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Koji Imayoshi
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of dicing wiring substrate, and packaging substrate
Patent number
11,081,368
Issue date
Aug 3, 2021
Toppan Printing Co., Ltd.
Koji Imayoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
Patent number
11,006,516
Issue date
May 11, 2021
Toppan Printing Co., Ltd.
Koji Imayoshi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring circuit substrate, semiconductor device, method of producing...
Patent number
10,790,209
Issue date
Sep 29, 2020
Toppan Printing Co., Ltd.
Koji Imayoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of dicing wiring substrate, and packaging substrate
Patent number
10,679,865
Issue date
Jun 9, 2020
Toppan Printing Co., Ltd.
Koji Imayoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposers, semiconductor devices, method for manufacturing interp...
Patent number
10,056,322
Issue date
Aug 21, 2018
Toppan Printing Co., Ltd.
Koji Imayoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrode substrate and reflection type liquid crystal display devi...
Patent number
6,483,562
Issue date
Nov 19, 2002
Toppan Printing Co., Ltd.
Kenzo Fukuyoshi
G02 - OPTICS
Information
Patent Grant
Electrode plate having transparent type or reflective type multi-la...
Patent number
6,249,082
Issue date
Jun 19, 2001
Toppan Printing Co., Ltd.
Kenzo Fukuyoshi
G02 - OPTICS
Information
Patent Grant
Multilayered conductive film, and transparent electrode substrate a...
Patent number
5,667,853
Issue date
Sep 16, 1997
Toppan Printing Co., Ltd.
Kenzo Fukuyoshi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...
Publication number
20200275548
Publication date
Aug 27, 2020
Toppan Printing Co.,Ltd.
Koji IMAYOSHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF DICING WIRING SUBSTRATE, AND PACKAGING SUBSTRATE
Publication number
20200266077
Publication date
Aug 20, 2020
Toppan Printing Co., Ltd.
Koji IMAYOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF DICING WIRING SUBSTRATE, AND PACKAGING SUBSTRATE
Publication number
20190304804
Publication date
Oct 3, 2019
Toppan Printing Co., Ltd.
Koji IMAYOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING CIRCUIT SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD OF PRODUCING...
Publication number
20180166354
Publication date
Jun 14, 2018
Toppan Printing Co., Ltd.
Koji IMAYOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING...
Publication number
20170250141
Publication date
Aug 31, 2017
Toppan Printing Co., Ltd.
Koji IMAYOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSERS, SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURING INTERP...
Publication number
20170018492
Publication date
Jan 19, 2017
Toppan Printing Co., Ltd.
Koji IMAYOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for manufacturing electrode plate having transparent type or...
Publication number
20010026120
Publication date
Oct 4, 2001
Kenzo Fukuyoshi
G02 - OPTICS