Krishna Seshan

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ball-limiting metallurgies, solder bump compositions used therewith...
- Patent number 7,960,831
- Issue date Jun 14, 2011
- Intel Corporation
- Fay Hua
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power gridding scheme
- Patent number 7,511,370
- Issue date Mar 31, 2009
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable decoupling capacitors for integrated circuits and associ...
- Patent number 7,425,458
- Issue date Sep 16, 2008
- Intel Corporation
- Krishna Seshan
- G01 - MEASURING TESTING
Information Patent Grant
Isolation structure configurations for modifying stresses in semico...
- Patent number 7,411,269
- Issue date Aug 12, 2008
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure configurations for modifying stresses in semico...
- Patent number 7,410,858
- Issue date Aug 12, 2008
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-limiting metallurgies, solder bump compositions used therewith...
- Patent number 7,314,819
- Issue date Jan 1, 2008
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to make a weight compensating/tuning layer on a substrate
- Patent number 7,262,070
- Issue date Aug 28, 2007
- Intel Corporation
- Theodore Doros
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a linearized output driver and terminator
- Patent number 7,250,333
- Issue date Jul 31, 2007
- Intel Corporation
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor passivation deposition process for interfacial adhesion
- Patent number 7,202,568
- Issue date Apr 10, 2007
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a cap above a metal layer
- Patent number 7,056,817
- Issue date Jun 6, 2006
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming segmented ball limiting metallurgy
- Patent number 7,033,923
- Issue date Apr 25, 2006
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with segmented ball limiting metallurgy
- Patent number 7,034,402
- Issue date Apr 25, 2006
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode and transistor design for high speed I/O
- Patent number 7,012,304
- Issue date Mar 14, 2006
- Intel Corporation
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power gridding scheme
- Patent number 6,979,896
- Issue date Dec 27, 2005
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable decoupling capacitors for integrated circuit and methods...
- Patent number 6,937,458
- Issue date Aug 30, 2005
- Intel Corporation
- Krishna Seshan
- G01 - MEASURING TESTING
Information Patent Grant
Power gridding scheme
- Patent number 6,930,379
- Issue date Aug 16, 2005
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a moat around an active pixel area of a micr...
- Patent number 6,914,658
- Issue date Jul 5, 2005
- Intel Corporation
- Krishna Seshan
- G02 - OPTICS
Information Patent Grant
Isolation structure configurations for modifying stresses in semico...
- Patent number 6,876,053
- Issue date Apr 5, 2005
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 6,734,544
- Issue date May 11, 2004
- Intel Corporation
- Soupin Yan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bond process flow for copper metal-six, structures achieved th...
- Patent number 6,715,663
- Issue date Apr 6, 2004
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable decoupling capacitors for integrated circuit and methods...
- Patent number 6,686,659
- Issue date Feb 3, 2004
- Intel Corporation
- Krishna Seshan
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for a linearized output driver and terminator
- Patent number 6,646,324
- Issue date Nov 11, 2003
- Intel Corporation
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to mechanically stabilize isolated top-level metal lines
- Patent number 6,614,118
- Issue date Sep 2, 2003
- Intel Corporation
- Eric Selvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mobile computer having a housing with openings for cooling
- Patent number 6,577,502
- Issue date Jun 10, 2003
- Intel Corporation
- Eric DiStefano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package
- Patent number 6,552,425
- Issue date Apr 22, 2003
- Intel Corporation
- Soupin Yan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball limiting metallurgy for input/outputs and methods of fabrication
- Patent number 6,521,996
- Issue date Feb 18, 2003
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passivation process, probe geometry and probing process
- Patent number 6,515,358
- Issue date Feb 4, 2003
- Intel Corporation
- M. Lawrence A. Dass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly and cooling thereof
- Patent number 6,480,385
- Issue date Nov 12, 2002
- Intel Corporation
- Krishna Seshan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to reduce timing skews in I/O circuits and clock drivers cau...
- Patent number 6,480,059
- Issue date Nov 12, 2002
- Intel Corporation
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mobile computer having a housing with openings for cooling
- Patent number 6,459,573
- Issue date Oct 1, 2002
- Intel Corporation
- Eric DiStefano
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Microelectronic die having electrical connections to allow testing...
- Publication number 20080078994
- Publication date Apr 3, 2008
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL-LIMITING METALLURGIES, SOLDER BUMP COMPOSITIONS USED THEREWITH...
- Publication number 20070284741
- Publication date Dec 13, 2007
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Frequency tuning of film bulk acoustic resonators (FBAR)
- Publication number 20070139140
- Publication date Jun 21, 2007
- Valluri R. Rao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Isolation structure configurations for modifying stresses in semico...
- Publication number 20070013023
- Publication date Jan 18, 2007
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball-limiting metallurgies, solder bump compositions used therewith...
- Publication number 20070004086
- Publication date Jan 4, 2007
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation structure configurations for modifying stresses in semico...
- Publication number 20060220147
- Publication date Oct 5, 2006
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a cap above a metal layer
- Publication number 20060180945
- Publication date Aug 17, 2006
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball limiting metallurgy split into segments
- Publication number 20060131748
- Publication date Jun 22, 2006
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power gridding scheme
- Publication number 20060033197
- Publication date Feb 16, 2006
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power gridding scheme
- Publication number 20060033211
- Publication date Feb 16, 2006
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable decoupling capacitors for integrated circuits and associ...
- Publication number 20050247931
- Publication date Nov 10, 2005
- Intel Corporation
- Krishna Seshan
- G01 - MEASURING TESTING
Information Patent Application
Isolation structure configurations for modifying stresses in semico...
- Publication number 20050179109
- Publication date Aug 18, 2005
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming segmented ball limiting metallurgy
- Publication number 20050158980
- Publication date Jul 21, 2005
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to make a weight compensating/tuning layer on a substrate
- Publication number 20050070119
- Publication date Mar 31, 2005
- Theodore Doros
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wire-bond process flow for copper metal-six, structures achieved th...
- Publication number 20040192019
- Publication date Sep 30, 2004
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating microelectronic image projection devices
- Publication number 20040125247
- Publication date Jul 1, 2004
- Krishna Seshan
- G02 - OPTICS
Information Patent Application
Selectable decoupling capacitors for integrated circuit and methods...
- Publication number 20040108596
- Publication date Jun 10, 2004
- Intel Corporation
- Krishna Seshan
- G01 - MEASURING TESTING
Information Patent Application
Forming a cap above a metal layer
- Publication number 20040094836
- Publication date May 20, 2004
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power gridding scheme
- Publication number 20040065948
- Publication date Apr 8, 2004
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for a linearized output driver and terminator
- Publication number 20040038475
- Publication date Feb 26, 2004
- Intel Corporation
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures to mechanically stabilize isolated top-level metal lines
- Publication number 20040009657
- Publication date Jan 15, 2004
- Eric Selvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package
- Publication number 20030155640
- Publication date Aug 21, 2003
- Intel Corporation
- Soupin Yan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wire-bond process flow for copper metal-six, structures achieved th...
- Publication number 20030132766
- Publication date Jul 17, 2003
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power gridding scheme
- Publication number 20030080406
- Publication date May 1, 2003
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable decoupling capacitors for integrated circuit and methods...
- Publication number 20020119583
- Publication date Aug 29, 2002
- Intel Corporation
- Krishna Seshan
- G01 - MEASURING TESTING
Information Patent Application
Ball limiting metallurgy for input/outputs and methods of fabrication
- Publication number 20020079576
- Publication date Jun 27, 2002
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor passivation deposition process for interfacial adhesion
- Publication number 20020050629
- Publication date May 2, 2002
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly and cooling thereof
- Publication number 20020048153
- Publication date Apr 25, 2002
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE TIMING SKEWS IN I/O CIRCUITS AND CLOCK DRIVERS CAU...
- Publication number 20020044011
- Publication date Apr 18, 2002
- SANJAY DABRAL
- G06 - COMPUTING CALCULATING COUNTING

