Krishna R. Tunga

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Asymmetric die bonding
- Patent number 11,784,160
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 11,756,911
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internet of things (IoT) real-time response to defined symptoms
- Patent number 11,744,981
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Mahmoud Amin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mitigating cooldown peeling stress during chip package assembly
- Patent number 11,545,444
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated stiffener to control the warpage of electronic chip carriers
- Patent number 11,302,651
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Language learning and speech enhancement through natural language p...
- Patent number 11,302,205
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Mahmoud Amin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enlarged conductive pad structures for enhanced chip bond assembly...
- Patent number 11,282,773
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Krishna R. Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating thermal-mechanical strain and warpage of an organic lami...
- Patent number 11,239,183
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Behavior-based interactive educational sessions
- Patent number 11,210,968
- Issue date Dec 28, 2021
- International Business Machines Corporation
- Lawrence A. Clevenger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Internet of things (IOT) real-time response to defined symptoms
- Patent number 11,185,658
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Mahmoud Amin
- G08 - SIGNALLING
Information Patent Grant
Mitigating cracking within integrated circuit (IC) device carrier
- Patent number 10,985,129
- Issue date Apr 20, 2021
- International Business Machines Corporation
- Thomas E. Lombardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free column interconnect
- Patent number 10,950,573
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Language learning and speech enhancement through natural language p...
- Patent number 10,916,154
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Mahmoud Amin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Managing thermal warpage of a laminate
- Patent number 10,832,987
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multipart lid for a semiconductor package with multiple components
- Patent number 10,777,482
- Issue date Sep 15, 2020
- ELPIS TECHNOLOGIES INC.
- Charles L. Arvin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Connected plane stiffener within integrated circuit chip carrier
- Patent number 10,770,385
- Issue date Sep 8, 2020
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor stiffener
- Patent number 10,756,031
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package cover having underside rib
- Patent number 10,665,524
- Issue date May 26, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic package
- Patent number 10,636,746
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 10,622,319
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package cover having underside rib
- Patent number 10,622,275
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 10,593,639
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control warpage in a semiconductor chip package
- Patent number 10,541,211
- Issue date Jan 21, 2020
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized individual sleep patterns
- Patent number 10,426,400
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Mahmoud Amin
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronic package with tapered pedestal
- Patent number 10,424,527
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized individual sleep patterns
- Patent number 10,420,502
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Mahmoud Amin
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Test cell for laminate and method
- Patent number 10,381,276
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal pad modification
- Patent number 10,373,925
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multipart lid for a semiconductor package with multiple components
- Patent number 10,325,830
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Charles L. Arvin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Reduction of solder interconnect stress
- Patent number 10,276,534
- Issue date Apr 30, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MITIGATING COOLDOWN PEELING STRESS DURING CHIP PACKAGE ASSEMBLY
- Publication number 20220208693
- Publication date Jun 30, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC DIE BONDING
- Publication number 20220093556
- Publication date Mar 24, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNET OF THINGS (IOT) REAL-TIME RESPONSE TO DEFINED SYMPTOMS
- Publication number 20220032000
- Publication date Feb 3, 2022
- International Business Machines Corporation
- Mahmoud Amin
- G08 - SIGNALLING
Information Patent Application
ENLARGED CONDUCTIVE PAD STRUCTURES FOR ENHANCED CHIP BOND ASSEMBLY...
- Publication number 20210320056
- Publication date Oct 14, 2021
- International Business Machines Corporation
- Krishna R. Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...
- Publication number 20210242139
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANGUAGE LEARNING AND SPEECH ENHANCEMENT THROUGH NATURAL LANGUAGE P...
- Publication number 20210110727
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Mahmoud Amin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Mitigating Cracking Within Integrated Circuit (IC) Device Carrier
- Publication number 20200328177
- Publication date Oct 15, 2020
- Thomas E. Lombardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE COLUMN INTERCONNECT
- Publication number 20200303339
- Publication date Sep 24, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COGNITIVE COMPUTING DEVICE FOR PREDICTING AN OPTIMAL STRATEGY IN CO...
- Publication number 20200160228
- Publication date May 21, 2020
- International Business Machines Corporation
- Mahmoud Amin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BEHAVIOR-BASED INTERACTIVE EDUCATIONAL SESSIONS
- Publication number 20200090542
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Lawrence A. Clevenger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERNET OF THINGS (IOT) REAL-TIME RESPONSE TO DEFINED SYMPTOMS
- Publication number 20200066127
- Publication date Feb 27, 2020
- International Business Machines Corporation
- Mahmoud Amin
- G08 - SIGNALLING
Information Patent Application
COGNITIVE TOOL FOR TEACHING GENERLIZATION OF OBJECTS TO A PERSON
- Publication number 20200051447
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Krishna R. Tunga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Connected Plane Stiffener Within Integrated Circuit Chip Carrier
- Publication number 20200035593
- Publication date Jan 30, 2020
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
- Publication number 20200013732
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Kamal K. SIKKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZED INDIVIDUAL SLEEP PATTERNS
- Publication number 20190357843
- Publication date Nov 28, 2019
- International Business Machines Corporation
- MAHMOUD AMIN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MANAGING THERMAL WARPAGE OF A LAMINATE
- Publication number 20190295921
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PAD MODIFICATION
- Publication number 20190295978
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
- Publication number 20190267332
- Publication date Aug 29, 2019
- International Business Machines Corporation
- Kamal K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS
- Publication number 20190259683
- Publication date Aug 22, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METAL PAD MODIFICATION
- Publication number 20190244923
- Publication date Aug 8, 2019
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS
- Publication number 20190164864
- Publication date May 30, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC PACKAGE WITH TAPERED PEDESTAL
- Publication number 20190148260
- Publication date May 16, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANGUAGE LEARNING AND SPEECH ENHANCEMENT THROUGH NATURAL LANGUAGE P...
- Publication number 20190122574
- Publication date Apr 25, 2019
- International Business Machines Corporation
- Mahmoud Amin
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
METAL PAD MODIFICATION
- Publication number 20190006304
- Publication date Jan 3, 2019
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED INDIVIDUAL SLEEP PATTERNS
- Publication number 20180368756
- Publication date Dec 27, 2018
- International Business Machines Corporation
- MAHMOUD AMIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTIMIZED INDIVIDUAL SLEEP PATTERNS
- Publication number 20180368757
- Publication date Dec 27, 2018
- International Business Machines Corporation
- MAHMOUD AMIN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CONTROL WARPAGE IN A SEMICONDUCTOR CHIP PACKAGE
- Publication number 20180301355
- Publication date Oct 18, 2018
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINAL PASSIVATION FOR WAFER LEVEL WARPAGE AND ULK STRESS REDUCTION
- Publication number 20180108626
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE COVER HAVING UNDERSIDE RIB
- Publication number 20180082919
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE COVER HAVING UNDERSIDE RIB
- Publication number 20180082922
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS

