Klaus Jürgen REINGRUBER

Person

Langquaid, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,955,462
- Issue date Apr 9, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method for producing an optoelectronic...
- Patent number 11,715,820
- Issue date Aug 1, 2023
- OSRAM OLED GmbH
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing optoelectronic semiconductor components, and o...
- Patent number 11,670,745
- Issue date Jun 6, 2023
- OSRAM OLED GmbH
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing reduced height s...
- Patent number 11,469,213
- Issue date Oct 11, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure with internal conductive layer
- Patent number 11,424,209
- Issue date Aug 23, 2022
- Intel Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,239,199
- Issue date Feb 1, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method of producing an optoelectronic...
- Patent number 10,937,932
- Issue date Mar 2, 2021
- OSRAM OLED GmbH
- Peter Nagel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with more than one hanging die
- Patent number 10,854,590
- Issue date Dec 1, 2020
- Intel IP Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages including an optical redistribution layer
- Patent number 10,816,742
- Issue date Oct 27, 2020
- Intel IP Corporation
- Georg Seidemann
- G02 - OPTICS
Information Patent Grant
Electronic components having three-dimensional capacitors in a meta...
- Patent number 10,741,486
- Issue date Aug 11, 2020
- Intel Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package assemblies including a chip recess
- Patent number 10,714,455
- Issue date Jul 14, 2020
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a lighting device
- Patent number 10,680,147
- Issue date Jun 9, 2020
- OSRAM OLED GmbH
- Peter Nagel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure with internal conductive layer
- Patent number 10,672,731
- Issue date Jun 2, 2020
- Intel IP Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with conductive routing exposed on sidewalls
- Patent number 10,651,102
- Issue date May 12, 2020
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a variable redistribution layer thickness
- Patent number 10,553,538
- Issue date Feb 4, 2020
- Intel Corporation
- Klaus Jürgen Reingruber
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrical device and a method for forming an electrical device
- Patent number 10,522,485
- Issue date Dec 31, 2019
- Intel IP Corporation
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical wire connections for integrated circuit package
- Patent number 10,490,527
- Issue date Nov 26, 2019
- Intel IP Corporation
- Christian Geissler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced node cost reduction by ESD interposer
- Patent number 10,446,541
- Issue date Oct 15, 2019
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with illuminated backside exterior
- Patent number 10,411,000
- Issue date Sep 10, 2019
- Intel IP Corporation
- Marc Stephan Dittes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package devices and methods for forming system-in-package...
- Patent number 10,403,609
- Issue date Sep 3, 2019
- Intel IP Corporation
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for a microelectronic device
- Patent number 10,366,968
- Issue date Jul 30, 2019
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible band wearable electronic device
- Patent number 10,228,725
- Issue date Mar 12, 2019
- Intel IP Corporation
- Sven Albers
- A44 - HABERDASHERY JEWELLERY
Information Patent Grant
Integrated circuit packages including an optical redistribution layer
- Patent number 10,209,466
- Issue date Feb 19, 2019
- Intel IP Corporation
- Georg Seidemann
- G02 - OPTICS
Information Patent Grant
Integrated circuit package assemblies including a chip recess
- Patent number 10,186,499
- Issue date Jan 22, 2019
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package architecture and method for making
- Patent number 10,170,409
- Issue date Jan 1, 2019
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooler for semiconductor devices
- Patent number 10,121,726
- Issue date Nov 6, 2018
- Intel IP Corporation
- Sven Albers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package having a variable redistribution layer thickness
- Patent number 10,115,668
- Issue date Oct 30, 2018
- Intel IP Corporation
- Klaus Jürgen Reingruber
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wearable computing device
- Patent number 9,921,694
- Issue date Mar 20, 2018
- Intel Corporation
- Sven Albers
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic package with coil formed on core
- Patent number 9,865,387
- Issue date Jan 9, 2018
- Intel IP Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer lines
- Patent number 9,741,651
- Issue date Aug 22, 2017
- Intel IP Corportaion
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STACKING USING CHIP TO WAFER BONDING
- Publication number 20240213225
- Publication date Jun 27, 2024
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACKING USING CHIP TO WAFER BONDING
- Publication number 20220108976
- Publication date Apr 7, 2022
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC...
- Publication number 20200373470
- Publication date Nov 26, 2020
- OSRAM OLED GmbH
- Klaus REINGRUBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE STRUCTURE WITH INTERNAL CONDUCTIVE LAYER
- Publication number 20200273832
- Publication date Aug 27, 2020
- Intel IP Corporation
- Sven ALBERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING OPTOELECTRONIC SEMICONDUCTOR COMPONENTS, AND O...
- Publication number 20200212271
- Publication date Jul 2, 2020
- OSRAM OLED GmbH
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH MORE THAN ONE HANGING DIE
- Publication number 20200176436
- Publication date Jun 4, 2020
- Intel IP Corporation
- Sven ALBERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT TERMINATIONS FOR SEMICONDUCTOR PACKAGES
- Publication number 20200068711
- Publication date Feb 27, 2020
- Intel IP Corporation
- Andreas Wolter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE DEVICES HAVING A BALL GRID ARRAY WITH SIDE WALL CONTACT PADS
- Publication number 20200066692
- Publication date Feb 27, 2020
- Intel IP Corporation
- Andreas WOLTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES OF STACKING INTEGRATED CIRCUITS
- Publication number 20190393191
- Publication date Dec 26, 2019
- Intel IP Corporation
- Klaus REINGRUBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20190333886
- Publication date Oct 31, 2019
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC...
- Publication number 20190267519
- Publication date Aug 29, 2019
- Osram Opto Semiconductors GmbH
- Peter Nagel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING REDUCED HEIGHT S...
- Publication number 20190214369
- Publication date Jul 11, 2019
- Intel IP Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPLB/EWLB BASED POP FOR HBM OR CUSTOMIZED PACKAGE STACK
- Publication number 20190206833
- Publication date Jul 4, 2019
- Intel IP Corporation
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A LIGHTING DEVICE
- Publication number 20190189871
- Publication date Jun 20, 2019
- Osram Opto Semiconductors GmbH
- Peter Nagel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FIBER CONNECTION ON PACKAGE EDGE
- Publication number 20190121041
- Publication date Apr 25, 2019
- Intel IP Corporation
- Sven Albers
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ASSEMBLIES INCLUDING A CHIP RECESS
- Publication number 20190109120
- Publication date Apr 11, 2019
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING AN OPTICAL REDISTRIBUTION LAYER
- Publication number 20190072732
- Publication date Mar 7, 2019
- Intel IP Corporation
- Georg Seidemann
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A VARIABLE REDISTRIBUTION LAYER THICKNESS
- Publication number 20190043800
- Publication date Feb 7, 2019
- Intel IP Corporation
- Klaus Jürgen REINGRUBER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
VERTICAL WIRE CONNECTIONS FOR INTEGRATED CIRCUIT PACKAGE
- Publication number 20180374819
- Publication date Dec 27, 2018
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE STRUCTURE WITH INTERNAL CONDUCTIVE LAYER
- Publication number 20180358317
- Publication date Dec 13, 2018
- Sven ALBERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH CONDUCTIVE ROUTING EXPOSED ON SIDEWALLS
- Publication number 20180342431
- Publication date Nov 29, 2018
- Intel IP Corporation
- Klaus Reingruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System-in-Package Devices and Methods for Forming System-in-Package...
- Publication number 20180331080
- Publication date Nov 15, 2018
- Intel IP Corporation
- Christian GEISSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical device and a method for forming an electrical device
- Publication number 20180331053
- Publication date Nov 15, 2018
- Intel IP Corporation
- Christian GEISSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACKING USING CHIP TO WAFER BONDING
- Publication number 20180331070
- Publication date Nov 15, 2018
- Intel IP Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH COIL FORMED ON CORE
- Publication number 20180226185
- Publication date Aug 9, 2018
- Intel IP Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED NODE COST REDUCTION BY ESD INTERPOSER
- Publication number 20180204831
- Publication date Jul 19, 2018
- Intel IP Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE COMPUTING DEVICE
- Publication number 20180150156
- Publication date May 31, 2018
- Intel Corporation
- Sven Albers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20180096970
- Publication date Apr 5, 2018
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE BAND WEARABLE ELECTRONIC DEVICE
- Publication number 20180092443
- Publication date Apr 5, 2018
- Sven Albers
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE BAND WEARABLE ELECTRONIC DEVICE
- Publication number 20180095426
- Publication date Apr 5, 2018
- Sven Albers
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Klaus Jürgen REINGRUBER

Person

Patents Grantslast 30 patents

Package stacking using chip to wafer bonding

Optoelectronic component and method for producing an optoelectronic...

