Krishnan Kelappan

Person

Carrollton, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package including embedded thin-film battery
- Patent number 9,012,264
- Issue date Apr 21, 2015
- STMicroelectronics, Inc.
- Michael J. Hundt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package including embedded thin-film battery
- Patent number 8,766,435
- Issue date Jul 1, 2014
- STMicroelectronics, Inc.
- Michael J. Hundt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
BGA memory module with battery pack
- Patent number 6,846,186
- Issue date Jan 25, 2005
- STMicroelectronics, Inc.
- Tom Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable integrated circuit package with low-profile detac...
- Patent number 5,570,273
- Issue date Oct 29, 1996
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable integrated circuit package with detachable module
- Patent number 5,557,504
- Issue date Sep 17, 1996
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for achieving printed circuit board planarity
- Patent number 5,491,889
- Issue date Feb 20, 1996
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded package integrated circuit with electrochemical cell
- Patent number 5,451,715
- Issue date Sep 19, 1995
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socketed integrated circuit package
- Patent number D359028
- Issue date Jun 6, 1995
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Detachable integrated circuit module
- Patent number D358805
- Issue date May 30, 1995
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Detachable integrated circuit module
- Patent number D358804
- Issue date May 30, 1995
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Socketed integrated circuit package
- Patent number D358806
- Issue date May 30, 1995
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Low-profile detachable integrated circuit module
- Patent number D354275
- Issue date Jan 10, 1995
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Low-profile detachable integrated circuit module
- Patent number D354274
- Issue date Jan 10, 1995
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Integrated circuit package with molded cell
- Patent number 5,196,374
- Issue date Mar 23, 1993
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY
- Publication number 20140315334
- Publication date Oct 23, 2014
- Michael J. Hundt
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
Integrated circuit package including embedded thin-film battery
- Publication number 20060001137
- Publication date Jan 5, 2006
- STMicroelectronics, Inc.
- Michael J. Hundt
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
BGA memory module with self-contained battery pack
- Publication number 20030201751
- Publication date Oct 30, 2003
- STMicroelectronics, Inc.
- Tom Lao
- H01 - BASIC ELECTRIC ELEMENTS

Krishnan Kelappan

Person

Patents Grantslast 30 patents

Integrated circuit package including embedded thin-film battery

Integrated circuit package including embedded thin-film battery

BGA memory module with battery pack

Surface mountable integrated circuit package with low-profile detac...

Surface mountable integrated circuit package with detachable module

Apparatus for achieving printed circuit board planarity

Molded package integrated circuit with electrochemical cell

Socketed integrated circuit package

Detachable integrated circuit module

Detachable integrated circuit module

Socketed integrated circuit package

Low-profile detachable integrated circuit module

Low-profile detachable integrated circuit module

Integrated circuit package with molded cell

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY

Integrated circuit package including embedded thin-film battery

BGA memory module with self-contained battery pack