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Ibaraki-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Operation plan creation device, operation plan creation method, and...
Patent number
10,466,672
Issue date
Nov 5, 2019
Mitsubishi Heavy Industries, Ltd.
Naoya Kawamura
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Solder, and mounted components using the same
Patent number
7,829,199
Issue date
Nov 9, 2010
NEC Corporation
Takuo Funaya
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package board using a metal base
Patent number
7,696,007
Issue date
Apr 13, 2010
NEC Corporation
Katsumi Kikuchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package board using a metal base
Patent number
7,585,699
Issue date
Sep 8, 2009
NEC Corporation
Katsumi Kikuchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component unit
Patent number
7,352,069
Issue date
Apr 1, 2008
Nitto Denko Corporation
Ichiro Hazeyama
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Interconnecting substrate for carrying semiconductor device, method...
Patent number
7,338,884
Issue date
Mar 4, 2008
NEC Corporation
Tadanori Shimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnecting substrate for carrying semiconductor device, method...
Patent number
6,861,757
Issue date
Mar 1, 2005
NEC Corporation
Tadanori Shimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package board using a metal base
Patent number
6,841,862
Issue date
Jan 11, 2005
NEC Corporation
Katsumi Kikuchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device assembly and a method of connecting electronic de...
Patent number
6,798,070
Issue date
Sep 28, 2004
NEC Corporation
Takuo Funaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component
Patent number
6,674,016
Issue date
Jan 6, 2004
Nitto Denko Corporation
Masahiro Kubo
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Electronic device assembly and a method of connecting electronic de...
Patent number
6,576,499
Issue date
Jun 10, 2003
NEC Corporation
Takuo Funaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Supporting substrate for a semiconductor bare chip
Patent number
6,515,869
Issue date
Feb 4, 2003
NEC Corporation
Takuo Funaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thin film resistor and method for forming the same
Patent number
6,466,124
Issue date
Oct 15, 2002
NEC Corporation
Akinobu Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin laminated wiring sheet, wiring structure using the same, and...
Patent number
6,444,403
Issue date
Sep 3, 2002
NEC Corporation
Tadanori Shimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Carrier film and process for producing the same
Patent number
6,333,136
Issue date
Dec 25, 2001
NEC Corporation
Tadanori Shimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin-film resistor, wiring substrate, and method for manufacturing...
Patent number
6,331,811
Issue date
Dec 18, 2001
NEC Corporation
Akinobu Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin film capacitor formed in via
Patent number
6,278,153
Issue date
Aug 21, 2001
NEC Corporation
Katsumi Kikuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alkali or acid corrodible organic or composite particles in resin m...
Patent number
6,232,398
Issue date
May 15, 2001
NEC Corporation
Yoshitsugu Funada
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Semiconductor carrier and method for manufacturing the same
Patent number
6,204,565
Issue date
Mar 20, 2001
NEC Corporation
Tadanori Shimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier film and process for producing the same
Patent number
6,156,414
Issue date
Dec 5, 2000
NEC Corporation
Tadanori Shimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming electrically conductive wiring pattern
Patent number
6,150,074
Issue date
Nov 21, 2000
NEC Corporation
Tadanori Shimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of thermocompression bonding a supporting substrate to a sem...
Patent number
6,042,682
Issue date
Mar 28, 2000
NEC Corporation
Takuo Funaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a tab semiconductor device
Patent number
5,972,739
Issue date
Oct 26, 1999
NEC Corporation
Yoshitsugu Funada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer wiring structure
Patent number
5,889,233
Issue date
Mar 30, 1999
NEC Corporation
Tadanori Shimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection structures and method of making same
Patent number
5,830,563
Issue date
Nov 3, 1998
NEC Corporation
Tadanori Shimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device with passivation layer of benzocyclobutene pol...
Patent number
5,712,506
Issue date
Jan 27, 1998
NEC Corporation
Tadanori Shimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed wiring board and method for preparing the same
Patent number
5,681,648
Issue date
Oct 28, 1997
NEC Corporation
Yoshitsugu Funada
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of bonding circuit boards
Patent number
5,545,281
Issue date
Aug 13, 1996
NEC Corporation
Koji Matsui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer printed circuit board
Patent number
5,483,101
Issue date
Jan 9, 1996
NEC Corporation
Tadanori Shimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of connecting an integrated circuit chip to a substrate
Patent number
5,384,952
Issue date
Jan 31, 1995
NEC Corporation
Koji Matsui
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
OPERATION PLAN CREATION DEVICE, OPERATION PLAN CREATION METHOD, AND...
Publication number
20150378338
Publication date
Dec 31, 2015
Mitsubishi Heavy Industries, Ltd.
Naoya KAWAMURA
G05 - CONTROLLING REGULATING
Information
Patent Application
SEMICONDUCTOR PACKAGE BOARD USING A METAL BASE
Publication number
20090162974
Publication date
Jun 25, 2009
NEC CORPORATION
Katsumi Kikuchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Solder, and Mounted Components Using the Same
Publication number
20080026240
Publication date
Jan 31, 2008
Takuo Funaya
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor package board using a metal base
Publication number
20060244137
Publication date
Nov 2, 2006
NEC Corporation
Katsumi Kikuchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic component unit
Publication number
20060103028
Publication date
May 18, 2006
Nitto Denko Corporation
Ichiro Hazeyama
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Interconnecting substrate for carrying semiconductor device, method...
Publication number
20050130413
Publication date
Jun 16, 2005
NEC Corporation
Tadanori Shimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor package board using a metal base
Publication number
20050098875
Publication date
May 12, 2005
NEC Corporation
Katsumi Kikuchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic component
Publication number
20030116347
Publication date
Jun 26, 2003
NITTO DENKO CORPORATION
Masahiro Kubo
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Method for manufacturing flexible printed circuit and flexible prin...
Publication number
20030064147
Publication date
Apr 3, 2003
NITTO DENKO CORPORATION
Hirofumi Fujii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Interconnecting substrate for carrying semiconductor device, method...
Publication number
20030045024
Publication date
Mar 6, 2003
Tadanori Shimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUPPORTING SUBSTRATE TO BE BONDED WITH SEMICONDUCTOR BARE CHIP AND...
Publication number
20020092610
Publication date
Jul 18, 2002
TAKUO FUNAYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic device assembly and a method of connecting electronic de...
Publication number
20020042164
Publication date
Apr 11, 2002
NEC Corporation
Takuo Funaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thin-film resistor, wiring substrate, and method for manufacturing...
Publication number
20020030577
Publication date
Mar 14, 2002
AKINOBU SHIBUYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wiring board for high dense mounting and method of producing the same
Publication number
20020024138
Publication date
Feb 28, 2002
NEC Corporation
Tadanori Shimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thin film capacitor avoiding short circuit between electrodes
Publication number
20020020836
Publication date
Feb 21, 2002
NEC Corporation
Katsumi Kikuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package board using a metal base
Publication number
20020001937
Publication date
Jan 3, 2002
NEC Corporation
Katsumi Kikuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN-FILM RESISTOR, WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING...
Publication number
20010019301
Publication date
Sep 6, 2001
AKINOBU SHIBUYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded resin composition exhibiting good adhesion to conductive mat...
Publication number
20010011111
Publication date
Aug 2, 2001
NEC Corporation
Yoshitsugu Funada
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Electronic device assembly and a method of connecting electronic de...
Publication number
20010003656
Publication date
Jun 14, 2001
Takuo Funaya
H01 - BASIC ELECTRIC ELEMENTS