Kris V. Srikrishnan

Person

bothof Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and structure for buried circuits and devices
- Patent number 7,491,588
- Issue date Feb 17, 2009
- International Business Machines Corporation
- John E. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for buried circuits and devices
- Patent number 7,320,918
- Issue date Jan 22, 2008
- International Business Machines Corporation
- John E. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for buried circuits and devices
- Patent number 7,141,853
- Issue date Nov 28, 2006
- International Business Machines Corporation
- John E. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for buried circuits and devices
- Patent number 6,759,282
- Issue date Jul 6, 2004
- International Business Machines Corporation
- John E. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous multiple silicon on insulator (SOI) wafer production
- Patent number 6,326,285
- Issue date Dec 4, 2001
- International Business Machines Corporation
- Alex A. Behfar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for restoring rejected wafers in line for reuse as new
- Patent number 5,920,764
- Issue date Jul 6, 1999
- International Business Machines Corporation
- David R. Hanson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio low resistivity lines/vias by surface diffusion
- Patent number 5,897,370
- Issue date Apr 27, 1999
- International Business Machines Corporation
- Rajiv Vasant Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart-cut process for the production of thin semiconductor material...
- Patent number 5,882,987
- Issue date Mar 16, 1999
- International Business Machines Corporation
- Kris V. Srikrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating high aspect ratio low resistivity lines/vias...
- Patent number 5,877,084
- Issue date Mar 2, 1999
- International Business Machines Corporation
- Rajiv Vasant Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio low resistivity lines/vias by surface diffusion
- Patent number 5,856,026
- Issue date Jan 5, 1999
- International Business Machines Corporation
- Rajiv Vasant Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complete chip I/O test through low contact testing using enhanced b...
- Patent number 5,787,098
- Issue date Jul 28, 1998
- International Business Machines Corporation
- Sumit DasGupta
- G01 - MEASURING TESTING
Information Patent Grant
High aspect ratio low resistivity lines/vias with a tungsten-german...
- Patent number 5,731,245
- Issue date Mar 24, 1998
- International Business Machines Corp.
- Rajiv Vasant Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antifuse element with electrical or optical programming
- Patent number 5,485,032
- Issue date Jan 16, 1996
- International Business Machines Corporation
- Dominic J. Schepis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically blowable fuse structure manufacturing for organic insu...
- Patent number 5,469,981
- Issue date Nov 28, 1995
- International Business Machines Corporation
- Kris V. Srikrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making corrosion resistant, low resistivity copper for in...
- Patent number 5,420,069
- Issue date May 30, 1995
- International Business Machines Corporation
- Rajiv V. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically blowable fuse structure for organic insulators
- Patent number 5,389,814
- Issue date Feb 14, 1995
- International Business Machines Corporation
- Kris V. Srikrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aerosol cleaning method
- Patent number 5,372,652
- Issue date Dec 13, 1994
- International Business Machines Corporation
- Kris V. Srikrishnan
- B08 - CLEANING
Information Patent Grant
Chip interconnection having a breathable etch stop layer
- Patent number 5,371,047
- Issue date Dec 6, 1994
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an antifuse element with electrical or optical p...
- Patent number 5,314,840
- Issue date May 24, 1994
- International Business Machines Corporation
- Dominic J. Schepis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip contacts without oxide discontinuities
- Patent number 4,839,715
- Issue date Jun 13, 1989
- International Business Machines Corporation
- Joseph J. Gajda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration lifetime increase of lead base alloys
- Patent number 4,622,205
- Issue date Nov 11, 1986
- IBM Corporation
- David P. Fouts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective coating of metallurgical features of a dielectric substra...
- Patent number 4,493,856
- Issue date Jan 15, 1985
- International Business Machines Corporation
- Ananda H. Kumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film capacitor with a dual bottom electrode structure
- Patent number 4,471,405
- Issue date Sep 11, 1984
- International Business Machines Corporation
- James K. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor with a dual bottom electrode structure
- Patent number 4,423,087
- Issue date Dec 27, 1983
- International Business Machines Corporation
- James K. Howard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and structure for buried circuits and devices
- Publication number 20070128784
- Publication date Jun 7, 2007
- John E. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for valuing intellectual property
- Publication number 20050261927
- Publication date Nov 24, 2005
- Mark R. Bilak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and structure for buried circuits and devices
- Publication number 20050214988
- Publication date Sep 29, 2005
- John E. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for buried circuits and devices
- Publication number 20050029592
- Publication date Feb 10, 2005
- John E. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic mail system for generating a mail message to multiple re...
- Publication number 20020194280
- Publication date Dec 19, 2002
- International Business Machines Corporation
- John J. Altavilla
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and structure for buried circuits and devices
- Publication number 20020185684
- Publication date Dec 12, 2002
- International Business Machines Corporation
- John E. Campbell
- H01 - BASIC ELECTRIC ELEMENTS

Kris V. Srikrishnan

Person

Patents Grantslast 30 patents

Method and structure for buried circuits and devices

Method and structure for buried circuits and devices

Method and structure for buried circuits and devices

Method and structure for buried circuits and devices

Simultaneous multiple silicon on insulator (SOI) wafer production

Process for restoring rejected wafers in line for reuse as new

High aspect ratio low resistivity lines/vias by surface diffusion

Smart-cut process for the production of thin semiconductor material...

Method for fabricating high aspect ratio low resistivity lines/vias...

High aspect ratio low resistivity lines/vias by surface diffusion

Complete chip I/O test through low contact testing using enhanced b...

High aspect ratio low resistivity lines/vias with a tungsten-german...

Antifuse element with electrical or optical programming

Electrically blowable fuse structure manufacturing for organic insu...

Method of making corrosion resistant, low resistivity copper for in...

Electrically blowable fuse structure for organic insulators

Aerosol cleaning method

Chip interconnection having a breathable etch stop layer

Method for forming an antifuse element with electrical or optical p...

Chip contacts without oxide discontinuities

Electromigration lifetime increase of lead base alloys

Selective coating of metallurgical features of a dielectric substra...

Thin film capacitor with a dual bottom electrode structure

Thin film capacitor with a dual bottom electrode structure

Patents Applicationslast 30 patents

Method and structure for buried circuits and devices

System and method for valuing intellectual property

Method and structure for buried circuits and devices

Method and structure for buried circuits and devices

Electronic mail system for generating a mail message to multiple re...

Method and structure for buried circuits and devices