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Koichi Matsuno
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Fremont, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Three-dimensional memory device including low-k drain-select-level...
Patent number
11,871,580
Issue date
Jan 9, 2024
SanDisk Technologies LLC
Peng Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device including low-k drain-select-level...
Patent number
11,856,765
Issue date
Dec 26, 2023
SanDisk Technologies LLC
Koichi Matsuno
Information
Patent Grant
Bonded semiconductor die assembly containing through-stack via stru...
Patent number
11,587,920
Issue date
Feb 21, 2023
SanDisk Technologies LLC
Johann Alsmeier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device containing bit lines separated by air gaps and...
Patent number
11,387,142
Issue date
Jul 12, 2022
SanDisk Technologies LLC
Koichi Matsuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device including backside trench support s...
Patent number
11,380,707
Issue date
Jul 5, 2022
SanDisk Technologies LLC
Koichi Matsuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for removing a bulk substrate from a bonded assembly of wafers
Patent number
11,127,729
Issue date
Sep 21, 2021
SanDisk Technologies LLC
James Kai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional device with bonded structures including a support...
Patent number
10,985,169
Issue date
Apr 20, 2021
SanDisk Technologies LLC
James Kai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for removing a bulk substrate from a bonded assembly of wafers
Patent number
10,727,216
Issue date
Jul 28, 2020
SanDisk Technologies LLC
James Kai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE LINES AND MET...
Publication number
20240172431
Publication date
May 23, 2024
SANDISK TECHNOLOGIES LLC
James KAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL SUPPORT BRID...
Publication number
20240155841
Publication date
May 9, 2024
SANDISK TECHNOLOGIES LLC
Seyyed Ehsan Esfahani RASHIDI
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...
Publication number
20240057332
Publication date
Feb 15, 2024
SANDISK TECHNOLOGIES LLC
Koichi MATSUNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...
Publication number
20240057331
Publication date
Feb 15, 2024
SANDISK TECHNOLOGIES LLC
Koichi MATSUNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DEFORMATION RESISTANT TR...
Publication number
20230411306
Publication date
Dec 21, 2023
SANDISK TECHNOLOGIES LLC
Koichi MATSUNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH-STOP STRUCTURES AND...
Publication number
20230275026
Publication date
Aug 31, 2023
SANDISK TECHNOLOGIES LLC
Koichi MATSUNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING HAMMERHEAD-SHAPED WORD LI...
Publication number
20230246084
Publication date
Aug 3, 2023
SANDISK TECHNOLOGIES LLC
Adarsh RAJASHEKHAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED ETCH STOP RINGS F...
Publication number
20230240070
Publication date
Jul 27, 2023
SANDISK TECHNOLOGIES LLC
Kota FUNAYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED SEMICONDUCTOR DIE ASSEMBLY CONTAINING THROUGH-STACK VIA STRU...
Publication number
20230163116
Publication date
May 25, 2023
Johann Alsmeier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL...
Publication number
20220367499
Publication date
Nov 17, 2022
SANDISK TECHNOLOGIES LLC
Koichi MATSUNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL...
Publication number
20220367487
Publication date
Nov 17, 2022
SANDISK TECHNOLOGIES LLC
Peng ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH MULTIPLE TYPES OF SUPPORT PILL...
Publication number
20220352196
Publication date
Nov 3, 2022
SANDISK TECHNOLOGIES LLC
Kenichi SHIMOMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH FINNED SUPPORT PILLAR STRUCTUR...
Publication number
20220352091
Publication date
Nov 3, 2022
SANDISK TECHNOLOGIES LLC
Jixin YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH MULTIPLE TYPES OF SUPPORT PILL...
Publication number
20220352197
Publication date
Nov 3, 2022
SANDISK TECHNOLOGIES LLC
Koichi MATSUNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH MULTIPLE TYPES OF SUPPORT PILL...
Publication number
20220352093
Publication date
Nov 3, 2022
SANDISK TECHNOLOGIES LLC
Katsuo Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BRIDGES FOR ENHANCED STR...
Publication number
20220254728
Publication date
Aug 11, 2022
SANDISK TECHNOLOGIES LLC
Koichi MATSUNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING BACKSIDE TRENCH SUPPORT S...
Publication number
20220181348
Publication date
Jun 9, 2022
SANDISK TECHNOLOGIES LLC
Koichi MATSUNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED SEMICONDUCTOR DIE ASSEMBLY CONTAINING THROUGH-STACK VIA STRU...
Publication number
20220028846
Publication date
Jan 27, 2022
SANDISK TECHNOLOGIES LLC
Johann ALSMEIER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC ISOLATED VIA STRUCT...
Publication number
20210210503
Publication date
Jul 8, 2021
SANDISK TECHNOLOGIES LLC
Koichi MATSUNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR REMOVING A BULK SUBSTRATE FROM A BONDED ASSEMBLY OF WAFERS
Publication number
20200357783
Publication date
Nov 12, 2020
SANDISK TECHNOLOGIES LLC
James KAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL DEVICE WITH BONDED STRUCTURES INCLUDING A SUPPORT...
Publication number
20200286905
Publication date
Sep 10, 2020
SANDISK TECHNOLOGIES LLC
James KAI
H01 - BASIC ELECTRIC ELEMENTS