INTEGRATED CIRCUIT PACKAGE SYSTEM WITH L-SHAPED LEADFINGERS

Abstract

An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first L-shaped leadfingers adjacent the single edge, connecting the die pads and the first L-shaped leadfingers, and encapsulating the die pads and portions of the first L-shaped leadfingers to form a first package.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view, taken from FIG. 4 along a line segment 1-1, of an integrated circuit package system in an embodiment of the present invention;

FIG. 2 a cross-sectional view of an integrated circuit package system in an alternative embodiment of the present invention;

FIG. 3 is a top plan view of the integrated circuit package system;

FIG. 4 is a bottom plan view of the integrated circuit package system;

FIG. 5 is a cross-sectional view of an integrated circuit package system in another alternative embodiment of the present invention;

FIG. 6 is a cross-sectional view of package stacking with the integrated circuit package system of FIG. 1 or 2 using wire interconnection in another alternative embodiment of the present invention;

FIG. 7 is a cross-sectional view of an integrated circuit package system in another alternative embodiment of the present invention;

FIG. 8 is a cross-sectional view of package stacking with the integrated circuit package system of FIG. 7 using solder paste or conductive material in another alternative embodiment of the present invention;

FIG. 9 is a top plan view of the integrated circuit package system;

FIG. 10 is a bottom plan view of the integrated circuit package system;

FIG. 11 is a cross-sectional view of the integrated circuit package system in a first coverlay attach phase;

FIG. 12 is the structure of FIG. 1 in a first die attach phase;

FIG. 13 is the structure of FIG. 12 in a first die connect phase;

FIG. 14 is the structure of FIG. 13 in a second die attach phase;

FIG. 15 is the structure of FIG. 14 in a second coverlay attach phase;

FIG. 16 is the structure of FIG. 15 in a first detape and turn over phase;

FIG. 17 is the structure of FIG. 16 in a second die connect phase;

FIG. 18 is the structure of FIG. 17 in a mold and plastic mold compound (PMC) phase;

FIG. 19 is the structure of FIG. 18 in a second detape phase;

FIG. 20 is the structure of FIG. 19 in an optional plating and singulation phase;

FIG. 21 is a cross-sectional view of package stacking with the integrated circuit package system of FIG. 5 in another alternative embodiment of the present invention;

FIG. 22 is a cross-sectional view of package stacking with the integrated circuit package system of FIG. 20 using wire interconnection in another alternative embodiment of the present invention; and

FIG. 23 is a flow chart of an integrated circuit package system for manufacturing the integrated circuit package system in an embodiment of the present invention.

Claims

1. An integrated circuit package system comprising: providing a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die;forming first L-shaped leadfingers adjacent the single edge;connecting the die pads and the first L-shaped leadfingers; andencapsulating the die pads and a portion of the first L-shaped leadfingers to form a first package.

2. The system as claimed in claim 1 further comprising: providing a second integrated circuit die having second die pads only adjacent a single edge of the second integrated circuit die;attaching the second integrated circuit die over the first integrated circuit die having the die pads of the first integrated circuit die exposed;forming second L-shaped leadfingers adjacent the single edge of the second integrated circuit die;connecting the second die pads and the second L-shaped leadfingers; andwherein encapsulating includes:encapsulating the second die pads and portions of the second L-shaped leadfingers.

3. The system as claimed in claim 1 further comprising: providing a second integrated circuit die having second die pads only adjacent a single edge of the second integrated circuit die;attaching the second integrated circuit die over the first integrated circuit die with the die pads of the first integrated circuit die exposed;forming second L-shaped leadfingers adjacent the single edge of the second integrated circuit die and adjacent or intermixed with the first L-shaped leadfingers;connecting the second die pads and the second L-shaped leadfingers; and

4. The system as claimed in claim 1 further comprising: providing a second integrated circuit die having second die pads only adjacent a single edge of the second integrated circuit die;forming second L-shaped leadfingers adjacent the single edge of the second integrated circuit die;connecting the second die pads and the second L-shaped leadfingers;encapsulating the second die pads and portions of the second L-shaped leadfingers to form a second package; andstacking the second package over the first package with the first L-shaped leadfingers and the second L-shaped leadfingers electrically connected.

