Number | Date | Country | Kind |
---|---|---|---|
10-162091 | Jun 1998 | JP |
Number | Name | Date | Kind |
---|---|---|---|
4769399 | Schenz | Sep 1988 |
Number | Date | Country |
---|---|---|
59-22393 | Feb 1984 | JP |
3-177034 | Aug 1991 | JP |
4-292611 | Oct 1992 | JP |
4-337380 | Nov 1992 | JP |
5-11452 | Jan 1993 | JP |
5-11451 | Jan 1993 | JP |
5-259223 | Oct 1993 | JP |
5-327224 | Dec 1993 | JP |
6-19134 | Jan 1994 | JP |
6-27660 | Feb 1994 | JP |
6-334343 | Dec 1994 | JP |
9-116267 | May 1997 | JP |
9-214141 | Aug 1997 | JP |
9-219590 | Aug 1997 | JP |
Entry |
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Abstract—pub-No. SU 598916A, Derwent database, Feb. 1978, one page, Akutin et al.* |
1996 Electronic Components and Technology Conference pp. 727-732, “Development of Molded Fine-Pitch Ball Grid Array (FPBGA) Using Through-Hole Bonding Process”, Matsuda et al. |