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Patents Grantslast 30 patents

Information Patent Grant
Method for bonding wafers, and a wafer
- Patent number 12,202,725
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Konsta Hannula
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...
- Publication number 20240409398
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING WAFERS, AND A WAFER
- Publication number 20220289567
- Publication date Sep 15, 2022
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY