Koichi Matsuno

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded semiconductor die assembly containing through-stack via stru...
- Patent number 12,243,865
- Issue date Mar 4, 2025
- SanDisk Technologies, Inc.
- Johann Alsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing bridges for enhanced str...
- Patent number 12,148,710
- Issue date Nov 19, 2024
- SanDisk Technologies LLC
- Koichi Matsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with self-aligned etch stop rings f...
- Patent number 12,133,388
- Issue date Oct 29, 2024
- SanDisk Technologies LLC
- Kota Funayama
Information Patent Grant
Three-dimensional memory device with multiple types of support pill...
- Patent number 12,096,632
- Issue date Sep 17, 2024
- SanDisk Technologies LLC
- Koichi Matsuno
Information Patent Grant
Three-dimensional memory device with multiple types of support pill...
- Patent number 12,029,036
- Issue date Jul 2, 2024
- SanDisk Technologies LLC
- Kenichi Shimomura
Information Patent Grant
Three-dimensional memory device including low-k drain-select-level...
- Patent number 11,871,580
- Issue date Jan 9, 2024
- SanDisk Technologies LLC
- Peng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including low-k drain-select-level...
- Patent number 11,856,765
- Issue date Dec 26, 2023
- SanDisk Technologies LLC
- Koichi Matsuno
Information Patent Grant
Bonded semiconductor die assembly containing through-stack via stru...
- Patent number 11,587,920
- Issue date Feb 21, 2023
- SanDisk Technologies LLC
- Johann Alsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device containing bit lines separated by air gaps and...
- Patent number 11,387,142
- Issue date Jul 12, 2022
- SanDisk Technologies LLC
- Koichi Matsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including backside trench support s...
- Patent number 11,380,707
- Issue date Jul 5, 2022
- SanDisk Technologies LLC
- Koichi Matsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing a bulk substrate from a bonded assembly of wafers
- Patent number 11,127,729
- Issue date Sep 21, 2021
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device with bonded structures including a support...
- Patent number 10,985,169
- Issue date Apr 20, 2021
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing a bulk substrate from a bonded assembly of wafers
- Patent number 10,727,216
- Issue date Jul 28, 2020
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA ST...
- Publication number 20250079294
- Publication date Mar 6, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE ST...
- Publication number 20250081453
- Publication date Mar 6, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Yuya SANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE ST...
- Publication number 20250081458
- Publication date Mar 6, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Koichi MATSUNO
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...
- Publication number 20250014990
- Publication date Jan 9, 2025
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING WORD LINE CONTACT STRIPS AND METHODS OF FOR...
- Publication number 20240414917
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Mark D. KRAMAN
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL BRIDGE SUPPO...
- Publication number 20240395710
- Publication date Nov 28, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGE STRUCTURES...
- Publication number 20240386959
- Publication date Nov 21, 2024
- Western Digital Technologies, Inc.
- Jixin YU
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING TRENCH SUPPORT BRIDGE ST...
- Publication number 20240371789
- Publication date Nov 7, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...
- Publication number 20240373633
- Publication date Nov 7, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Mohan DUNGA
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...
- Publication number 20240373631
- Publication date Nov 7, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Koichi MATSUNO
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE DIELECTRIC ISO...
- Publication number 20240334695
- Publication date Oct 3, 2024
- SANDISK TECHNOLOGIES LLC
- Jixin YU
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL WORD LINE CO...
- Publication number 20240290714
- Publication date Aug 29, 2024
- SANDISK TECHNOLOGIES LLC
- Mark D. KRAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH INTEGRATED CONTACT AND SUPPORT...
- Publication number 20240276725
- Publication date Aug 15, 2024
- SANDISK TECHNOLOGIES LLC
- Adarsh RAJASHEKHAR
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH INTEGRATED CONTACT AND SUPPORT...
- Publication number 20240274191
- Publication date Aug 15, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HETEROJUNCTION SOURCE LA...
- Publication number 20240268115
- Publication date Aug 8, 2024
- SANDISK TECHNOLOGIES LLC
- Wei CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR CIRCUITS INCLUDING FRINGELESS TRANSISTORS AND METHOD OF...
- Publication number 20240258317
- Publication date Aug 1, 2024
- SANDISK TECHNOLOGIES LLC
- Kiyokazu SHISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...
- Publication number 20240250023
- Publication date Jul 25, 2024
- SANDISK TECHNOLOGIES LLC
- Ruogu Matthew ZHU
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...
- Publication number 20240251551
- Publication date Jul 25, 2024
- SANDISK TECHNOLOGIES LLC
- Ruogu Matthew ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED WORD LINE CONTACT...
- Publication number 20240237354
- Publication date Jul 11, 2024
- Kartik SONDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...
- Publication number 20240215243
- Publication date Jun 27, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masanori TSUTSUMI
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED WORD LINE CONTACT...
- Publication number 20240179916
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...
- Publication number 20240179906
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Naohiro HOSODA
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED WORD LINE CONTACT...
- Publication number 20240178140
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...
- Publication number 20240179905
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Takayuki MAEKURA
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE LINES AND MET...
- Publication number 20240172431
- Publication date May 23, 2024
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL SUPPORT BRID...
- Publication number 20240155841
- Publication date May 9, 2024
- SANDISK TECHNOLOGIES LLC
- Seyyed Ehsan Esfahani RASHIDI
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...
- Publication number 20240057332
- Publication date Feb 15, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...
- Publication number 20240057331
- Publication date Feb 15, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DEFORMATION RESISTANT TR...
- Publication number 20230411306
- Publication date Dec 21, 2023
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH-STOP STRUCTURES AND...
- Publication number 20230275026
- Publication date Aug 31, 2023
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS

Koichi Matsuno

Person

Patents Grantslast 30 patents

Bonded semiconductor die assembly containing through-stack via stru...

Three-dimensional memory device containing bridges for enhanced str...

Three-dimensional memory device with self-aligned etch stop rings f...

Three-dimensional memory device with multiple types of support pill...

Three-dimensional memory device with multiple types of support pill...

Three-dimensional memory device including low-k drain-select-level...

Three-dimensional memory device including low-k drain-select-level...

Bonded semiconductor die assembly containing through-stack via stru...

Semiconductor device containing bit lines separated by air gaps and...

Three-dimensional memory device including backside trench support s...

Method for removing a bulk substrate from a bonded assembly of wafers

Three-dimensional device with bonded structures including a support...

Method for removing a bulk substrate from a bonded assembly of wafers

Patents Applicationslast 30 patents

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA ST...

THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE ST...

THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE ST...

THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...

MEMORY DEVICE INCLUDING WORD LINE CONTACT STRIPS AND METHODS OF FOR...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL BRIDGE SUPPO...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGE STRUCTURES...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING TRENCH SUPPORT BRIDGE ST...

THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...

THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE DIELECTRIC ISO...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL WORD LINE CO...

THREE-DIMENSIONAL MEMORY DEVICE WITH INTEGRATED CONTACT AND SUPPORT...

THREE-DIMENSIONAL MEMORY DEVICE WITH INTEGRATED CONTACT AND SUPPORT...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HETEROJUNCTION SOURCE LA...

TRANSISTOR CIRCUITS INCLUDING FRINGELESS TRANSISTORS AND METHOD OF...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...

THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED WORD LINE CONTACT...

THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...

THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED WORD LINE CONTACT...

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...

THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED WORD LINE CONTACT...

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE LINES AND MET...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL SUPPORT BRID...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DEFORMATION RESISTANT TR...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH-STOP STRUCTURES AND...