Klaus Pressel

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a semiconductor flip-chip package
- Patent number 11,393,742
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector block with two sorts of through connections, and electron...
- Patent number 10,217,695
- Issue date Feb 26, 2019
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips, semiconductor device and method...
- Patent number 9,601,475
- Issue date Mar 21, 2017
- INTEL DEUTSCHLAND GMBH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips, semiconductor device and method...
- Patent number 9,293,423
- Issue date Mar 22, 2016
- INTEL DEUTSCHLAND GMBH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with integrated antenna and method of formin...
- Patent number 8,952,521
- Issue date Feb 10, 2015
- Infineon Technologies AG
- Maciej Wojnowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips, semiconductor device and method...
- Patent number 8,779,563
- Issue date Jul 15, 2014
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method
- Patent number 8,779,583
- Issue date Jul 15, 2014
- Infineon Technologies AG
- Klaus Pressel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for routing electrical connections of semiconduct...
- Patent number 8,598,709
- Issue date Dec 3, 2013
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for routing electrical connections of semiconduct...
- Patent number 8,415,803
- Issue date Apr 9, 2013
- Infineon Technologies AG
- Thorsten Meyer
Information Patent Grant
Semiconductor device and manufacturing method
- Patent number 8,338,936
- Issue date Dec 25, 2012
- Infineon Technologies AG
- Klaus Pressel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure for electrostatic discharge in embedded wafer level packages
- Patent number 8,309,454
- Issue date Nov 13, 2012
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package
- Patent number 8,237,259
- Issue date Aug 7, 2012
- Infineon Technologies AG
- Klaus Pressel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a stacked die module
- Patent number 7,910,404
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Klaus Pressel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module including components in plastic casing
- Patent number 7,863,728
- Issue date Jan 4, 2011
- Infineon Technologies AG
- Gottfried Beer
- G01 - MEASURING TESTING
Information Patent Grant
Stacked semiconductor chips
- Patent number 7,858,440
- Issue date Dec 28, 2010
- Infineon Technologies AG
- Klaus Pressel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Singulating semiconductor wafers to form semiconductor chips
- Patent number 7,799,659
- Issue date Sep 21, 2010
- Infineon Technologies AG
- Klaus Pressel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module comprising components for microwave engineerin...
- Patent number 7,692,588
- Issue date Apr 6, 2010
- Infineon Technologies AG
- Gottfried Beer
- G01 - MEASURING TESTING
Information Patent Grant
Workpiece with semiconductor chips and molding, semiconductor devic...
- Patent number 7,687,895
- Issue date Mar 30, 2010
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for radio frequencies of more than 10 GHz and...
- Patent number 7,659,618
- Issue date Feb 9, 2010
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate with strip conductors formed of carbon nano...
- Patent number 7,504,711
- Issue date Mar 17, 2009
- Infineon Technologies AG
- Gottfried Beer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible rewiring plate for semiconductor components, and process f...
- Patent number 7,268,423
- Issue date Sep 11, 2007
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Fabricating a Semiconductor Flip-Chip Package
- Publication number 20200388561
- Publication date Dec 10, 2020
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector block with two sorts of through connections, and electron...
- Publication number 20170162476
- Publication date Jun 8, 2017
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...
- Publication number 20160163682
- Publication date Jun 9, 2016
- Intel Deutschland GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...
- Publication number 20140332937
- Publication date Nov 13, 2014
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages with Integrated Antenna and Method of Formin...
- Publication number 20140110840
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Maciej Wojnowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece with Semiconductor Chips, Semiconductor Device and Method...
- Publication number 20130228904
- Publication date Sep 5, 2013
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20120319304
- Publication date Dec 20, 2012
- INFINEON TECHNOLOGIES AG
- Klaus Pressel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED CHIP PACKAGE
- Publication number 20120287583
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Klaus Pressel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR ROUTING ELECTRICAL CONNECTIONS OF SEMICONDUCT...
- Publication number 20120049375
- Publication date Mar 1, 2012
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A STACKED DIE MODULE
- Publication number 20100062563
- Publication date Mar 11, 2010
- INFINEON TECHNOLOGIES AG
- Klaus Pressel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20100019370
- Publication date Jan 28, 2010
- INFINEON TECHNOLOGIES AG
- Klaus Pressel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED SEMICONDUCTOR CHIPS
- Publication number 20090079090
- Publication date Mar 26, 2009
- INFINEON TECHNOLOGIES AG
- Klaus Pressel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED CHIP PACKAGE
- Publication number 20080308917
- Publication date Dec 18, 2008
- INFINEON TECHNOLOGIES AG
- Klaus Pressel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Workpiece with Semiconductor Chips, Semiconductor Device and Method...
- Publication number 20080265383
- Publication date Oct 30, 2008
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module Including Components in Plastic Casing
- Publication number 20080105966
- Publication date May 8, 2008
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- G01 - MEASURING TESTING
Information Patent Application
SINGULATING SEMICONDUCTOR WAFERS TO FORM SEMICONDUCTOR CHIPS
- Publication number 20070293020
- Publication date Dec 20, 2007
- INFINEON TECHNOLOGIES AG
- Klaus Pressel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate with Strip Conductors and Production of Strip Conductors...
- Publication number 20070210883
- Publication date Sep 13, 2007
- Infineon Technologies AG
- Gottfried Beer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device for radio frequencies of more than 10 GHz and...
- Publication number 20070023896
- Publication date Feb 1, 2007
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module comprising components for microwave engineerin...
- Publication number 20070026567
- Publication date Feb 1, 2007
- Gottfried Beer
- G01 - MEASURING TESTING
Information Patent Application
Flexible rewiring plate for semiconductor components, and process f...
- Publication number 20050142933
- Publication date Jun 30, 2005
- Gottfried Beer
- B82 - NANO-TECHNOLOGY

