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Kris Lipu Chuang
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Hsinchu City, TW
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,935,871
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240047436
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzuan-Horng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20230378140
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230369263
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kris Lipu Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230307404
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Yu Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20230268260
Publication date
Aug 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kris Lipu Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230060720
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS