Koji Bando

Person

  • Hyogo, JP

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE

    • Publication number 20200144147
    • Publication date May 7, 2020
    • RENESAS ELECTRONICS CORPORATION
    • Kuniharu MUTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20190067251
    • Publication date Feb 28, 2019
    • Renesas Electronics Corporation
    • Koji Bando
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE

    • Publication number 20190006258
    • Publication date Jan 3, 2019
    • RENESAS ELECTRONICS CORPORATION
    • Kuniharu MUTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20180337158
    • Publication date Nov 22, 2018
    • Renesas Electronics Corporation
    • Koji Bando
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20180331002
    • Publication date Nov 15, 2018
    • RENESAS ELECTRONICS CORPORATION
    • Koji BANDO
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20180241319
    • Publication date Aug 23, 2018
    • RENESAS ELECTRONICS CORPORATION
    • Koji BANDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE

    • Publication number 20180138828
    • Publication date May 17, 2018
    • RENESAS ELECTRONICS CORPORATION
    • Kuniharu MUTO
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20180122767
    • Publication date May 3, 2018
    • RENESAS ELECTRONICS CORPORATION
    • Koji Bando
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20180047649
    • Publication date Feb 15, 2018
    • RENESAS ELECTRONICS CORPORATION
    • Koji BANDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

    • Publication number 20170103940
    • Publication date Apr 13, 2017
    • RENESAS ELECTRONICS CORPORATION
    • Akira MUTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20170033710
    • Publication date Feb 2, 2017
    • RENESAS ELECTRONICS CORPORATION
    • Kuniharu MUTO
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20160163615
    • Publication date Jun 9, 2016
    • RENESAS ELECTRONICS CORPORATION
    • Kazuhiro MITAMURA
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

    • Publication number 20160148859
    • Publication date May 26, 2016
    • Renesas Electronics Corporation
    • Akira MUTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

    • Publication number 20160064312
    • Publication date Mar 3, 2016
    • Renesas Electronics Corporation
    • Koji Bando
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

    • Publication number 20120309131
    • Publication date Dec 6, 2012
    • Renesas Electronics Corporation
    • KOJI BANDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

    • Publication number 20100164077
    • Publication date Jul 1, 2010
    • RENESAS TECHNOLOGY CORP.
    • Koji Bando
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE, INTERPOSER CHIP AND MANUFACTURING METHOD OF S...

    • Publication number 20070170573
    • Publication date Jul 26, 2007
    • Soshi KURODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Resin-sealed semiconductor device

    • Publication number 20050082689
    • Publication date Apr 21, 2005
    • Mitsubishi Denki Kabushiki Kaisha
    • Koji Bando
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device and method for manufacture thereof

    • Publication number 20040159925
    • Publication date Aug 19, 2004
    • RENESAS TECHNOLOGY CORP.
    • Tetsuya Matsuura
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    ELECTRONIC ELEMENT

    • Publication number 20040047135
    • Publication date Mar 11, 2004
    • Mitsubishi Denki Kabushiki Kaisha
    • Koji Bando
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20030214050
    • Publication date Nov 20, 2003
    • Mitsubishi Denki Kabushiki Kaisha
    • Koji Bando
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Resin-sealed semiconductor device

    • Publication number 20030201546
    • Publication date Oct 30, 2003
    • Mitsubishi Denki Kabushiki Kaisha
    • Koji Bando
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Design support apparatus for semiconductor devices

    • Publication number 20030192019
    • Publication date Oct 9, 2003
    • Mitsubishi Denki Kabushiki Kaisha
    • Akihiro Goto
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Resin-sealed chip stack type semiconductor device

    • Publication number 20010035587
    • Publication date Nov 1, 2001
    • Mitsubishi Denki Kabushiki Kaisha
    • Takashi Kondo
    • H01 - BASIC ELECTRIC ELEMENTS