Kris A. Slesinger

Person

Charlotte, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for determining component dimensional information
- Patent number 6,633,663
- Issue date Oct 14, 2003
- International Business Machines Corporation
- Kris A. Slesinger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and composition for mounting an electronic component and dev...
- Patent number 6,589,376
- Issue date Jul 8, 2003
- International Business Machines Corporation
- John G. Davis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for mounting an electronic component and dev...
- Patent number 6,590,285
- Issue date Jul 8, 2003
- International Business Machines Corporation
- John G. Davis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rework and underfill nozzle for electronic components
- Patent number 6,499,644
- Issue date Dec 31, 2002
- International Business Machines Corporation
- Wilton L. Cox
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer fluxing method and apparatus for component placement on su...
- Patent number 6,471,117
- Issue date Oct 29, 2002
- International Business Machines Corporation
- John Gillette Davis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rework and underfill nozzle for electronic components
- Patent number 6,464,125
- Issue date Oct 15, 2002
- International Business Machines Corporation
- Wilton L. Cox
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rework and underfill nozzle for electronic components
- Patent number 6,457,631
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Wilton L. Cox
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for micro BGA removal and reattach
- Patent number 6,425,515
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Allen Thomas Mays
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro grid array solder interconnection structure with solder colum...
- Patent number 6,380,494
- Issue date Apr 30, 2002
- International Business Machines Corporation
- Allen Thomas Mays
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro grid array solder interconnection structure for second level...
- Patent number 6,340,111
- Issue date Jan 22, 2002
- International Business Machines Corporation
- Allen Thomas Mays
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rework and underfill nozzle for electronic components
- Patent number 6,264,094
- Issue date Jul 24, 2001
- International Business Machines Corporation
- Wilton L. Cox
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rework and underfill nozzle for electronic components
- Patent number 6,220,503
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Wilton L. Cox
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for μBGA removal and reattach
- Patent number 6,196,439
- Issue date Mar 6, 2001
- International Business Machines Corporation
- Allen Thomas Mays
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro grid array solder interconnection structure for second level...
- Patent number 6,059,173
- Issue date May 9, 2000
- International Business Machines Corporation
- Allen Thomas Mays
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer fluxing method and apparatus for component placement on su...
- Patent number 6,039,805
- Issue date Mar 21, 2000
- International Business Machines Corporation
- John Gillette Davis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated placement and soldering pickup head and method of using
- Patent number 6,016,949
- Issue date Jan 25, 2000
- International Business Machines Corporation
- Kris Allan Slesinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and composition for mounting an electronic component and dev...
- Publication number 20040003882
- Publication date Jan 8, 2004
- John G. Davis
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Rework and underfill nozzle for electronic components
- Publication number 20020117535
- Publication date Aug 29, 2002
- Wilton L. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO GRID ARRAY SOLDER INTERCONNECTION STRUCTURE WITH SOLDER COLUM...
- Publication number 20020029901
- Publication date Mar 14, 2002
- Allen Thomas Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for muBGA removal and reattach
- Publication number 20010017313
- Publication date Aug 30, 2001
- International Business Machines Corporation
- Allen Thomas Mays
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rework and underfill nozzle for electronic components
- Publication number 20010006185
- Publication date Jul 5, 2001
- Wilton L. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rework and underfill nozzle for electronic components
- Publication number 20010004990
- Publication date Jun 28, 2001
- Wilton L. Cox
- H01 - BASIC ELECTRIC ELEMENTS

Kris A. Slesinger

Person

Patents Grantslast 30 patents

Method and system for determining component dimensional information

Method and composition for mounting an electronic component and dev...

Method and composition for mounting an electronic component and dev...

Rework and underfill nozzle for electronic components

Transfer fluxing method and apparatus for component placement on su...

Rework and underfill nozzle for electronic components

Rework and underfill nozzle for electronic components

Method and apparatus for micro BGA removal and reattach

Micro grid array solder interconnection structure with solder colum...

Micro grid array solder interconnection structure for second level...

Rework and underfill nozzle for electronic components

Rework and underfill nozzle for electronic components

Method and apparatus for &#x03BC;BGA removal and reattach

Micro grid array solder interconnection structure for second level...

Transfer fluxing method and apparatus for component placement on su...

Integrated placement and soldering pickup head and method of using

Patents Applicationslast 30 patents

Method and composition for mounting an electronic component and dev...

Rework and underfill nozzle for electronic components

MICRO GRID ARRAY SOLDER INTERCONNECTION STRUCTURE WITH SOLDER COLUM...

Method and apparatus for muBGA removal and reattach

Rework and underfill nozzle for electronic components

Rework and underfill nozzle for electronic components

Method and apparatus for μBGA removal and reattach