Koo Hwa Lee

Person

Kyongsangbuk-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with support structure and meth...
- Patent number 9,768,102
- Issue date Sep 19, 2017
- STATS ChipPAC Pte. Ltd.
- Dong Ju Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with bonding lands
- Patent number 8,710,675
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin package system with external terminals and method of manufactu...
- Patent number 8,481,371
- Issue date Jul 9, 2013
- Stats Chippac Ltd.
- Youngcheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with L-shaped leadfingers
- Patent number 8,471,374
- Issue date Jun 25, 2013
- Stats Chippac Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable multi-chip package system
- Patent number 8,432,026
- Issue date Apr 30, 2013
- Stats Chippac Ltd.
- Koo Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-stacking module system
- Patent number 8,410,594
- Issue date Apr 2, 2013
- Stats Chippac Ltd.
- Kwang Soon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system with substrate heat sink
- Patent number 8,125,076
- Issue date Feb 28, 2012
- Stats Chippac Ltd.
- Gwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system for package stacking and manufact...
- Patent number 8,067,272
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with internal stacking module adh...
- Patent number 8,026,582
- Issue date Sep 27, 2011
- Stats Chippac Ltd.
- Myung Kil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package system
- Patent number 8,012,867
- Issue date Sep 6, 2011
- Stats Chippac Ltd.
- Koo Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin package system with external terminals
- Patent number 7,947,535
- Issue date May 24, 2011
- Stats Chippac Ltd.
- Youngcheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with base structure device
- Patent number 7,915,724
- Issue date Mar 29, 2011
- Stats Chippac Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable multi-chip package system with support structure
- Patent number 7,915,738
- Issue date Mar 29, 2011
- Stats Chippac Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip interconnection
- Patent number 7,736,950
- Issue date Jun 15, 2010
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing structural support
- Patent number 7,683,467
- Issue date Mar 23, 2010
- Stats Chippac Ltd.
- Byoung Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable multi-chip package system with support structure
- Patent number 7,645,638
- Issue date Jan 12, 2010
- Stats Chippac Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system for package stacking and manufact...
- Patent number 7,622,333
- Issue date Nov 24, 2009
- Stats Chippac Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip package system
- Patent number 7,521,297
- Issue date Apr 21, 2009
- Stats Chippac Ltd.
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic semiconductor package
- Patent number 6,661,083
- Issue date Dec 9, 2003
- ChipPAC, Inc.
- Sang D. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorescent screen of color CRT and fabricating method thereof
- Patent number 6,614,160
- Issue date Sep 2, 2003
- LG Electronics Inc.
- Koo Hwa Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming an Interposer Including...
- Publication number 20150001741
- Publication date Jan 1, 2015
- STATS ChipPAC, Ltd.
- Koo Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METH...
- Publication number 20130249078
- Publication date Sep 26, 2013
- Dong Ju Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN PACKAGE SYSTEM WITH EXTERNAL TERMINALS AND METHOD OF MANUFACTU...
- Publication number 20110215456
- Publication date Sep 8, 2011
- Youngcheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MULTI-CHIP PACKAGE SYSTEM WITH SUPPORT STRUCTURE
- Publication number 20100052117
- Publication date Mar 4, 2010
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND MANUFACT...
- Publication number 20100038768
- Publication date Feb 18, 2010
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE ADH...
- Publication number 20090194867
- Publication date Aug 6, 2009
- Myung Kil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BASE STRUCTURE DEVICE
- Publication number 20090085178
- Publication date Apr 2, 2009
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip interconnection
- Publication number 20090045507
- Publication date Feb 19, 2009
- STATS ChipPAC Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package system employing structural support
- Publication number 20080135989
- Publication date Jun 12, 2008
- STATS ChipPAC Ltd.
- Byoung Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MULTI-CHIP PACKAGE SYSTEM
- Publication number 20080029867
- Publication date Feb 7, 2008
- STATS ChipPAC Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MULTI-CHIP PACKAGE SYSTEM
- Publication number 20080029868
- Publication date Feb 7, 2008
- STATS ChipPAC Ltd.
- Koo Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MULTI-CHIP PACKAGE SYSTEM WITH SUPPORT STRUCTURE
- Publication number 20080029866
- Publication date Feb 7, 2008
- STATS ChipPAC Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGE SYSTEM
- Publication number 20070216007
- Publication date Sep 20, 2007
- STATS ChipPAC Ltd.
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH L-SHAPED LEADFINGERS
- Publication number 20070194463
- Publication date Aug 23, 2007
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING LANDS
- Publication number 20070194462
- Publication date Aug 23, 2007
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE SYSTEM
- Publication number 20070178667
- Publication date Aug 2, 2007
- STATS ChipPAC Ltd.
- Koo Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inter-stacking module system
- Publication number 20070158858
- Publication date Jul 12, 2007
- STATS ChipPAC Ltd.
- Kwang Soon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Color cathode ray tube
- Publication number 20040095056
- Publication date May 20, 2004
- Sang Mun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic semiconductor package
- Publication number 20020163015
- Publication date Nov 7, 2002
- ChipPAC, Inc.
- Sang D. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Panel and implosion proof glass of flat color CRT and method for bo...
- Publication number 20020074933
- Publication date Jun 20, 2002
- LG Electronics Inc.
- Koo Hwa Lee
- C03 - GLASS MINERAL OR SLAG WOOL

Koo Hwa Lee

Person

Patents Grantslast 30 patents

Integrated circuit packaging system with support structure and meth...

Integrated circuit package system with bonding lands

Thin package system with external terminals and method of manufactu...

Integrated circuit package system with L-shaped leadfingers

Stackable multi-chip package system

Inter-stacking module system

Semiconductor package system with substrate heat sink

Integrated circuit package system for package stacking and manufact...

Integrated circuit package system with internal stacking module adh...

Wafer level chip scale package system

Thin package system with external terminals

Integrated circuit packaging system with base structure device

Stackable multi-chip package system with support structure

Flip chip interconnection

Integrated circuit package system employing structural support

Stackable multi-chip package system with support structure

Integrated circuit package system for package stacking and manufact...

Multichip package system

Plastic semiconductor package

Fluorescent screen of color CRT and fabricating method thereof

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming an Interposer Including...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METH...

THIN PACKAGE SYSTEM WITH EXTERNAL TERMINALS AND METHOD OF MANUFACTU...

STACKABLE MULTI-CHIP PACKAGE SYSTEM WITH SUPPORT STRUCTURE

INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND MANUFACT...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE ADH...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BASE STRUCTURE DEVICE

Flip chip interconnection

Integrated circuit package system employing structural support

STACKABLE MULTI-CHIP PACKAGE SYSTEM

STACKABLE MULTI-CHIP PACKAGE SYSTEM

STACKABLE MULTI-CHIP PACKAGE SYSTEM WITH SUPPORT STRUCTURE

MULTICHIP PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH L-SHAPED LEADFINGERS

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING LANDS

WAFER LEVEL CHIP SCALE PACKAGE SYSTEM

Inter-stacking module system

Color cathode ray tube

Plastic semiconductor package

Panel and implosion proof glass of flat color CRT and method for bo...