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Kouichirou Hori
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Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
Method for manufacturing semiconductor device having via holes
Patent number
7,288,486
Issue date
Oct 30, 2007
Mitsubishi Electric Corporation
Takeo Shirahama
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Method for manufacturing semiconductor device having via holes
Publication number
20070128852
Publication date
Jun 7, 2007
Mitsubishi Electric Corporation
Takeo Shirahama
H01 - BASIC ELECTRIC ELEMENTS