Kraig A. Quinn

Person

Webster, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor module architecture
- Patent number 7,350,712
- Issue date Apr 1, 2008
- Xerox Corporation
- Kraig A. Quinn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mounting and curing chips on a substrate so as to minimize gap
- Patent number 6,752,888
- Issue date Jun 22, 2004
- Xerox Corporation
- Paul A. Hosier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of imaging arrays for large format documents
- Patent number 6,747,259
- Issue date Jun 8, 2004
- Xerox Corporation
- Kraig A. Quinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Construction of scanning or imaging arrays suitable for large docum...
- Patent number 6,252,780
- Issue date Jun 26, 2001
- Xerox Corporation
- Kraig A. Quinn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Replacing semiconductor chips in a full-width chip array
- Patent number 6,165,813
- Issue date Dec 26, 2000
- Xerox Corporation
- Kraig A. Quinn
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wiring board for supporting an array of imaging chips
- Patent number 5,784,258
- Issue date Jul 21, 1998
- Xerox Corporation
- Kraig A. Quinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacing semiconductor chips in a full-width chip array
- Patent number 5,753,959
- Issue date May 19, 1998
- Xerox Corporation
- Kraig A. Quinn
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Butted chip array with beveled chips
- Patent number 5,706,176
- Issue date Jan 6, 1998
- Xerox Corporation
- Kraig A. Quinn
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor wafer divisible into chips for creating or recording...
- Patent number 5,668,400
- Issue date Sep 16, 1997
- Xerox Corporation
- Kraig A. Quinn
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Assembly for mounting semiconductor chips in a full-width-array ima...
- Patent number 5,545,913
- Issue date Aug 13, 1996
- Xerox Corporation
- Kraig A. Quinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full width array read or write bars having low induced thermal stress
- Patent number 5,528,272
- Issue date Jun 18, 1996
- Xerox Corporation
- Kraig A. Quinn
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Process of mounting semiconductor chips in a full-width-array image
- Patent number 5,510,273
- Issue date Apr 23, 1996
- Xerox Corporation
- Kraig A. Quinn
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Photosensitive array wherein chips are not thermally matched to the...
- Patent number 5,473,513
- Issue date Dec 5, 1995
- Xerox Corporation
- Kraig A. Quinn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for minimizing stress between semiconductor chips having a c...
- Patent number 5,272,113
- Issue date Dec 21, 1993
- Xerox Corporation
- Kraig A. Quinn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of fabricating image sensor dies and the like for use in ass...
- Patent number 5,219,796
- Issue date Jun 15, 1993
- Xerox Corporation
- Kraig A. Quinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for separating image sensor dies and the like from a wafer...
- Patent number 5,128,282
- Issue date Jul 7, 1992
- Xerox Corporation
- Brian T. Ormond
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Image sensor module architecture
- Publication number 20060219790
- Publication date Oct 5, 2006
- Xerox Corporation.
- Kraig A. Quinn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Mounting and curing chips on a substrate so as to minimize gap
- Publication number 20030106208
- Publication date Jun 12, 2003
- Xerox Corporation.
- Paul A. Hosier
- H01 - BASIC ELECTRIC ELEMENTS

Kraig A. Quinn

Person

Patents Grantslast 30 patents

Image sensor module architecture

Mounting and curing chips on a substrate so as to minimize gap

Assembly of imaging arrays for large format documents

Construction of scanning or imaging arrays suitable for large docum...

Replacing semiconductor chips in a full-width chip array

Wiring board for supporting an array of imaging chips

Replacing semiconductor chips in a full-width chip array

Butted chip array with beveled chips

Semiconductor wafer divisible into chips for creating or recording...

Assembly for mounting semiconductor chips in a full-width-array ima...

Full width array read or write bars having low induced thermal stress

Process of mounting semiconductor chips in a full-width-array image

Photosensitive array wherein chips are not thermally matched to the...

Method for minimizing stress between semiconductor chips having a c...

Method of fabricating image sensor dies and the like for use in ass...

Process for separating image sensor dies and the like from a wafer...

Patents Applicationslast 30 patents

Image sensor module architecture

Mounting and curing chips on a substrate so as to minimize gap