Krishna Vasanth VALAVALA

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package architecture including thermoelectric cooler structures
- Patent number 11,756,856
- Issue date Sep 12, 2023
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Annular silicon-embedded thermoelectric cooling devices for localiz...
- Patent number 11,694,942
- Issue date Jul 4, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state thermoelectric cooler in silicon backend layers for fas...
- Patent number 11,664,293
- Issue date May 30, 2023
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump integrated thermoelectric cooler
- Patent number 11,658,095
- Issue date May 23, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a thermoelectric cooler to reduce heat transfer between heat-...
- Patent number 11,462,457
- Issue date Oct 4, 2022
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR
- Publication number 20230290706
- Publication date Sep 14, 2023
- Intel Corporation
- Gaurav Patankar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK AND THIN TRACES IN A BRIDGE WITH A GLASS CORE
- Publication number 20230100576
- Publication date Mar 30, 2023
- Intel Corporation
- Andrew COLLINS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH FLIPPED HIGH BANDWIDTH MEMORY DEVICE
- Publication number 20230081139
- Publication date Mar 16, 2023
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE THERMOELECTRIC COOLER IN SILICON BACKEND LAYERS FOR FAS...
- Publication number 20210125897
- Publication date Apr 29, 2021
- Intel Corporation
- Krishna Vasanth VALAVALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP INTEGRATED THERMOELECTRIC COOLER
- Publication number 20200312742
- Publication date Oct 1, 2020
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLER TO ENHANCE THERMAL-MECHANICAL PACKAGE PERFORM...
- Publication number 20200312741
- Publication date Oct 1, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANNULAR SILICON-EMBEDDED THERMOELECTRIC COOLING DEVICES FOR LOCALIZ...
- Publication number 20200126888
- Publication date Apr 23, 2020
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE INCLUDING THERMOELECTRIC COOLER STRUCTURES
- Publication number 20200105639
- Publication date Apr 2, 2020
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING A THERMOELECTRIC COOLER TO REDUCE HEAT TRANSFER BETWEEN HEAT-...
- Publication number 20200098664
- Publication date Mar 26, 2020
- Intel Corporation
- Krishna Vasanth VALAVALA
- H01 - BASIC ELECTRIC ELEMENTS

Krishna Vasanth VALAVALA

Person

Patents Grantslast 30 patents

Package architecture including thermoelectric cooler structures

Annular silicon-embedded thermoelectric cooling devices for localiz...

Solid state thermoelectric cooler in silicon backend layers for fas...

Bump integrated thermoelectric cooler

Using a thermoelectric cooler to reduce heat transfer between heat-...

Patents Applicationslast 30 patents

VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR

THICK AND THIN TRACES IN A BRIDGE WITH A GLASS CORE

INTEGRATED CIRCUIT PACKAGE WITH FLIPPED HIGH BANDWIDTH MEMORY DEVICE

SOLID STATE THERMOELECTRIC COOLER IN SILICON BACKEND LAYERS FOR FAS...

BUMP INTEGRATED THERMOELECTRIC COOLER

THERMOELECTRIC COOLER TO ENHANCE THERMAL-MECHANICAL PACKAGE PERFORM...

ANNULAR SILICON-EMBEDDED THERMOELECTRIC COOLING DEVICES FOR LOCALIZ...

PACKAGE ARCHITECTURE INCLUDING THERMOELECTRIC COOLER STRUCTURES

USING A THERMOELECTRIC COOLER TO REDUCE HEAT TRANSFER BETWEEN HEAT-...