Klaus Pressel

Person

Patents Grantslast 30 patents

Method for fabricating a semiconductor flip-chip package

Connector block with two sorts of through connections, and electron...

Workpiece with semiconductor chips, semiconductor device and method...

Workpiece with semiconductor chips, semiconductor device and method...

Semiconductor packages with integrated antenna and method of formin...

Workpiece with semiconductor chips, semiconductor device and method...

Semiconductor device and manufacturing method

Method and system for routing electrical connections of semiconduct...

Method and system for routing electrical connections of semiconduct...

Semiconductor device and manufacturing method

Structure for electrostatic discharge in embedded wafer level packages

Embedded chip package

Method of manufacturing a stacked die module

Semiconductor module including components in plastic casing

Stacked semiconductor chips

Singulating semiconductor wafers to form semiconductor chips

Semiconductor module comprising components for microwave engineerin...

Workpiece with semiconductor chips and molding, semiconductor devic...

Semiconductor device for radio frequencies of more than 10 GHz and...

Semiconductor substrate with strip conductors formed of carbon nano...

Flexible rewiring plate for semiconductor components, and process f...

Patents Applicationslast 30 patents

Method for Fabricating a Semiconductor Flip-Chip Package

Connector block with two sorts of through connections, and electron...

WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...

WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...

Semiconductor Packages with Integrated Antenna and Method of Formin...

Workpiece with Semiconductor Chips, Semiconductor Device and Method...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

EMBEDDED CHIP PACKAGE

METHOD AND SYSTEM FOR ROUTING ELECTRICAL CONNECTIONS OF SEMICONDUCT...

METHOD OF MANUFACTURING A STACKED DIE MODULE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

STACKED SEMICONDUCTOR CHIPS

EMBEDDED CHIP PACKAGE

Workpiece with Semiconductor Chips, Semiconductor Device and Method...

Semiconductor Module Including Components in Plastic Casing

SINGULATING SEMICONDUCTOR WAFERS TO FORM SEMICONDUCTOR CHIPS

Substrate with Strip Conductors and Production of Strip Conductors...

Semiconductor device for radio frequencies of more than 10 GHz and...

Semiconductor module comprising components for microwave engineerin...

Flexible rewiring plate for semiconductor components, and process f...