TREA

Kris Lipu Chuang

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  • Hsinchu City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250192112
    • Publication date Jun 12, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240413121
    • Publication date Dec 12, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • CHIH-TING LAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
    • Publication number 20240234375
    • Publication date Jul 11, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240047436
    • Publication date Feb 8, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzuan-Horng Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
    • Publication number 20230378140
    • Publication date Nov 23, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230369263
    • Publication date Nov 16, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kris Lipu Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20230307404
    • Publication date Sep 28, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Cheng-Yu Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
    • Publication number 20230268260
    • Publication date Aug 24, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kris Lipu Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    • Publication number 20230060720
    • Publication date Mar 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS