Kouji Kataoka

Person

Takatsuki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wired circuit board assembly sheet
- Patent number 8,487,189
- Issue date Jul 16, 2013
- Nitto Denko Corporation
- Toshiki Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board assembly sheet
- Patent number 8,362,360
- Issue date Jan 29, 2013
- Nitto Denko Corporation
- Toshiki Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board assembly sheet
- Patent number 8,017,871
- Issue date Sep 13, 2011
- Nitto Denko Corporation
- Toshiki Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board
- Patent number 7,816,609
- Issue date Oct 19, 2010
- Nitto Denko Corporation
- Kouji Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polypropylene film and laminated material thereof
- Patent number 7,732,027
- Issue date Jun 8, 2010
- Toray Advanced Film Co., Ltd.
- Yoichi Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flexible wired circuit board
- Patent number 7,696,441
- Issue date Apr 13, 2010
- Nitto Denko Corporation
- Kouji Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired-circuit-board assembly sheet
- Patent number 7,649,143
- Issue date Jan 19, 2010
- Nitto Denko Corporation
- Tetsuya Ohsawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board assembly sheet
- Patent number 7,592,551
- Issue date Sep 22, 2009
- Nitto Denko Corporation
- Toshiki Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Identification mark for a wiring circuit board carrying sheet
- Patent number D594425
- Issue date Jun 16, 2009
- Nitto Denko Corporation
- Tetsuya Ohsawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Grooves formed around a semiconductor device on a circuit board
- Patent number D580895
- Issue date Nov 18, 2008
- Nitto Denko Corporation
- Naohiro Terada
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Identification mark for a wiring circuit board carrying sheet
- Patent number D580382
- Issue date Nov 11, 2008
- Nitto Denko Corporation
- Tetsuya Ohsawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Grooves formed around a semiconductor device on a circuit board
- Patent number D568838
- Issue date May 13, 2008
- Nitto Denko Corporation
- Naohiro Terada
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Expansive solidifying material
- Patent number 4,266,980
- Issue date May 12, 1981
- Osaka Cement Co., Ltd.
- Akira Chudo
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Wired circuit board assembly sheet
- Publication number 20110155421
- Publication date Jun 30, 2011
- Nitto Denko Corporation
- Toshiki Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wired circuit board assembly sheet
- Publication number 20110139490
- Publication date Jun 16, 2011
- Nitto Denko Corporation
- Toshiki Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wired circuit board assembly sheet
- Publication number 20090260855
- Publication date Oct 22, 2009
- Nitto Denko Corporation
- Toshiki Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polypropylene Film and Laminated Material Thereof
- Publication number 20080213519
- Publication date Sep 4, 2008
- TORAY ADVANCED FILM CO., LTD.
- Yoichi Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wired circuit board assembly sheet
- Publication number 20070241764
- Publication date Oct 18, 2007
- Nitto Denko Corporation
- Toshiki Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wired-circuit-board assembly sheet
- Publication number 20070170911
- Publication date Jul 26, 2007
- Nitto Denko Corporation
- Tetsuya Ohsawa
- G11 - INFORMATION STORAGE
Information Patent Application
Flexible wired circuit board
- Publication number 20070141864
- Publication date Jun 21, 2007
- Nitto Denko Corporation
- Kouji Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wired circuit board
- Publication number 20070128952
- Publication date Jun 7, 2007
- Nitto Denko Corporation
- Kouji Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kouji Kataoka

Person

Patents Grantslast 30 patents

Wired circuit board assembly sheet

Wired circuit board assembly sheet

Wired circuit board assembly sheet

Wired circuit board

Polypropylene film and laminated material thereof

Flexible wired circuit board

Wired-circuit-board assembly sheet

Wired circuit board assembly sheet

Identification mark for a wiring circuit board carrying sheet

Grooves formed around a semiconductor device on a circuit board

Identification mark for a wiring circuit board carrying sheet

Grooves formed around a semiconductor device on a circuit board

Expansive solidifying material

Patents Applicationslast 30 patents

Wired circuit board assembly sheet

Wired circuit board assembly sheet

Wired circuit board assembly sheet

Polypropylene Film and Laminated Material Thereof

Wired circuit board assembly sheet

Wired-circuit-board assembly sheet

Flexible wired circuit board

Wired circuit board