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Ibi-gun, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Multilayered printed circuit board and manufacturing method thereof
Patent number
8,148,643
Issue date
Apr 3, 2012
Ibiden Co., Ltd.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed wiring board and its manufacturing method
Patent number
8,065,794
Issue date
Nov 29, 2011
Ibiden Co., Ltd.
Honchin En
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Interlayer insulating layer for printed wiring board, printed wirin...
Patent number
8,021,748
Issue date
Sep 20, 2011
Ibiden Co., Ltd.
Motoo Asai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing a multilayered printed circuit board
Patent number
7,832,098
Issue date
Nov 16, 2010
Ibiden Co., Ltd.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electroplating process of electroplating an elecrically conductive...
Patent number
7,827,680
Issue date
Nov 9, 2010
Ibiden Co., Ltd.
Honchin En
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Printed wiring board and its manufacturing method
Patent number
7,691,189
Issue date
Apr 6, 2010
Ibiden Co., Ltd.
Honchin En
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Multilayer printed wiring board and its manufacturing method, and r...
Patent number
RE40947
Issue date
Oct 27, 2009
Ibiden Co., Ltd.
Motoo Asai
428 - Stock material or miscellaneous articles
Information
Patent Grant
Method of manufacturing multilayered circuit board
Patent number
7,415,761
Issue date
Aug 26, 2008
Ibiden Co., Ltd.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed wiring board and its manufacturing method
Patent number
7,230,188
Issue date
Jun 12, 2007
Ibiden Co., Ltd.
Honchin En
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Multilayer printed-circuit board and method of manufacture
Patent number
6,762,921
Issue date
Jul 13, 2004
Ibiden Co., Ltd.
Motoo Asai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method of a multilayered printed circuit board having...
Patent number
6,591,495
Issue date
Jul 15, 2003
Ibiden Co., Ltd.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer printed wiring board having a roughened inner conductor...
Patent number
6,512,186
Issue date
Jan 28, 2003
Ibiden Co., Ltd.
Yoko Nishiwaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer printed wiring board and its manufacturing method, and r...
Patent number
6,376,049
Issue date
Apr 23, 2002
Ibiden Co., Ltd.
Motoo Asai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer printed wiring board and its production process, resin c...
Patent number
6,376,052
Issue date
Apr 23, 2002
Ibiden Co., Ltd.
Motoo Asai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Adhesive for electroless plating, feedstock composition for prepari...
Patent number
6,261,671
Issue date
Jul 17, 2001
Ibiden Co., Ltd.
Motoo Asai
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Adhesive for electroless plating, raw material composition for prep...
Patent number
6,248,428
Issue date
Jun 19, 2001
Ibiden Co., Ltd.
Motoo Asai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High density multi-layered printed wiring board, multi-chip carrier...
Patent number
5,841,190
Issue date
Nov 24, 1998
Ibiden Co., Ltd.
Kouta Noda
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20120125680
Publication date
May 24, 2012
IBIDEN CO., LTD.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
Publication number
20090145652
Publication date
Jun 11, 2009
IBIDEN CO., LTD.
Honchin En
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20080189943
Publication date
Aug 14, 2008
IBIDEN CO., LTD.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20080173473
Publication date
Jul 24, 2008
IBIDEN CO., LTD.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRIN...
Publication number
20080023815
Publication date
Jan 31, 2008
IBIDEN CO., LTD.
Motoo Asai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRIN...
Publication number
20080014336
Publication date
Jan 17, 2008
IBIDEN CO., LTD.
Motoo Asai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
Publication number
20070266886
Publication date
Nov 22, 2007
IBIDEN CO., LTD.
Honchin En
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Interlayer insulating layer for printed wiring board, printed wirin...
Publication number
20070013049
Publication date
Jan 18, 2007
Ibiden Co., Ltd.
Motoo Asai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printed wiring board and its manufacturing method
Publication number
20040134682
Publication date
Jul 15, 2004
IBIDEN CO., LTD.
Honchin En
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Multilayered printed circuit board and manufacturing method therefor
Publication number
20040025333
Publication date
Feb 12, 2004
IBIDEN CO., LTD.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayered printed circuit board and manufacturing method therefor
Publication number
20010042637
Publication date
Nov 22, 2001
Naohiro Hirose
H01 - BASIC ELECTRIC ELEMENTS