Krishna Darbha

Person

Kirkland, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to accommodate increase in volume expansion during solder re...
- Patent number 7,703,199
- Issue date Apr 27, 2010
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of accommodating in volume expansion during solder reflow
- Patent number 7,086,147
- Issue date Aug 8, 2006
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
- Patent number 6,989,607
- Issue date Jan 24, 2006
- International Business Machines Corporation
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array stiffener for use with flexible chip carriers
- Patent number 6,905,961
- Issue date Jun 14, 2005
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to accommodate increase in volume expansion during solder...
- Patent number 6,686,664
- Issue date Feb 3, 2004
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Negative volume expansion lead-free electrical connection
- Patent number 6,649,833
- Issue date Nov 18, 2003
- International Business Machines Corporation
- David V. Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
- Patent number 6,639,302
- Issue date Oct 28, 2003
- International Business Machines Corporation
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with thermally conductive standoff
- Patent number 6,631,078
- Issue date Oct 7, 2003
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink structure with pyramidic and base-plate cut-outs
- Patent number 6,622,786
- Issue date Sep 23, 2003
- International Business Machines Corporation
- Varaprasad V. Calmidi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Land grid array stiffener use with flexible chip carriers
- Patent number 6,528,892
- Issue date Mar 4, 2003
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20060208030
- Publication date Sep 21, 2006
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20040183094
- Publication date Sep 23, 2004
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
- Publication number 20040021205
- Publication date Feb 5, 2004
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS REDUCTION IN FLIP-CHIP PBGA PACKAGING BY UTILIZING SEGMENTED...
- Publication number 20030178649
- Publication date Sep 25, 2003
- International Business Machines Corporation
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH THERMALLY CONDUCTIVE STANDOFF
- Publication number 20030129863
- Publication date Jul 10, 2003
- International Business Machines Corporation
- David J. Alcoe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Land grid array stiffener for use with flexible chip carriers
- Publication number 20030090000
- Publication date May 15, 2003
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array stiffener use with flexible chip carriers
- Publication number 20020180061
- Publication date Dec 5, 2002
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20020158110
- Publication date Oct 31, 2002
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS

Krishna Darbha

Person

Patents Grantslast 30 patents

Method to accommodate increase in volume expansion during solder re...

Method of accommodating in volume expansion during solder reflow

Stress reduction in flip-chip PBGA packaging by utilizing segmented...

Land grid array stiffener for use with flexible chip carriers

Structure to accommodate increase in volume expansion during solder...

Negative volume expansion lead-free electrical connection

Stress reduction in flip-chip PBGA packaging by utilizing segmented...

Electronic package with thermally conductive standoff

Heat sink structure with pyramidic and base-plate cut-outs

Land grid array stiffener use with flexible chip carriers

Patents Applicationslast 30 patents

Structure to accommodate increase in volume expansion during solder...

Structure to accommodate increase in volume expansion during solder...

Stress reduction in flip-chip PBGA packaging by utilizing segmented...

STRESS REDUCTION IN FLIP-CHIP PBGA PACKAGING BY UTILIZING SEGMENTED...

ELECTRONIC PACKAGE WITH THERMALLY CONDUCTIVE STANDOFF

Land grid array stiffener for use with flexible chip carriers

Land grid array stiffener use with flexible chip carriers

Structure to accommodate increase in volume expansion during solder...