Kojiro Nakamura

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer separating apparatus and wafer separating method
- Patent number 9,190,301
- Issue date Nov 17, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Michirou Yoshino
- B32 - LAYERED PRODUCTS
Information Patent Grant
Mounting structure and mounting method
- Patent number 8,080,884
- Issue date Dec 20, 2011
- Panasonic Corporation
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly and fabrication method therefor
- Patent number 8,035,225
- Issue date Oct 11, 2011
- Panasonic Corporation
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLID ELECTROLYTIC CAPACITOR
- Publication number 20240428998
- Publication date Dec 26, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- FUMIYA MIYAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SEPARATING APPARATUS AND WAFER SEPARATING METHOD
- Publication number 20140130986
- Publication date May 15, 2014
- PANASONIC CORPORATION
- MICHIROU YOSHINO
- B32 - LAYERED PRODUCTS
Information Patent Application
MOUNTING STRUCTURE AND MOUNTING METHOD
- Publication number 20090321926
- Publication date Dec 31, 2009
- Panasonic Corporation
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Assembly And Fabrication Method Therefor
- Publication number 20080150133
- Publication date Jun 26, 2008
- Matsushita Electric Industrial Co., Ltd.
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS