaka

Person

Patents Grantslast 30 patents

Method of manufacturing through hole of substrate

Wiring board, electronic apparatus, method for attaching sheet meta...

Printed wiring board, crack prediction device, and crack prediction...

Inspection method of laminated board, inspection module, and pallet

Substrate and method of manufacturing the same

Printed wiring board, crack prediction device, and crack prediction...

Substrate with embedded component

Method of repair of electronic device and repair system

Electronic apparatus

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING THROUGH HOLE OF SUBSTRATE

WIRING BOARD, ELECTRONIC APPARATUS, METHOD FOR ATTACHING SHEET META...

SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

INSPECTION METHOD OF LAMINATED BOARD, INSPECTION MODULE, AND PALLET

PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...

RIGID FLEXIBLE BOARD AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE WITH EMBEDDED COMPONENT

PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...

MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCT...

PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICA...

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD

MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME...

METHOD FOR PRODUCING ELECTRONIC PART UNIT

Method of repair of electronic device and repair system

Electronic apparatus