Kohei Toyama

Person

Fukushima-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for lapping or polishing semiconductor silicon...
- Patent number 6,387,809
- Issue date May 14, 2002
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B24 - GRINDING POLISHING
Information Patent Grant
Recovery of coolant and abrasive grains used in slicing semiconduct...
- Patent number 6,001,265
- Issue date Dec 14, 1999
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw cutting apparatus synchronizing workpiece feed speed with...
- Patent number 5,947,798
- Issue date Sep 7, 1999
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method for chamfering wafer with loose abrasive grains
- Patent number 5,944,584
- Issue date Aug 31, 1999
- Shin-Estu Handotai Co., Ltd.
- Kohei Toyama
- B24 - GRINDING POLISHING
Information Patent Grant
Method for slicing cylindrical workpieces by varying slurry conditi...
- Patent number 5,937,844
- Issue date Aug 17, 1999
- Shin-Etsu Handotai Co., Ltd.
- Etsuo Kiuchi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of manufacturing wire for use in a wire saw and wire for use...
- Patent number 5,927,131
- Issue date Jul 27, 1999
- Shin-Etsu Handotai Co., Ltd.
- Etsuo Kiuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor wafers
- Patent number 5,899,744
- Issue date May 4, 1999
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of slicing semiconductor single crystal ingot
- Patent number 5,875,769
- Issue date Mar 2, 1999
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
System for reusing oily slurry waste fluid
- Patent number 5,830,369
- Issue date Nov 3, 1998
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw cutting method synchronizing workpiece feed speed with wir...
- Patent number 5,810,643
- Issue date Sep 22, 1998
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw slicing apparatus and slicing method using the same
- Patent number 5,778,869
- Issue date Jul 14, 1998
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting fluid, method for production thereof, and method for cuttin...
- Patent number 5,693,596
- Issue date Dec 2, 1997
- Shin-Etsu Handotai Co., Ltd.
- Shingo Kaburagi
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Grant
Method of and an apparatus for slicing a single crystal ingot using...
- Patent number 5,313,741
- Issue date May 24, 1994
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw and slicing method using the same
- Patent number 5,269,285
- Issue date Dec 14, 1993
- Shin-Etsu Handotai Company, Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of using an ID saw slicing machine for slicing a single crys...
- Patent number 5,226,403
- Issue date Jul 13, 1993
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
Packaging bag for semiconductor wafer and method of packaging semic...
- Publication number 20020153526
- Publication date Oct 24, 2002
- Kohei Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR LAPPING OR POLISHING SEMICONDUCTOR SILICON...
- Publication number 20010008801
- Publication date Jul 19, 2001
- KOHEI TOYAMA
- B24 - GRINDING POLISHING

Kohei Toyama

Person

Patents Grantslast 30 patents

Method and apparatus for lapping or polishing semiconductor silicon...

Recovery of coolant and abrasive grains used in slicing semiconduct...

Wire saw cutting apparatus synchronizing workpiece feed speed with...

Apparatus and method for chamfering wafer with loose abrasive grains

Method for slicing cylindrical workpieces by varying slurry conditi...

Method of manufacturing wire for use in a wire saw and wire for use...

Method of manufacturing semiconductor wafers

Method of slicing semiconductor single crystal ingot

System for reusing oily slurry waste fluid

Wire saw cutting method synchronizing workpiece feed speed with wir...

Wire saw slicing apparatus and slicing method using the same

Cutting fluid, method for production thereof, and method for cuttin...

Method of and an apparatus for slicing a single crystal ingot using...

Wire saw and slicing method using the same

Method of using an ID saw slicing machine for slicing a single crys...

Patents Applicationslast 30 patents

Packaging bag for semiconductor wafer and method of packaging semic...

METHOD AND APPARATUS FOR LAPPING OR POLISHING SEMICONDUCTOR SILICON...