Krishna Seshan

Person

Patents Grantslast 30 patents

Ball-limiting metallurgies, solder bump compositions used therewith...

Power gridding scheme

Selectable decoupling capacitors for integrated circuits and associ...

Isolation structure configurations for modifying stresses in semico...

Isolation structure configurations for modifying stresses in semico...

Ball-limiting metallurgies, solder bump compositions used therewith...

Method to make a weight compensating/tuning layer on a substrate

Method of fabricating a linearized output driver and terminator

Semiconductor passivation deposition process for interfacial adhesion

Forming a cap above a metal layer

Method of forming segmented ball limiting metallurgy

Device with segmented ball limiting metallurgy

Diode and transistor design for high speed I/O

Power gridding scheme

Selectable decoupling capacitors for integrated circuit and methods...

Power gridding scheme

Method for fabricating a moat around an active pixel area of a micr...

Isolation structure configurations for modifying stresses in semico...

Integrated circuit package

Wire-bond process flow for copper metal-six, structures achieved th...

Selectable decoupling capacitors for integrated circuit and methods...

Method and apparatus for a linearized output driver and terminator

Structures to mechanically stabilize isolated top-level metal lines

Mobile computer having a housing with openings for cooling

Integrated circuit package

Ball limiting metallurgy for input/outputs and methods of fabrication

Integrated passivation process, probe geometry and probing process

Electronic assembly and cooling thereof

Method to reduce timing skews in I/O circuits and clock drivers cau...

Mobile computer having a housing with openings for cooling

Patents Applicationslast 30 patents

Microelectronic die having electrical connections to allow testing...

BALL-LIMITING METALLURGIES, SOLDER BUMP COMPOSITIONS USED THEREWITH...

Frequency tuning of film bulk acoustic resonators (FBAR)

Isolation structure configurations for modifying stresses in semico...

Ball-limiting metallurgies, solder bump compositions used therewith...

Isolation structure configurations for modifying stresses in semico...

Forming a cap above a metal layer

Ball limiting metallurgy split into segments

Power gridding scheme

Power gridding scheme

Selectable decoupling capacitors for integrated circuits and associ...

Isolation structure configurations for modifying stresses in semico...

Method of forming segmented ball limiting metallurgy

Method to make a weight compensating/tuning layer on a substrate

Wire-bond process flow for copper metal-six, structures achieved th...

Method for fabricating microelectronic image projection devices

Selectable decoupling capacitors for integrated circuit and methods...

Forming a cap above a metal layer

Power gridding scheme

Method and apparatus for a linearized output driver and terminator

Structures to mechanically stabilize isolated top-level metal lines

Integrated circuit package

Wire-bond process flow for copper metal-six, structures achieved th...

Power gridding scheme

Selectable decoupling capacitors for integrated circuit and methods...

Ball limiting metallurgy for input/outputs and methods of fabrication

Semiconductor passivation deposition process for interfacial adhesion

Electronic assembly and cooling thereof

METHOD TO REDUCE TIMING SKEWS IN I/O CIRCUITS AND CLOCK DRIVERS CAU...