Krishna Bharath

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Computing system with cooling for controlling temperature of electr...
- Patent number 12,342,454
- Issue date Jun 24, 2025
- Microsoft Technology Licensing, LLC
- Unnikrishnan Vadakkanmaru Veedu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors on package substrates
- Patent number 12,336,196
- Issue date Jun 17, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging architecture for disaggregated integrated voltage regulators
- Patent number 12,308,362
- Issue date May 20, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal power delivery structure for direct chip attach architect...
- Patent number 12,288,750
- Issue date Apr 29, 2025
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating voltage regulators and passive circuit elements with to...
- Patent number 12,242,290
- Issue date Mar 4, 2025
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 12,199,018
- Issue date Jan 14, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package embedded magnetic power transformers for SMPS
- Patent number 12,154,710
- Issue date Nov 26, 2024
- Intel Corporation
- Anuj Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery structures
- Patent number 12,087,682
- Issue date Sep 10, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase switching regulators with hybrid inductors and per phas...
- Patent number 12,068,684
- Issue date Aug 20, 2024
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,062,631
- Issue date Aug 13, 2024
- Intel Corporation
- Adel A Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 12,002,745
- Issue date Jun 4, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
- Patent number 11,955,426
- Issue date Apr 9, 2024
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated voltage regulator c...
- Patent number 11,916,006
- Issue date Feb 27, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging with high density interconnects
- Patent number 11,881,457
- Issue date Jan 23, 2024
- Tahoe Research, LTD.
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines with stacked dielect...
- Patent number 11,791,528
- Issue date Oct 17, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial magnetic inductors with pre-fabricated ferrite cores
- Patent number 11,735,535
- Issue date Aug 22, 2023
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated thin film capacitors on a glass core substrate
- Patent number 11,688,729
- Issue date Jun 27, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-in-via structure for high density package integrated inductor
- Patent number 11,676,950
- Issue date Jun 13, 2023
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic core inductors on glass core substrates
- Patent number 11,538,617
- Issue date Dec 27, 2022
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including fully integrated voltage regulator circuitry with...
- Patent number 11,527,483
- Issue date Dec 13, 2022
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated voltage regulator c...
- Patent number 11,462,463
- Issue date Oct 4, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having magnetic core inductors
- Patent number 11,450,560
- Issue date Sep 20, 2022
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dies with integrated voltage regulators
- Patent number 11,417,593
- Issue date Aug 16, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer embedded magnetic inductor coil
- Patent number 11,404,364
- Issue date Aug 2, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
- Patent number 11,393,751
- Issue date Jul 19, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level distributed clamps
- Patent number 11,380,652
- Issue date Jul 5, 2022
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cross-domain power transfer voltage regulators
- Patent number 11,353,900
- Issue date Jun 7, 2022
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines having l-shaped cros...
- Patent number 11,329,358
- Issue date May 10, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 11,227,825
- Issue date Jan 18, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20240355768
- Publication date Oct 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES
- Publication number 20240355725
- Publication date Oct 24, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING SYSTEM WITH COOLING FOR CONTROLLING TEMPERATURE OF ELECTR...
- Publication number 20230397325
- Publication date Dec 7, 2023
- Microsoft Technology Licensing, LLC
- Unnikrishnan VADAKKANMARU VEEDU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAINED DISAGGREGATED SERVER ARCHITECTURE
- Publication number 20230187407
- Publication date Jun 15, 2023
- Intel Corporation
- Carleton L. Molnar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY THROUGH CAPACITOR-DIES IN A MULTI-LAYERED MICROELECT...
- Publication number 20230163098
- Publication date May 25, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MAGNETIC INDUCTOR AND METHOD
- Publication number 20230162902
- Publication date May 25, 2023
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES
- Publication number 20230096368
- Publication date Mar 30, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURE FOR DIRECT CHIP ATTACH ARCHITEC...
- Publication number 20230097714
- Publication date Mar 30, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING VOLTAGE REGULATORS AND PASSIVE CIRCUIT ELEMENTS WITH TO...
- Publication number 20230095063
- Publication date Mar 30, 2023
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES
- Publication number 20230095608
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES
- Publication number 20230095654
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-BUILT MAGNETIC INDUCTOR SCHEMES FOR GLASS CORE SUBSTRATES
- Publication number 20230089093
- Publication date Mar 23, 2023
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS
- Publication number 20230060727
- Publication date Mar 2, 2023
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS
- Publication number 20230068300
- Publication date Mar 2, 2023
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO PROVIDE PASSIVATION STRUCTURES OF A M...
- Publication number 20220406512
- Publication date Dec 22, 2022
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED VOLTAGE REGULATOR C...
- Publication number 20220406701
- Publication date Dec 22, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND MAGNETIC CORE...
- Publication number 20220375865
- Publication date Nov 24, 2022
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE
- Publication number 20220310512
- Publication date Sep 29, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS
- Publication number 20220231394
- Publication date Jul 21, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEPPED COAX MIL PTHS FOR MODULATING INDUCTANCE WITHIN A PACKAGE
- Publication number 20220102055
- Publication date Mar 31, 2022
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS
- Publication number 20220102261
- Publication date Mar 31, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PHASE SWITCHING REGULATORS WITH HYBRID INDUCTORS AND PER PHAS...
- Publication number 20220094263
- Publication date Mar 24, 2022
- Intel Corporation
- Krishna BHARATH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20220093546
- Publication date Mar 24, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
- Publication number 20220093492
- Publication date Mar 24, 2022
- Intel Corporation
- Adel A. Elsherbini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE EMBEDDED MAGNETIC POWER TRANSFORMERS FOR SMPS
- Publication number 20220093314
- Publication date Mar 24, 2022
- Intel Corporation
- Anuj MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE INDUCTORS IN INTERPOSER
- Publication number 20220093536
- Publication date Mar 24, 2022
- Intel Corporation
- Krishna BHARATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE AND VR CHIPLET WITH DUAL-SIDED AND UNIDIRECTIONAL CURRE...
- Publication number 20220093565
- Publication date Mar 24, 2022
- Intel Corporation
- Kaladhar RADHAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES
- Publication number 20210398895
- Publication date Dec 23, 2021
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH HIGH DENSITY INTERCONNECTS
- Publication number 20210193583
- Publication date Jun 24, 2021
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION IN INTEGRATED CIRCUITS
- Publication number 20210193595
- Publication date Jun 24, 2021
- Intel Corporation
- Adel A. Elsherbini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Krishna Bharath

