Kooi Chi OOI

Person

Glugor, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with hybrid mold layers
- Patent number 12,288,740
- Issue date Apr 29, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded silicon interconnects in bridges for integrated-circuit pack...
- Patent number 12,218,064
- Issue date Feb 4, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated bridge for die-to-die interconnects
- Patent number 12,002,747
- Issue date Jun 4, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated vertical interconnects for high-speed applications and...
- Patent number 11,887,917
- Issue date Jan 30, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with gradiated dielectric for reducing impedance mismatch
- Patent number 11,837,458
- Issue date Dec 5, 2023
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for signal integrity protection technique
- Patent number 11,798,894
- Issue date Oct 24, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to improve data training of a machine learnin...
- Patent number 11,710,029
- Issue date Jul 25, 2023
- Intel Corporation
- Kooi Chi Ooi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Embedded reference layers for semiconductor package substrates
- Patent number 11,676,910
- Issue date Jun 13, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for allocating a workload to an accelerator u...
- Patent number 11,586,473
- Issue date Feb 21, 2023
- Intel Corporation
- Divya Vijayaraghavan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Evaluating risk factors of proposed vehicle maneuvers using externa...
- Patent number 11,584,368
- Issue date Feb 21, 2023
- Intel Corporation
- Naissa Conde
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Vertical die-to-die interconnects bridge
- Patent number 11,545,434
- Issue date Jan 3, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with extended frame
- Patent number 11,527,467
- Issue date Dec 13, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical shield for stacked heterogeneous device integration
- Patent number 11,527,485
- Issue date Dec 13, 2022
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid ball grid array package for high speed interconnects
- Patent number 11,527,463
- Issue date Dec 13, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for hybrid interconnect geometry
- Patent number 11,508,650
- Issue date Nov 22, 2022
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and system
- Patent number 11,482,481
- Issue date Oct 25, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overhang bridge interconnect
- Patent number 11,430,764
- Issue date Aug 30, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect core
- Patent number 11,355,458
- Issue date Jun 7, 2022
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical power plane module for semiconductor packages
- Patent number 11,342,289
- Issue date May 24, 2022
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated bridge for die-to-die interconnects
- Patent number 11,282,780
- Issue date Mar 22, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded reference layers for semiconductor package substrates
- Patent number 11,195,801
- Issue date Dec 7, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with gradiated dielectric for reducing impedance mismatch
- Patent number 11,164,827
- Issue date Nov 2, 2021
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated vertical interconnects for high-speed applications and...
- Patent number 11,049,801
- Issue date Jun 29, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for allocating a workload to an accelerator u...
- Patent number 11,030,012
- Issue date Jun 8, 2021
- Intel Corporation
- Divya Vijayaraghavan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems in packages including wide-band phased-array antennas and m...
- Patent number 10,978,434
- Issue date Apr 13, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-conductor interconnect structure for a microelectronic device
- Patent number 10,980,108
- Issue date Apr 13, 2021
- Intel Corporation
- Ping Ping Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with stacked sitffeners and methods of assembli...
- Patent number 10,964,677
- Issue date Mar 30, 2021
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring-in-ring configurable-capacitance stiffeners and methods of ass...
- Patent number 10,950,552
- Issue date Mar 16, 2021
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer-assisted or autonomous driving vehicle incident management...
- Patent number 10,948,915
- Issue date Mar 16, 2021
- Intel Corporation
- Shekoufeh Qawami
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked dice systems
- Patent number 10,916,524
- Issue date Feb 9, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
- Publication number 20240234283
- Publication date Jul 11, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES
- Publication number 20240222346
- Publication date Jul 4, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC INTERCONNECT AND METHOD OF FORMING THE SAME
- Publication number 20240145365
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
- Publication number 20240136269
- Publication date Apr 25, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY HAVING A COOLING FEATURE AND METHODS OF FORMING...
- Publication number 20240071856
- Publication date Feb 29, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EXTENDED STIFFENER
- Publication number 20240006341
- Publication date Jan 4, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE PRINTED CIRCUIT BOARDS AND DEVICES
- Publication number 20240006786
- Publication date Jan 4, 2024
- Intel Corporation
- Howe Yin LOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES FOR STACKED MEMORY-ON-PACKAGE (SMOP) AND MET...
- Publication number 20240006324
- Publication date Jan 4, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES FOR ALTERNATE STACKED MEMORY AND METHODS OF...
- Publication number 20240006376
- Publication date Jan 4, 2024
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR PACKAGE FOR IMPROVED POWER INTEGRITY
- Publication number 20230187368
- Publication date Jun 15, 2023
- Intel Corporation
- Seok Ling LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STACKED MEMORY DEVICES
- Publication number 20230163101
- Publication date May 25, 2023
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDABLE COMPRESSION ATTACHED MEMORY MODULE (FCAMM)
- Publication number 20230120513
- Publication date Apr 20, 2023
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
- Publication number 20230113084
- Publication date Apr 13, 2023
- Intel Corporation
- Jackson Chung Peng KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS BRIDGES FOR MULTI-CHIP PACKAGES
- Publication number 20230065380
- Publication date Mar 2, 2023
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS
- Publication number 20220392835
- Publication date Dec 8, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SILICON INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT PACK...
- Publication number 20220302033
- Publication date Sep 22, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH GRADIATED DIELECTRIC FOR REDUCING IMPEDANCE MISMATCH
- Publication number 20220102295
- Publication date Mar 31, 2022
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL SHIELD FOR STACKED HETEROGENEOUS DEVICE INTEGRATION
- Publication number 20220068833
- Publication date Mar 3, 2022
- Intel Corporation
- Seok Ling LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL POWER PLANE MODULE FOR SEMICONDUCTOR PACKAGES
- Publication number 20220068846
- Publication date Mar 3, 2022
- Intel Corporation
- Jenny Shio Yin ONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20220068821
- Publication date Mar 3, 2022
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED REFERENCE LAYERS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
- Publication number 20220068836
- Publication date Mar 3, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH EXTENDED FRAME
- Publication number 20220068782
- Publication date Mar 3, 2022
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR ALLOCATING A WORKLOAD TO AN ACCELERATOR U...
- Publication number 20210406085
- Publication date Dec 30, 2021
- Intel Corporation
- Divya Vijayaraghavan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VERTICAL DIE-TO-DIE INTERCONNECTS BRIDGE
- Publication number 20210384130
- Publication date Dec 9, 2021
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BALL GRID ARRAY PACKAGE FOR HIGH SPEED INTERCONNECTS
- Publication number 20210375735
- Publication date Dec 2, 2021
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPOSSUM REDISTRIBUTION FRAME FOR CONFIGURABLE MEMORY DEVICES
- Publication number 20210335718
- Publication date Oct 28, 2021
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HYBRID MOLD LAYERS
- Publication number 20210335698
- Publication date Oct 28, 2021
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED VERTICAL INTERCONNECTS FOR HIGH-SPEED APPLICATIONS AND...
- Publication number 20210217689
- Publication date Jul 15, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERHANG BRIDGE INTERCONNECT
- Publication number 20210193616
- Publication date Jun 24, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS

