Kotaro Kodani

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and electronic component device
- Patent number 10,177,012
- Issue date Jan 8, 2019
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring substrate
- Patent number 10,117,336
- Issue date Oct 30, 2018
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,818,702
- Issue date Nov 14, 2017
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Kotaro Kodani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,345,143
- Issue date May 17, 2016
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component device
- Patent number 9,257,373
- Issue date Feb 9, 2016
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,247,644
- Issue date Jan 26, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,210,808
- Issue date Dec 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 9,137,896
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,089,041
- Issue date Jul 21, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate having columnar protruding part
- Patent number 9,018,538
- Issue date Apr 28, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 9,006,103
- Issue date Apr 14, 2015
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 8,797,757
- Issue date Aug 5, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 8,790,504
- Issue date Jul 29, 2014
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 8,760,883
- Issue date Jun 24, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 8,749,046
- Issue date Jun 10, 2014
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and electronic component device
- Patent number 8,686,298
- Issue date Apr 1, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 8,610,287
- Issue date Dec 17, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 8,476,536
- Issue date Jul 2, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 8,476,754
- Issue date Jul 2, 2013
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate having columnar protruding part
- Patent number 8,458,900
- Issue date Jun 11, 2013
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring board
- Patent number 7,954,234
- Issue date Jun 7, 2011
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and wiring substrate manufacturing method
- Patent number 7,582,551
- Issue date Sep 1, 2009
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tab tape and method for producing same
- Patent number 6,007,668
- Issue date Dec 28, 1999
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab tape and method for producing same
- Patent number 5,738,928
- Issue date Apr 14, 1998
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE
- Publication number 20180114702
- Publication date Apr 26, 2018
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20160379938
- Publication date Dec 29, 2016
- Shinko Electric Industries Co., LTD.
- Kotaro Kodani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160044792
- Publication date Feb 11, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20150289380
- Publication date Oct 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART
- Publication number 20150206833
- Publication date Jul 23, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150014027
- Publication date Jan 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT DEVICE
- Publication number 20140145317
- Publication date May 29, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20140087556
- Publication date Mar 27, 2014
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140076614
- Publication date Mar 20, 2014
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130256012
- Publication date Oct 3, 2013
- Kotaro Kodani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART
- Publication number 20130250533
- Publication date Sep 26, 2013
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20130134127
- Publication date May 30, 2013
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130075145
- Publication date Mar 28, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20120175153
- Publication date Jul 12, 2012
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND ELECTRONIC COMPONENT DEVICE
- Publication number 20120145437
- Publication date Jun 14, 2012
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate and Method for Manufacturing Wiring Substrate
- Publication number 20120006591
- Publication date Jan 12, 2012
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20110290536
- Publication date Dec 1, 2011
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110147924
- Publication date Jun 23, 2011
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20100314254
- Publication date Dec 16, 2010
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100308451
- Publication date Dec 9, 2010
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART
- Publication number 20100263923
- Publication date Oct 21, 2010
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND ELECTRONIC COMPONENT DEVICE
- Publication number 20100132993
- Publication date Jun 3, 2010
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20100084163
- Publication date Apr 8, 2010
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFA...
- Publication number 20100032196
- Publication date Feb 11, 2010
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD
- Publication number 20080246146
- Publication date Oct 9, 2008
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080245549
- Publication date Oct 9, 2008
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate and method for manufacturing the same
- Publication number 20080149383
- Publication date Jun 26, 2008
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kotaro Kodani

Person

Patents Grantslast 30 patents

Wiring substrate and electronic component device

Method of manufacturing a wiring substrate

Wiring substrate and semiconductor device

Method of fabricating a wiring board

Electronic component device

Wiring board and method for manufacturing the same

Wiring substrate and method of manufacturing the same

Wiring substrate

Method of fabricating a wiring board

Wiring substrate having columnar protruding part

Method of manufacturing wiring substrate

Wiring substrate and manufacturing method thereof

Method of manufacturing wiring substrate

Wiring substrate and manufacturing method thereof

Wiring substrate and method of manufacturing the same

Wiring board and electronic component device

Wiring substrate and method of manufacturing the same

Wiring substrate and method for manufacturing the same

Wiring substrate and method of manufacturing the same

Wiring substrate having columnar protruding part

Method of manufacturing a wiring board

Wiring substrate and wiring substrate manufacturing method

Tab tape and method for producing same

Tab tape and method for producing same

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD OF FABRICATING THE SAME

WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT DEVICE

METHOD OF MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART

WIRING BOARD AND METHOD OF FABRICATING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING BOARD AND ELECTRONIC COMPONENT DEVICE

Wiring Substrate and Method for Manufacturing Wiring Substrate

WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART

WIRING BOARD AND ELECTRONIC COMPONENT DEVICE

WIRING BOARD AND METHOD OF FABRICATING THE SAME

MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFA...

WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Wiring substrate and method for manufacturing the same