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Koichi YAJIMA

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    FIXING COMPONENT
    • Publication number 20220356895
    • Publication date Nov 10, 2022
    • NIPPON ALEPH CO., LTD.
    • Eiichi KOSUGE
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Application

    PUSH SWITCH
    • Publication number 20220328267
    • Publication date Oct 13, 2022
    • NIPPON ALEPH CO., LTD.,
    • Koichi YAJIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FALL DETECTION SENSOR
    • Publication number 20220285113
    • Publication date Sep 8, 2022
    • NIPPON ALEPH CO., LTD.
    • Koichi YAJIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ROTATION ANGLE DETECTION SENSOR
    • Publication number 20220254588
    • Publication date Aug 11, 2022
    • NIPPON ALEPH CO., LTD.,
    • Koichi YAJIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EARPHONE DEVICE AND SOUND-REPRODUCING SYSTEM USING THE SAME
    • Publication number 20170188131
    • Publication date Jun 29, 2017
    • FOSTER ELECTRIC CO., LTD.
    • Koichi YAJIMA
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SWITCH-CONTAINING CABLE
    • Publication number 20170178839
    • Publication date Jun 22, 2017
    • FOSTER ELECTRIC CO., LTD.
    • Koichi YAJIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Water jet processing method
    • Publication number 20050196940
    • Publication date Sep 8, 2005
    • Koichi Yajima
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Flat-object holder and method of using the same
    • Publication number 20050085171
    • Publication date Apr 21, 2005
    • Yuzo Shimobeppu
    • B24 - GRINDING POLISHING
  • Information Patent Application

    Method for manufacturing semiconductor chip
    • Publication number 20040259332
    • Publication date Dec 23, 2004
    • Masateru Fukuoka
    • B24 - GRINDING POLISHING
  • Information Patent Application

    Method for manufacturing semiconductor chip
    • Publication number 20040192012
    • Publication date Sep 30, 2004
    • Kouji Takezoe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Ic chip manufacturing method
    • Publication number 20040185639
    • Publication date Sep 23, 2004
    • Masateru Fukuoka
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Wafer support plate
    • Publication number 20040124413
    • Publication date Jul 1, 2004
    • Kazuhisa Arai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor wafer protective member and semiconductor wafer grind...
    • Publication number 20040097053
    • Publication date May 20, 2004
    • Koichi Yajima
    • B24 - GRINDING POLISHING
  • Information Patent Application

    Production method for semiconductor chip
    • Publication number 20040048419
    • Publication date Mar 11, 2004
    • Masahiko Kitamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Flat-object holder and method of using the same
    • Publication number 20030077993
    • Publication date Apr 24, 2003
    • Yuzo Shimobeppu
    • B24 - GRINDING POLISHING