Wired-circuit-board assembly sheet

Abstract
A wired-circuit-board assembly sheet is provided having removable portions that are easily removable without any generation of metal powder. The wired-circuit-board assembly sheet comprises a plurality of suspension boards with circuits, distinguishing marks for distinguishing defectiveness of the suspension boards with circuits, and a supporting sheet for supporting the suspension boards with circuits and the distinguishing marks, wherein openings are formed in the supporting sheet, and removable portions which are to be removed when the suspension boards with circuits are judged defective are located in the openings and also supported by the supporting sheet via joint portions formed of resin.
Description

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings:



FIG. 1 is a plan view showing a suspension-board-with-circuit assembly sheet of an embodiment of a wired-circuit-board assembly sheet of the present invention;



FIG. 2 is a sectional view of the suspension-board-with-circuit assembly sheet shown in FIG. 1 taken along line A-A;



FIG. 3 is an enlarged plan view of a distinguishing mark provided on the suspension-board-with-circuit assembly sheet shown in FIG. 1;



FIG. 4 is an enlarged rear view of the distinguished mark shown in FIG. 3;



FIG. 5 is a production process drawing showing production processes of the suspension-board-with-circuit assembly sheet,


(a) showing the process of preparing a metal supporting board,


(b) showing the process of forming a plurality of insulating base layers on the metal supporting board,


(c) showing the process of forming a conductive pattern on the insulating base layer of each suspension board with circuit and forming a mark forming portion on the insulating base layer at each distinguishing mark, and


(d) showing the process of forming each insulating cover layer on each of the insulating base layers;



FIG. 6 is a production process drawing showing production processes of the suspension-board-with-circuit assembly sheet subsequent to the processes of FIG. 5,


(e) showing the process of forming an etching resist over the entire front surface of the suspension-board-with-circuit assembly sheet which is under production and forming an etching resist on the back side of the same in a predetermined pattern,


(f) showing the process of opening the metal supporting board exposed from the etching resist by etching, and


(g) showing the process of removing the etching resist;



FIG. 7 is an enlarged plan view showing a distinguishing mark of a suspension-board-with-circuit assembly sheet of another embodiment (a second embodiment) of the wired-circuit-board assembly sheet of the present invention;



FIG. 8 is an enlarged rear view showing a distinguishing mark of a suspension-board-with-circuit assembly sheet of still another embodiment (a third embodiment) of the wired-circuit-board assembly sheet of the present invention;



FIG. 9 is an enlarged rear view showing a distinguishing mark of a suspension-board-with-circuit assembly sheet of a further embodiment (a fourth embodiment) of the wired-circuit-board assembly sheet of the present invention; and



FIG. 10 is an enlarged rear view showing a distinguishing mark of a suspension-board-with-circuit assembly sheet of a still further embodiment (a fifth embodiment) of the wired-circuit-board assembly sheet of the present invention.


Claims
  • 1. A wired-circuit-board assembly sheet, comprising: a plurality of wired circuit boards;distinguishing marks provided for distinguishing defectiveness of the wired circuit boards; anda supporting sheet for supporting the wired circuit boards and the distinguishing marks;wherein openings are formed in the supporting sheet where the distinguishing marks are provided, andthe distinguishing marks include removable portions provided in the openings for indicating whether the wired circuit boards are defective or non-defective, and joint portions formed of resin for joining the removable portions and the supporting sheet.
  • 2. The wired-circuit-board assembly sheet according to claim 1, the wired circuit board, comprising: a metal supporting layer;an insulating base layer formed on the metal supporting layer;a conductive pattern formed on the insulating base layer; andan insulating cover layer formed on the insulating base layer to cover the conductive pattern,wherein the supporting sheet comprises the metal supporting layer, andthe joint portion comprises the insulating base layer and/or the insulating cover layer.
  • 3. The wired-circuit-board assembly sheet according to claim 1, the joint portion comprising: a supporting-sheet-side end portion connected to the supporting sheet;a removable-portion-side end portion connected to the removable portion;wherein at least either of the supporting-sheet-side end portion and the removable-portion-side end portion has a curved portion formed to generally increase in width from inside to outside in a curved form in a direction in which the supporting-sheet-side end portion and the removable-portion-side end portion are opposite to each other.
  • 4. The wired-circuit-board assembly sheet according to claim 1, the distinguishing mark, comprising an outer frame portion formed of resin which is provided to extend continuously from the joint portion to surround the opening wherein the outer frame portion is formed to expose an end portion of the opening in the supporting sheet.
  • 5. The wired-circuit-board assembly sheet according to claim 1, the joint portion comprising: a supporting-sheet-side end portion connected to the supporting sheet; and a removable-portion-side end portion connected to the removable portion and are formed to generally decrease in width from the supporting-sheet-side end portion to the removable-portion-side end portion or from the removable-portion-side end portion to the supporting-sheet-side end portion.
  • 6. The wired-circuit-board assembly sheet according to claim 1, wherein the wired circuit board is a suspension board with circuit.
Priority Claims (1)
Number Date Country Kind
JP 2006-016492 Jan 2006 JP national