Kris Frutschy

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assembly including built-in thermoelectric cooler a...
- Patent number 8,686,277
- Issue date Apr 1, 2014
- Intel Corporation
- Mohammad M. Farahani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge clip with reinforced stiffener
- Patent number 7,326,065
- Issue date Feb 5, 2008
- Intel Corporation
- Kris Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for performing die attach using a flame
- Patent number 7,288,472
- Issue date Oct 30, 2007
- Intel Corporation
- Kris J. Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for having the same conductor inserts for signal, power and...
- Patent number 7,077,661
- Issue date Jul 18, 2006
- Intel Corporation
- Tim Renfro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual power supply method and apparatus
- Patent number 6,853,061
- Issue date Feb 8, 2005
- Intel Corporation
- Kris Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bridge clip with reinforced stiffener
- Patent number 6,786,739
- Issue date Sep 7, 2004
- Intel Corporation
- Kris Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct heatpipe attachment to die using center point loading
- Patent number 6,625,022
- Issue date Sep 23, 2003
- Intel Corporation
- Kris Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for package socket with embedded power and ground...
- Patent number 6,584,685
- Issue date Jul 1, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for package socket with embedded power and ground...
- Patent number 6,558,181
- Issue date May 6, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct heatpipe attachment to die using center point loading
- Patent number 6,469,893
- Issue date Oct 22, 2002
- Intel Corporation
- Kris Frutschy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Microelectronic Assembly including Built-In Thermoelectric Cooler a...
- Publication number 20150332987
- Publication date Nov 19, 2015
- Intel Corporation
- Mohammad M. Farahani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assembly including built-in thermoelectric cooler a...
- Publication number 20060137732
- Publication date Jun 29, 2006
- Mohammad M. Farahani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for performing die attach using a flame
- Publication number 20060134830
- Publication date Jun 22, 2006
- Kris J. Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET FOR A MICROELECTRONIC COMPONENT
- Publication number 20050181639
- Publication date Aug 18, 2005
- Tim Renfro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bridge clip with reinforced stiffener
- Publication number 20050015974
- Publication date Jan 27, 2005
- Kris Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual power supply method and apparatus
- Publication number 20040075165
- Publication date Apr 22, 2004
- Kris Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bridge clip with reinforced stiffener
- Publication number 20040063354
- Publication date Apr 1, 2004
- Kris Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for pakage socket with embedded power and ground...
- Publication number 20020115330
- Publication date Aug 22, 2002
- Chee-Yee Chung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
System and method for package socket with embedded power and ground...
- Publication number 20020115313
- Publication date Aug 22, 2002
- Chee-Yee Chung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Direct heatpipe attachment to die using center point loading
- Publication number 20020051341
- Publication date May 2, 2002
- Kris Frutschy
- H01 - BASIC ELECTRIC ELEMENTS

Kris Frutschy

Person

Patents Grantslast 30 patents

Microelectronic assembly including built-in thermoelectric cooler a...

Bridge clip with reinforced stiffener

Method and system for performing die attach using a flame

Socket for having the same conductor inserts for signal, power and...

Dual power supply method and apparatus

Bridge clip with reinforced stiffener

Direct heatpipe attachment to die using center point loading

System and method for package socket with embedded power and ground...

System and method for package socket with embedded power and ground...

Direct heatpipe attachment to die using center point loading

Patents Applicationslast 30 patents

Microelectronic Assembly including Built-In Thermoelectric Cooler a...

Microelectronic assembly including built-in thermoelectric cooler a...

Method and system for performing die attach using a flame

SOCKET FOR A MICROELECTRONIC COMPONENT

Bridge clip with reinforced stiffener

Dual power supply method and apparatus

Bridge clip with reinforced stiffener

System and method for pakage socket with embedded power and ground...

System and method for package socket with embedded power and ground...

Direct heatpipe attachment to die using center point loading