Kooi Chi OOI

Person

Patents Grantslast 30 patents

Semiconductor package with hybrid mold layers

Molded silicon interconnects in bridges for integrated-circuit pack...

Integrated bridge for die-to-die interconnects

Encapsulated vertical interconnects for high-speed applications and...

Substrate with gradiated dielectric for reducing impedance mismatch

Devices and methods for signal integrity protection technique

Methods and apparatus to improve data training of a machine learnin...

Embedded reference layers for semiconductor package substrates

Methods and apparatus for allocating a workload to an accelerator u...

Evaluating risk factors of proposed vehicle maneuvers using externa...

Vertical die-to-die interconnects bridge

Multi-chip package with extended frame

Electrical shield for stacked heterogeneous device integration

Hybrid ball grid array package for high speed interconnects

Interposer for hybrid interconnect geometry

Semiconductor device and system

Overhang bridge interconnect

Interconnect core

Vertical power plane module for semiconductor packages

Integrated bridge for die-to-die interconnects

Embedded reference layers for semiconductor package substrates

Substrate with gradiated dielectric for reducing impedance mismatch

Encapsulated vertical interconnects for high-speed applications and...

Methods and apparatus for allocating a workload to an accelerator u...

Systems in packages including wide-band phased-array antennas and m...

Multi-conductor interconnect structure for a microelectronic device

Electronic packages with stacked sitffeners and methods of assembli...

Ring-in-ring configurable-capacitance stiffeners and methods of ass...

Computer-assisted or autonomous driving vehicle incident management...

Stacked dice systems

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE

ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES

ELECTRONIC INTERCONNECT AND METHOD OF FORMING THE SAME

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE

ELECTRONIC ASSEMBLY HAVING A COOLING FEATURE AND METHODS OF FORMING...

SEMICONDUCTOR PACKAGE WITH EXTENDED STIFFENER

COMPOSITE PRINTED CIRCUIT BOARDS AND DEVICES

SEMICONDUCTOR PACKAGES FOR STACKED MEMORY-ON-PACKAGE (SMOP) AND MET...

SEMICONDUCTOR PACKAGES FOR ALTERNATE STACKED MEMORY AND METHODS OF...

HYBRID SEMICONDUCTOR PACKAGE FOR IMPROVED POWER INTEGRITY

SEMICONDUCTOR PACKAGE WITH STACKED MEMORY DEVICES

FOLDABLE COMPRESSION ATTACHED MEMORY MODULE (FCAMM)

VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE

INTERCONNECTS BRIDGES FOR MULTI-CHIP PACKAGES

INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS

MOLDED SILICON INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT PACK...

SUBSTRATE WITH GRADIATED DIELECTRIC FOR REDUCING IMPEDANCE MISMATCH

ELECTRICAL SHIELD FOR STACKED HETEROGENEOUS DEVICE INTEGRATION

VERTICAL POWER PLANE MODULE FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

EMBEDDED REFERENCE LAYERS FOR SEMICONDUCTOR PACKAGE SUBSTRATES

MULTI-CHIP PACKAGE WITH EXTENDED FRAME

METHODS AND APPARATUS FOR ALLOCATING A WORKLOAD TO AN ACCELERATOR U...

VERTICAL DIE-TO-DIE INTERCONNECTS BRIDGE

HYBRID BALL GRID ARRAY PACKAGE FOR HIGH SPEED INTERCONNECTS

OPOSSUM REDISTRIBUTION FRAME FOR CONFIGURABLE MEMORY DEVICES

SEMICONDUCTOR PACKAGE WITH HYBRID MOLD LAYERS

ENCAPSULATED VERTICAL INTERCONNECTS FOR HIGH-SPEED APPLICATIONS AND...

OVERHANG BRIDGE INTERCONNECT