Kousik Ganesan

Person

Tualatin, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Configuration and method of operation of an electrodeposition syste...
- Patent number 10,745,817
- Issue date Aug 18, 2020
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated circuit substrate and method of making
- Patent number 10,658,281
- Issue date May 19, 2020
- Intel Corporation
- Rahul N. Manepalli
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Configuration and method of operation of an electrodeposition syste...
- Patent number 9,816,193
- Issue date Nov 14, 2017
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for edge bevel removal of copper from silicon...
- Patent number 9,685,353
- Issue date Jun 20, 2017
- Novellus Systems, Inc.
- Kousik Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deionized water conditioning system and methods
- Patent number 9,138,784
- Issue date Sep 22, 2015
- Novellus Systems, Inc.
- Jeffrey Alan Hawkins
- B08 - CLEANING
Information Patent Grant
Plating method and apparatus with multiple internally irrigated cha...
- Patent number 8,540,857
- Issue date Sep 24, 2013
- Novellus Systems, Inc.
- Steven Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for edge bevel removal of copper from silicon...
- Patent number 8,419,964
- Issue date Apr 16, 2013
- Novellus Systems, Inc.
- Kousik Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapidly cleanable electroplating cup seal
- Patent number 8,398,831
- Issue date Mar 19, 2013
- Novellus Systems, Inc.
- Shantinath Ghongadi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating cup assembly
- Patent number 8,377,268
- Issue date Feb 19, 2013
- Novellus Systems, Inc.
- Robert Rash
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and apparatus with multiple internally irrigated cha...
- Patent number 8,262,871
- Issue date Sep 11, 2012
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Magnetically actuated chuck for edge bevel removal
- Patent number 8,172,646
- Issue date May 8, 2012
- Novellus Systems, Inc.
- Jingbin Feng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer electroplating apparatus for reducing edge defects
- Patent number 8,172,992
- Issue date May 8, 2012
- Novellus Systems, Inc.
- Vinay Prabhakar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Closed contact electroplating cup assembly
- Patent number 7,985,325
- Issue date Jul 26, 2011
- Novellus Systems, Inc.
- Robert Rash
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Rapidly cleanable electroplating cup assembly
- Patent number 7,935,231
- Issue date May 3, 2011
- Novellus Systems, Inc.
- Shantinath Ghongadi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF MAKING
- Publication number 20200211952
- Publication date Jul 2, 2020
- Intel Corporation
- Rahul N. Manepalli
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF MAKING
- Publication number 20190103348
- Publication date Apr 4, 2019
- Intel Corporation
- Rahul N. Manepalli
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...
- Publication number 20180038007
- Publication date Feb 8, 2018
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR EDGE BEVEL REMOVAL OF COPPER FROM SILICON...
- Publication number 20140190529
- Publication date Jul 10, 2014
- Kousik Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS
- Publication number 20120181170
- Publication date Jul 19, 2012
- Vinay Prabhakar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...
- Publication number 20120175263
- Publication date Jul 12, 2012
- Kousik GANESAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING CUP ASSEMBLY
- Publication number 20110233056
- Publication date Sep 29, 2011
- Novellus Systems, Inc.
- Robert Rash
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RAPIDLY CLEANABLE ELECTROPLATING CUP SEAL
- Publication number 20110181000
- Publication date Jul 28, 2011
- Novellus Systems, Inc.
- Shantinath Ghongadi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MAGNETICALLY ACTUATED CHUCK FOR EDGE BEVEL REMOVAL
- Publication number 20100219920
- Publication date Sep 2, 2010
- Novellus Systems, Inc.
- Jingbin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS
- Publication number 20100155254
- Publication date Jun 24, 2010
- Vinay Prabhakar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR EDGE BEVEL REMOVAL OF COPPER FROM SILICON...
- Publication number 20100055924
- Publication date Mar 4, 2010
- Novellus Systems, Inc.
- Kousik Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rapidly Cleanable Electroplating Cup Assembly
- Publication number 20090107835
- Publication date Apr 30, 2009
- Novellus Systems, Inc.
- Shantinath Ghongadi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Closed Contact Electroplating Cup Assembly
- Publication number 20090107836
- Publication date Apr 30, 2009
- Novellus Systems, Inc.
- Robert Rash
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kousik Ganesan

Person

Patents Grantslast 30 patents

Configuration and method of operation of an electrodeposition syste...

Integrated circuit substrate and method of making

Configuration and method of operation of an electrodeposition syste...

Apparatus and method for edge bevel removal of copper from silicon...

Deionized water conditioning system and methods

Plating method and apparatus with multiple internally irrigated cha...

Apparatus and method for edge bevel removal of copper from silicon...

Rapidly cleanable electroplating cup seal

Electroplating cup assembly

Plating method and apparatus with multiple internally irrigated cha...

Magnetically actuated chuck for edge bevel removal

Wafer electroplating apparatus for reducing edge defects

Closed contact electroplating cup assembly

Rapidly cleanable electroplating cup assembly

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF MAKING

INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF MAKING

CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...

APPARATUS AND METHOD FOR EDGE BEVEL REMOVAL OF COPPER FROM SILICON...

WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS

CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...

ELECTROPLATING CUP ASSEMBLY

RAPIDLY CLEANABLE ELECTROPLATING CUP SEAL

MAGNETICALLY ACTUATED CHUCK FOR EDGE BEVEL REMOVAL

WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS

APPARATUS AND METHOD FOR EDGE BEVEL REMOVAL OF COPPER FROM SILICON...

Rapidly Cleanable Electroplating Cup Assembly

Closed Contact Electroplating Cup Assembly