Person

Patents Grantslast 30 patents

Computing system with cooling for controlling temperature of electr...

Magnetic core inductors on package substrates

Packaging architecture for disaggregated integrated voltage regulators

Conformal power delivery structure for direct chip attach architect...

Integrating voltage regulators and passive circuit elements with to...

Magnetic core inductors in interposer

Direct bonding in microelectronic assemblies

Package embedded magnetic power transformers for SMPS

Power delivery structures

Multi-phase switching regulators with hybrid inductors and per phas...

Microelectronic assemblies with inductors in direct bonding regions

High performance integrated RF passives using dual lithography process

Package-integrated multi-turn coil embedded in a package magnetic core

Microelectronic assemblies having an integrated voltage regulator c...

Semiconductor packaging with high density interconnects

Low loss and low cross talk transmission lines with stacked dielect...

Coaxial magnetic inductors with pre-fabricated ferrite cores

Integrated thin film capacitors on a glass core substrate

Via-in-via structure for high density package integrated inductor

Integrated magnetic core inductors on glass core substrates

Package including fully integrated voltage regulator circuitry with...

Microelectronic assemblies having an integrated voltage regulator c...

Microelectronic assemblies having magnetic core inductors

Dies with integrated voltage regulators

Multi-layer embedded magnetic inductor coil

Package-integrated multi-turn coil embedded in a package magnetic core

Multi-level distributed clamps

Integrated cross-domain power transfer voltage regulators

Low loss and low cross talk transmission lines having l-shaped cros...

High performance integrated RF passives using dual lithography process

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

POWER DELIVERY STRUCTURES

COMPUTING SYSTEM WITH COOLING FOR CONTROLLING TEMPERATURE OF ELECTR...

FINE-GRAINED DISAGGREGATED SERVER ARCHITECTURE

POWER DELIVERY THROUGH CAPACITOR-DIES IN A MULTI-LAYERED MICROELECT...

STACKED MAGNETIC INDUCTOR AND METHOD

IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES

CONFORMAL POWER DELIVERY STRUCTURE FOR DIRECT CHIP ATTACH ARCHITEC...

INTEGRATING VOLTAGE REGULATORS AND PASSIVE CIRCUIT ELEMENTS WITH TO...

CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES

CONFORMAL POWER DELIVERY STRUCTURES

IN-BUILT MAGNETIC INDUCTOR SCHEMES FOR GLASS CORE SUBSTRATES

PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS

PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS

DEVICE, METHOD, AND SYSTEM TO PROVIDE PASSIVATION STRUCTURES OF A M...

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED VOLTAGE REGULATOR C...

MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND MAGNETIC CORE...

PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE

LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS

STEPPED COAX MIL PTHS FOR MODULATING INDUCTANCE WITHIN A PACKAGE

HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS

MULTI-PHASE SWITCHING REGULATORS WITH HYBRID INDUCTORS AND PER PHAS...

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

PACKAGE EMBEDDED MAGNETIC POWER TRANSFORMERS FOR SMPS

MAGNETIC CORE INDUCTORS IN INTERPOSER

STACKED DIE AND VR CHIPLET WITH DUAL-SIDED AND UNIDIRECTIONAL CURRE...

POWER DELIVERY STRUCTURES

SEMICONDUCTOR PACKAGING WITH HIGH DENSITY INTERCONNECTS

ELECTROSTATIC DISCHARGE PROTECTION IN INTEGRATED CIRCUITS