Kousaku Yano

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring structure of semiconductor device, method of prod...
- Patent number 8,110,495
- Issue date Feb 7, 2012
- Panasonic Corporation
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring structure of semiconductor device, method of prod...
- Patent number 7,911,060
- Issue date Mar 22, 2011
- Panasonic Corporation
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring structure of semiconductor device, method of prod...
- Patent number 7,642,654
- Issue date Jan 5, 2010
- Panasonic Corporation
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring structure of semiconductor device, method of prod...
- Patent number 7,443,031
- Issue date Oct 28, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring structure of semiconductor device, method of prod...
- Patent number 7,148,572
- Issue date Dec 12, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring structure of semiconductor device, method of prod...
- Patent number 6,815,338
- Issue date Nov 9, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring structure of semiconductor device, method of prod...
- Patent number 6,580,176
- Issue date Jun 17, 2003
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer forming material and wiring forming method
- Patent number 6,372,928
- Issue date Apr 16, 2002
- Matsushita Electric Industrial Co., Ltd.
- Akemi Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing multilayer wiring device with offset axises of...
- Patent number 6,197,685
- Issue date Mar 6, 2001
- Matsushita Electronics Corporation
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,022,804
- Issue date Feb 8, 2000
- Matsushita Electric Industrial Co., Ltd.
- Kousaku Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising MISFETS and method of manufacturing...
- Patent number 5,986,313
- Issue date Nov 16, 1999
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming thin film
- Patent number 5,863,338
- Issue date Jan 26, 1999
- Matsushita Electric Industrial Co., Ltd.
- Yuichiro Yamada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of preventing diffusion between interconnect and plug
- Patent number 5,834,369
- Issue date Nov 10, 1998
- Matsushita Electric Industrial Co., Ltd.
- Tomoyasu Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer forming material and wiring forming method
- Patent number 5,773,639
- Issue date Jun 30, 1998
- Matsushita Electric Industrial Co., Ltd.
- Akemi Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layer wiring structure having varying-sized cutouts
- Patent number 5,760,429
- Issue date Jun 2, 1998
- Matsushita Electric Industrial Co., Ltd.
- Kousaku Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and associated fabrication method
- Patent number 5,753,536
- Issue date May 19, 1998
- Matsushita Electric Industrial Co., Ltd.
- Tatsuo Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a field-effect transistor having a lower...
- Patent number 5,733,812
- Issue date Mar 31, 1998
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and associated fabrication method
- Patent number 5,723,909
- Issue date Mar 3, 1998
- Matsushita Electric Industrial Co., Ltd.
- Kousaku Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a memory device by utilizing variations in resis...
- Patent number 5,714,400
- Issue date Feb 3, 1998
- Matsushita Electric Industrial Co., Ltd.
- Shuji Hirao
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and process
- Patent number 5,633,211
- Issue date May 27, 1997
- Matsushita Electric Industrial Co., Ld.
- Shinichi Imai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Memory device with tungsten and aluminum interconnects
- Patent number 5,621,247
- Issue date Apr 15, 1997
- Matsushita Electric Industrial Co., Ltd.
- Shuji Hirao
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin layer forming method wherein hydrophobic molecular layers prev...
- Patent number 5,576,247
- Issue date Nov 19, 1996
- Matsushita Electric Industrial Co., Ltd.
- Kousaku Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method
- Patent number 5,569,628
- Issue date Oct 29, 1996
- Matsushita Electric Industrial Co., Ltd.
- Kousaku Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 5,545,919
- Issue date Aug 13, 1996
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming thin film
- Patent number 5,501,739
- Issue date Mar 26, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yuichiro Yamada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a multi-layer metallic wiring structure
- Patent number 5,385,867
- Issue date Jan 31, 1995
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preventing the corrosion of metallic wirings
- Patent number 5,312,776
- Issue date May 17, 1994
- Matsushita Electric Industrial Co., Ltd.
- Tomoyasu Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating interconnection structure
- Patent number 4,988,423
- Issue date Jan 29, 1991
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripe-color filter
- Patent number 4,355,866
- Issue date Oct 26, 1982
- Matsushita Electric Industrial Co., Ltd.
- Eiichiro Tanaka
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING STRUCTURE OF SEMICONDUCTOR DEVICE, METHOD OF PROD...
- Publication number 20110129995
- Publication date Jun 2, 2011
- PANASONIC CORPORATION
- Shinichi DOMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING STRUCTURE OF SEMICONDUCTOR DEVICE, METHOD OF PROD...
- Publication number 20100078827
- Publication date Apr 1, 2010
- PANASONIC CORPORATION
- Shinichi DOMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING STRUCTURE OF SEMICONDUCTOR DEVICE, METHOD OF PROD...
- Publication number 20090111262
- Publication date Apr 30, 2009
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring structure of semiconductor device, method of prod...
- Publication number 20070037453
- Publication date Feb 15, 2007
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring structure of semiconductor device, method of prod...
- Publication number 20040201104
- Publication date Oct 14, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING STRUCTURE OF SEMICONDUCTOR DEVICE, METHOD OF PROD...
- Publication number 20040092097
- Publication date May 13, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring structure of semiconductor device, method of prod...
- Publication number 20010004551
- Publication date Jun 21, 2001
- Matsushita Electronics Corporation
- Shinichi Domae
- H01 - BASIC ELECTRIC ELEMENTS

Kousaku Yano

Person

Patents Grantslast 30 patents

Multilayer wiring structure of semiconductor device, method of prod...

Multilayer wiring structure of semiconductor device, method of prod...

Multilayer wiring structure of semiconductor device, method of prod...

Multilayer wiring structure of semiconductor device, method of prod...

Multilayer wiring structure of semiconductor device, method of prod...

Multilayer wiring structure of semiconductor device, method of prod...

Multilayer wiring structure of semiconductor device, method of prod...

Layer forming material and wiring forming method

Method of producing multilayer wiring device with offset axises of...

Semiconductor device and its manufacturing method

Semiconductor device comprising MISFETS and method of manufacturing...

Apparatus and method for forming thin film

Method of preventing diffusion between interconnect and plug

Layer forming material and wiring forming method

Multi-layer wiring structure having varying-sized cutouts

Semiconductor device and associated fabrication method

Semiconductor device with a field-effect transistor having a lower...

Semiconductor device and associated fabrication method

Method for forming a memory device by utilizing variations in resis...

Semiconductor device and process

Memory device with tungsten and aluminum interconnects

Thin layer forming method wherein hydrophobic molecular layers prev...

Semiconductor device fabrication method

Semiconductor device and method of fabricating the same

Apparatus and method for forming thin film

Method for forming a multi-layer metallic wiring structure

Method of preventing the corrosion of metallic wirings

Method for fabricating interconnection structure

Stripe-color filter

Patents Applicationslast 30 patents

MULTILAYER WIRING STRUCTURE OF SEMICONDUCTOR DEVICE, METHOD OF PROD...

MULTILAYER WIRING STRUCTURE OF SEMICONDUCTOR DEVICE, METHOD OF PROD...

MULTILAYER WIRING STRUCTURE OF SEMICONDUCTOR DEVICE, METHOD OF PROD...

Multilayer wiring structure of semiconductor device, method of prod...

Multilayer wiring structure of semiconductor device, method of prod...

MULTILAYER WIRING STRUCTURE OF SEMICONDUCTOR DEVICE, METHOD OF PROD...

Multilayer wiring structure of semiconductor device, method of prod...