Kouji Kawakita

Person

Jouyou, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laminated electronic component, laminated duplexer and communicatio...
- Patent number 6,822,534
- Issue date Nov 23, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kazuhide Uriu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 6,326,694
- Issue date Dec 4, 2001
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Acceleration sensor
- Patent number 6,227,051
- Issue date May 8, 2001
- Matsushita Electric Industrial Co., Ltd.
- Tetsuro Otsuchi
- G01 - MEASURING TESTING
Information Patent Grant
Piezoelectric actuator, infrared sensor and piezoelectric light def...
- Patent number 6,222,302
- Issue date Apr 24, 2001
- Matsushita Electric Industrial Co., Ltd.
- Katsumi Imada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 6,211,487
- Issue date Apr 3, 2001
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated ceramic device
- Patent number 6,154,356
- Issue date Nov 28, 2000
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Kagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting member of a circuit substrate and method of manufacturin...
- Patent number 6,108,903
- Issue date Aug 29, 2000
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste composition for via hole filling and printed circu...
- Patent number 6,096,411
- Issue date Aug 1, 2000
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Acceleration sensor
- Patent number 6,050,144
- Issue date Apr 18, 2000
- Matsushita Electric Industrial Co., Ltd.
- Tetsuro Otsuchi
- G01 - MEASURING TESTING
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,977,490
- Issue date Nov 2, 1999
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 5,972,482
- Issue date Oct 26, 1999
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 5,960,538
- Issue date Oct 5, 1999
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,914,358
- Issue date Jun 22, 1999
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 5,817,404
- Issue date Oct 6, 1998
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,733,467
- Issue date Mar 31, 1998
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,652,042
- Issue date Jul 29, 1997
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing two-sided and multi-layered printed circuit...
- Patent number 5,588,207
- Issue date Dec 31, 1996
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting member of a circuit substrate and method of manufacturin...
- Patent number 5,484,647
- Issue date Jan 16, 1996
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-sided printed circuit board a multi-layered printed circuit board
- Patent number 5,440,075
- Issue date Aug 8, 1995
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric ceramic composition
- Patent number 5,093,757
- Issue date Mar 3, 1992
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Dielectric ceramic composition
- Patent number 5,006,956
- Issue date Apr 9, 1991
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Multilayer electronic part, multilayer antenna duplexer, and commun...
- Publication number 20030147197
- Publication date Aug 7, 2003
- Kazuhide Uriu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SINTERED BODY AND PRODUCTION METHOD THEREOF
- Publication number 20010035253
- Publication date Nov 1, 2001
- KOUJI KAWAKITA
- B32 - LAYERED PRODUCTS
Information Patent Application
Connecting member of a circuit substrate and method of manufacturin...
- Publication number 20010003610
- Publication date Jun 14, 2001
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20010002294
- Publication date May 31, 2001
- Akihito Hatakeyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Kouji Kawakita

Person

Patents Grantslast 30 patents

Laminated electronic component, laminated duplexer and communicatio...

Printed circuit board

Acceleration sensor

Piezoelectric actuator, infrared sensor and piezoelectric light def...

Printed circuit board and method of manufacturing the same

Laminated ceramic device

Connecting member of a circuit substrate and method of manufacturin...

Conductive paste composition for via hole filling and printed circu...

Acceleration sensor

Conductive paste compound for via hole filling, printed circuit boa...

Printed circuit board and method of manufacturing the same

Printed circuit board

Conductive paste compound for via hole filling, printed circuit boa...

Printed circuit board

Conductive paste compound for via hole filling, printed circuit boa...

Conductive paste compound for via hole filling, printed circuit boa...

Method of manufacturing two-sided and multi-layered printed circuit...

Connecting member of a circuit substrate and method of manufacturin...

Two-sided printed circuit board a multi-layered printed circuit board

Dielectric ceramic composition

Dielectric ceramic composition

Patents Applicationslast 30 patents

Multilayer electronic part, multilayer antenna duplexer, and commun...

CERAMIC SINTERED BODY AND PRODUCTION METHOD THEREOF

Connecting member of a circuit substrate and method of manufacturin...

Printed circuit board and method of manufacturing the same