Krishna R. Tunga

Person

Patents Grantslast 30 patents

Asymmetric die bonding

Metal pad modification

Internet of things (IoT) real-time response to defined symptoms

Mitigating cooldown peeling stress during chip package assembly

Laminated stiffener to control the warpage of electronic chip carriers

Language learning and speech enhancement through natural language p...

Enlarged conductive pad structures for enhanced chip bond assembly...

Mitigating thermal-mechanical strain and warpage of an organic lami...

Behavior-based interactive educational sessions

Internet of things (IOT) real-time response to defined symptoms

Mitigating cracking within integrated circuit (IC) device carrier

Lead-free column interconnect

Language learning and speech enhancement through natural language p...

Managing thermal warpage of a laminate

Multipart lid for a semiconductor package with multiple components

Connected plane stiffener within integrated circuit chip carrier

Decoupling capacitor stiffener

Electronic package cover having underside rib

Method of forming an electronic package

Final passivation for wafer level warpage and ULK stress reduction

Electronic package cover having underside rib

Metal pad modification

Control warpage in a semiconductor chip package

Optimized individual sleep patterns

Electronic package with tapered pedestal

Optimized individual sleep patterns

Test cell for laminate and method

Metal pad modification

Multipart lid for a semiconductor package with multiple components

Reduction of solder interconnect stress

Patents Applicationslast 30 patents

MITIGATING COOLDOWN PEELING STRESS DURING CHIP PACKAGE ASSEMBLY

ASYMMETRIC DIE BONDING

INTERNET OF THINGS (IOT) REAL-TIME RESPONSE TO DEFINED SYMPTOMS

ENLARGED CONDUCTIVE PAD STRUCTURES FOR ENHANCED CHIP BOND ASSEMBLY...

MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...

LANGUAGE LEARNING AND SPEECH ENHANCEMENT THROUGH NATURAL LANGUAGE P...

Mitigating Cracking Within Integrated Circuit (IC) Device Carrier

LEAD-FREE COLUMN INTERCONNECT

COGNITIVE COMPUTING DEVICE FOR PREDICTING AN OPTIMAL STRATEGY IN CO...

BEHAVIOR-BASED INTERACTIVE EDUCATIONAL SESSIONS

INTERNET OF THINGS (IOT) REAL-TIME RESPONSE TO DEFINED SYMPTOMS

COGNITIVE TOOL FOR TEACHING GENERLIZATION OF OBJECTS TO A PERSON

Connected Plane Stiffener Within Integrated Circuit Chip Carrier

LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS

OPTIMIZED INDIVIDUAL SLEEP PATTERNS

MANAGING THERMAL WARPAGE OF A LAMINATE

METAL PAD MODIFICATION

LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS

MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS

METAL PAD MODIFICATION

MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS

ELECTRONIC PACKAGE WITH TAPERED PEDESTAL

LANGUAGE LEARNING AND SPEECH ENHANCEMENT THROUGH NATURAL LANGUAGE P...

METAL PAD MODIFICATION

OPTIMIZED INDIVIDUAL SLEEP PATTERNS

OPTIMIZED INDIVIDUAL SLEEP PATTERNS

CONTROL WARPAGE IN A SEMICONDUCTOR CHIP PACKAGE

FINAL PASSIVATION FOR WAFER LEVEL WARPAGE AND ULK STRESS REDUCTION

ELECTRONIC PACKAGE COVER HAVING UNDERSIDE RIB

ELECTRONIC PACKAGE COVER HAVING UNDERSIDE RIB