Method for producing optoelectronic semiconductor components, and o...

Systems, methods, and apparatuses for implementing reduced height s...

Wafer level package structure with internal conductive layer

Package stacking using chip to wafer bonding

Optoelectronic component and method of producing an optoelectronic...

Semiconductor die package with more than one hanging die

Integrated circuit packages including an optical redistribution layer

Electronic components having three-dimensional capacitors in a meta...

Integrated circuit package assemblies including a chip recess

Method of producing a lighting device

Wafer level package structure with internal conductive layer

Interposer with conductive routing exposed on sidewalls

Semiconductor package having a variable redistribution layer thickness

Electrical device and a method for forming an electrical device

Vertical wire connections for integrated circuit package

Advanced node cost reduction by ESD interposer

Microelectronic package with illuminated backside exterior

System-in-package devices and methods for forming system-in-package...

Interconnect structure for a microelectronic device

Flexible band wearable electronic device

Integrated circuit packages including an optical redistribution layer

Integrated circuit package assemblies including a chip recess

Package on package architecture and method for making

Cooler for semiconductor devices

Semiconductor package having a variable redistribution layer thickness

Wearable computing device

Electronic package with coil formed on core

Redistribution layer lines

Patents Applicationslast 30 patents

PACKAGE STACKING USING CHIP TO WAFER BONDING

PACKAGE STACKING USING CHIP TO WAFER BONDING

OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC...

WAFER LEVEL PACKAGE STRUCTURE WITH INTERNAL CONDUCTIVE LAYER

METHOD FOR PRODUCING OPTOELECTRONIC SEMICONDUCTOR COMPONENTS, AND O...

SEMICONDUCTOR DIE PACKAGE WITH MORE THAN ONE HANGING DIE

COMPONENT TERMINATIONS FOR SEMICONDUCTOR PACKAGES

PACKAGE DEVICES HAVING A BALL GRID ARRAY WITH SIDE WALL CONTACT PADS

PACKAGES OF STACKING INTEGRATED CIRCUITS

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC...

SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING REDUCED HEIGHT S...

EPLB/EWLB BASED POP FOR HBM OR CUSTOMIZED PACKAGE STACK

METHOD OF PRODUCING A LIGHTING DEVICE

OPTICAL FIBER CONNECTION ON PACKAGE EDGE

INTEGRATED CIRCUIT PACKAGE ASSEMBLIES INCLUDING A CHIP RECESS

INTEGRATED CIRCUIT PACKAGES INCLUDING AN OPTICAL REDISTRIBUTION LAYER

SEMICONDUCTOR PACKAGE HAVING A VARIABLE REDISTRIBUTION LAYER THICKNESS

VERTICAL WIRE CONNECTIONS FOR INTEGRATED CIRCUIT PACKAGE

WAFER LEVEL PACKAGE STRUCTURE WITH INTERNAL CONDUCTIVE LAYER

INTERPOSER WITH CONDUCTIVE ROUTING EXPOSED ON SIDEWALLS

System-in-Package Devices and Methods for Forming System-in-Package...

Electrical device and a method for forming an electrical device

PACKAGE STACKING USING CHIP TO WAFER BONDING

ELECTRONIC PACKAGE WITH COIL FORMED ON CORE

ADVANCED NODE COST REDUCTION BY ESD INTERPOSER

WEARABLE COMPUTING DEVICE

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

FLEXIBLE BAND WEARABLE ELECTRONIC DEVICE

FLEXIBLE BAND WEARABLE ELECTRONIC DEVICE