Kothandapani RAMESH

Person

Ang Mo Kio, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover lid with selective and edge metallization and methods of making
- Patent number 12,020,999
- Issue date Jun 25, 2024
- Materion Corporation
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic combo lid with selective and edge metallizations
- Patent number 11,049,777
- Issue date Jun 29, 2021
- Materion Corporation
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cover lid with selective and edge metallization
- Patent number 11,031,309
- Issue date Jun 8, 2021
- Materion Corporation
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal cap assembly for optical communications
- Patent number 10,357,841
- Issue date Jul 23, 2019
- Materion Corporation
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a ceramic combo lid with selective and edge metall...
- Patent number 10,211,115
- Issue date Feb 19, 2019
- Materion Corporation
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal cap assembly for optical communications
- Patent number 9,560,781
- Issue date Jan 31, 2017
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold die bond sheet preform
- Patent number 8,975,176
- Issue date Mar 10, 2015
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONICS PACKAGE ASSEMBLIES AND PROCESSES FOR MAKING
- Publication number 20220359351
- Publication date Nov 10, 2022
- MATERION CORPORATION
- Ramesh KOTHANDAPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER LID WITH SELECTIVE AND EDGE METALLIZATION
- Publication number 20210257270
- Publication date Aug 19, 2021
- MATERION CORPORATION
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MANUFACTURING OF SOLDER PREFORMS
- Publication number 20170239756
- Publication date Aug 24, 2017
- Materion Corporation
- Ramesh Kothandapani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CERAMIC COMBO LID WITH SELECTIVE AND EDGE METALLIZATIONS
- Publication number 20170229360
- Publication date Aug 10, 2017
- MATERION CORPORATION
- Ramesh Kothandapani
- B32 - LAYERED PRODUCTS
Information Patent Application
COVER LID WITH SELECTIVE AND EDGE METALLIZATION
- Publication number 20170229361
- Publication date Aug 10, 2017
- MATERION CORPORATION
- Ramesh Kothandapani
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL CAP ASSEMBLY FOR OPTICAL COMMUNICATIONS
- Publication number 20170095870
- Publication date Apr 6, 2017
- Materion Corporation
- Ramesh Kothandapani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CERAMIC COMBO LID WITH SELECTIVE AND EDGE METALLIZATIONS
- Publication number 20150340298
- Publication date Nov 26, 2015
- Materion Corporation
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL CAP ASSEMBLY FOR OPTICAL COMMUNICATIONS
- Publication number 20150021330
- Publication date Jan 22, 2015
- Materion Corporation
- Kothandapani Ramesh
- B32 - LAYERED PRODUCTS
Information Patent Application
GOLD DIE BOND SHEET PREFORM
- Publication number 20140264949
- Publication date Sep 18, 2014
- MATERION CORPORATION
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PLATING OF FRAME LID ASSEMBLY
- Publication number 20130049555
- Publication date Feb 28, 2013
- Kothandapani RAMESH
- H01 - BASIC ELECTRIC ELEMENTS

Kothandapani RAMESH

Person

Patents Grantslast 30 patents

Microelectronics package assemblies and processes for making

Cover lid with selective and edge metallization and methods of making

Ceramic combo lid with selective and edge metallizations

Cover lid with selective and edge metallization

Metal cap assembly for optical communications

Method of making a ceramic combo lid with selective and edge metall...

Metal cap assembly for optical communications

Gold die bond sheet preform

Patents Applicationslast 30 patents

MICROELECTRONICS PACKAGE ASSEMBLIES AND PROCESSES FOR MAKING

COVER LID WITH SELECTIVE AND EDGE METALLIZATION

LASER MANUFACTURING OF SOLDER PREFORMS

CERAMIC COMBO LID WITH SELECTIVE AND EDGE METALLIZATIONS

COVER LID WITH SELECTIVE AND EDGE METALLIZATION

METAL CAP ASSEMBLY FOR OPTICAL COMMUNICATIONS

CERAMIC COMBO LID WITH SELECTIVE AND EDGE METALLIZATIONS

METAL CAP ASSEMBLY FOR OPTICAL COMMUNICATIONS

GOLD DIE BOND SHEET PREFORM

SELECTIVE PLATING OF FRAME LID ASSEMBLY