5. The system as claimed in claim 1 further comprising: providing a base substrate;providing a second integrated circuit die having second die pads only adjacent a single edge of the second integrated circuit die;forming second L-shaped leadfingers adjacent the single edge of the second integrated circuit die;connecting the second die pads and the second L-shaped leadfingers;encapsulating the second die pads and portions of the second L-shaped leadfingers to form a second package;stacking the second package over the first package with the first L-shaped leadfingers and the second L-shaped leadfingers electrically connected to the base substrate; and

6. An integrated circuit package system comprising: forming a first integrated circuit die having die pads on a first die active surface only adjacent a single edge of the first integrated circuit die;forming a leadframe having first L-shaped leadfingers adjacent the single edge;electrically connecting the die pads to the first L-shaped leadfingers; andencapsulating a portion of the first integrated circuit die, the die pads, and portions of the first L-shaped leadfingers to form a first package.

7. The system as claimed in claim 6 further comprising: providing a second integrated circuit die having a second die back surface; andattaching the second die back surface over the first die active surface, the second integrated circuit die having an offset from the first integrated circuit die with the die pads exposed adjacent the second integrated circuit die.

8. The system as claimed in claim 6 further comprising: providing a second integrated circuit die having second die pads and a second die active surface; andattaching the second die active surface over the first die active surface, the second integrated circuit die having an offset from the first integrated circuit die with the second die pads exposed adjacent the first integrated circuit die.

9. The system as claimed in claim 6 further comprising: providing a second integrated circuit die having second die pads; andattaching the second integrated circuit die over the first integrated circuit die having the second die pads on a side opposite the die pads.

10. The system as claimed in claim 6 further comprising: providing a second integrated circuit die having second die pads; andattaching the second integrated circuit die over the first integrated circuit die having the second die pads on a same side as the die pads.

11. An integrated circuit package system comprising: a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die;first L-shaped leadfingers adjacent the single edge, the first L-shaped leadfingers connected to the die pads; anda first package having the die pads and portions of the first L-shaped leadfingers encapsulated.

12. The system as claimed in claim 11 further comprising: a second integrated circuit die having second die pads only adjacent a single edge of the second integrated circuit die, the second integrated circuit die over the first integrated circuit die having the die pads exposed;second L-shaped leadfingers adjacent the single edge of the second integrated circuit die having the second die pad and the second L-shaped leadfingers connected; and

13. The system as claimed in claim 11 further comprising: a second integrated circuit die having second die pads only adjacent a single edge of the second integrated circuit die, the second integrated circuit die over the first integrated circuit die with the die pads exposed;second L-shaped leadfingers adjacent the single edge of the second integrated circuit die and adjacent or intermixed with the first L-shaped leadfingers, the second die pads and the second L-shaped leadfingers connected; and

14. The system as claimed in claim 11 further comprising: a second integrated circuit die having second die pads only adjacent a single edge of the second integrated circuit die;second L-shaped leadfingers adjacent the single edge of the second integrated circuit die having the second die pads and the second L-shaped leadfingers connected; anda second package having the second die pads and portions of the second L-shaped leadfingers encapsulated, the second package stacked over the first package with the first L-shaped leadfingers and the second L-shaped leadfingers electrically connected.

15. The system as claimed in claim 11 further comprising: a base substrate;a second integrated circuit die having second die pads only adjacent a single edge of the second integrated circuit die;second L-shaped leadfingers adjacent the single edge of the second integrated circuit die having the second die pads and the second L-shaped leadfingers connected;a second package having the second die pads and portions of the second L-shaped leadfingers encapsulated, the second package stacked over the first package with the first L-shaped leadfingers and the second L-shaped leadfingers electrically connected to the base substrate; andan encapsulant over the first package and the second package.

16. The system as claimed in claim 11 wherein: the first integrated circuit die is the first integrated circuit die having the die pads on a first die active surface only adjacent the single edge of the first integrated circuit die;the first L-shaped leadfingers are part of a leadframe having the first L-shaped leadfingers adjacent the single edge; andthe first package is the first package having a portion of the first integrated circuit die, the die pads, and the portions of the first L-shaped leadfingers encapsulated.

17. The system as claimed in claim 16 further comprising a second integrated circuit die having a second die back surface over the first die active surface, the second integrated circuit die having an offset from the first integrated circuit die with the die pads exposed adjacent the second integrated circuit die.

18. The system as claimed in claim 16 further comprising a second integrated circuit die having second die pads and a second die active surface over the first die active surface, the second integrated circuit die having an offset of the first integrated circuit die with the second die pads exposed adjacent the first integrated circuit die.

19. The system as claimed in claim 16 further comprising a second integrated circuit die having second die pads, the second integrated circuit die over the first integrated circuit die having the second die pads on a side opposite the die pads.

20. The system as claimed in claim 16 further comprising a second integrated circuit die having second die pads, the second integrated circuit die over the first integrated circuit die having the second die pads on a same side as the die pads.