Klaus Goller

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Barrier for power metallization in semiconductor devices
- Patent number 11,127,693
- Issue date Sep 21, 2021
- Infineon Technologies AG
- Johann Gatterbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit arrangement with an auxiliary indentation, parti...
- Patent number 8,901,737
- Issue date Dec 2, 2014
- Infineon Technologies AG
- Klaus Goller
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated circuit arrangement including vias having two sections,...
- Patent number 8,273,658
- Issue date Sep 25, 2012
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor assemblies
- Patent number 8,008,161
- Issue date Aug 30, 2011
- Infineon Technologies AG
- Jens Bachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor arrangement and method for making same
- Patent number 7,989,919
- Issue date Aug 2, 2011
- Infineon Technologies AG
- Josef Boeck
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interconnections for integrated circuits
- Patent number 7,951,703
- Issue date May 31, 2011
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a layer arrangement
- Patent number 7,795,135
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Stefan Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an integrated circuit assembly with an auxilia...
- Patent number 7,795,105
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and arrangement for contacting terminals
- Patent number 7,666,783
- Issue date Feb 23, 2010
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor element
- Patent number 7,611,958
- Issue date Nov 3, 2009
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for integrated circuits
- Patent number 7,569,938
- Issue date Aug 4, 2009
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having a useful structure and an auxiliary structure
- Patent number 7,342,314
- Issue date Mar 11, 2008
- Infineon Technologies AG
- Jens Bachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating a semiconductor d...
- Patent number 7,026,547
- Issue date Apr 11, 2006
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure for determining the electrical loadability of contacts
- Patent number 6,899,543
- Issue date May 31, 2005
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Barrier for Power Metallization in Semiconductor Devices
- Publication number 20200111754
- Publication date Apr 9, 2020
- Johann Gatterbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT ARRANGEMENT WITH AN AUXILIARY INDENTATION, PARTI...
- Publication number 20100320613
- Publication date Dec 23, 2010
- Infineon Technologies AG
- Klaus Goller
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Capacitor Arrangement And Method For Making Same
- Publication number 20100309606
- Publication date Dec 9, 2010
- Karl-Heinz ALLERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR INTEGRATED CIRCUITS
- Publication number 20090263964
- Publication date Oct 22, 2009
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR ELEMENT
- Publication number 20090148996
- Publication date Jun 11, 2009
- INFINEON TECHNOLOGIES AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Arrangment Including Vias Having Two Sections, a...
- Publication number 20080303169
- Publication date Dec 11, 2008
- INFINEON TECHNOLOGIES AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a layer arrangement
- Publication number 20080102625
- Publication date May 1, 2008
- Stefan Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and arrangement for contacting terminals
- Publication number 20080070403
- Publication date Mar 20, 2008
- INFINEON TECHNOLOGIES AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an integrated circuit assembly with an auxilia...
- Publication number 20070102819
- Publication date May 10, 2007
- Klaus Goller
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MAKING CONTACT WITH THE EMITTER CONTACT OF A SEMICONDUCTOR
- Publication number 20060246726
- Publication date Nov 2, 2006
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnections for integrated circuits
- Publication number 20060163737
- Publication date Jul 27, 2006
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor assemblies
- Publication number 20050287755
- Publication date Dec 29, 2005
- Jens Bachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing a capacitor in a dielectric layer
- Publication number 20050079669
- Publication date Apr 14, 2005
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device having a useful structure and an auxiliary structure
- Publication number 20050017328
- Publication date Jan 27, 2005
- Infineon Technologies AG
- Jens Bachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Making contact with the emitter contact of a semiconductor
- Publication number 20040227212
- Publication date Nov 18, 2004
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and arrangement for contacting terminals
- Publication number 20040198039
- Publication date Oct 7, 2004
- Infineon Technologies AG
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test structure for determining the electrical loadability of contacts
- Publication number 20040115963
- Publication date Jun 17, 2004
- Klaus Goller
- H01 - BASIC ELECTRIC ELEMENTS

Klaus Goller

Person

Patents Grantslast 30 patents

Barrier for power metallization in semiconductor devices

Integrated circuit arrangement with an auxiliary indentation, parti...

Integrated circuit arrangement including vias having two sections,...

Capacitor assemblies

Capacitor arrangement and method for making same

Interconnections for integrated circuits

Method for producing a layer arrangement

Method for producing an integrated circuit assembly with an auxilia...

Method and arrangement for contacting terminals

Method of making a semiconductor element

Interconnections for integrated circuits

Device having a useful structure and an auxiliary structure

Semiconductor device and a method for fabricating a semiconductor d...

Test structure for determining the electrical loadability of contacts

Patents Applicationslast 30 patents

Barrier for Power Metallization in Semiconductor Devices

INTEGRATED CIRCUIT ARRANGEMENT WITH AN AUXILIARY INDENTATION, PARTI...

Capacitor Arrangement And Method For Making Same

INTERCONNECTIONS FOR INTEGRATED CIRCUITS

METHOD OF MAKING A SEMICONDUCTOR ELEMENT

Integrated Circuit Arrangment Including Vias Having Two Sections, a...

Method for producing a layer arrangement

Method and arrangement for contacting terminals

Method for producing an integrated circuit assembly with an auxilia...

MAKING CONTACT WITH THE EMITTER CONTACT OF A SEMICONDUCTOR

Interconnections for integrated circuits

Capacitor assemblies

Method of producing a capacitor in a dielectric layer

Device having a useful structure and an auxiliary structure

Making contact with the emitter contact of a semiconductor

Method and arrangement for contacting terminals

Test structure for determining the electrical loadability of contacts