Krystyna W. Semkow

Person

Poughquag, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,244,917
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,171,102
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,094,657
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 10,403,590
- Issue date Sep 3, 2019
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 10,396,051
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 9,640,501
- Issue date May 2, 2017
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 9,472,520
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Virendra R. Jadhav
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electromigration-resistant lead-free solder interconnect structures
- Patent number 9,379,007
- Issue date Jun 28, 2016
- Globalfoundries Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under ball metallurgy (UBM) for improved electromigration
- Patent number 9,142,501
- Issue date Sep 22, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 9,111,816
- Issue date Aug 18, 2015
- International Business Machines Corporation
- Virendra R. Jadhav
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Under ball metallurgy (UBM) for improved electromigration
- Patent number 9,084,378
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures for improving current carrying capability of interconnec...
- Patent number 9,035,459
- Issue date May 19, 2015
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,922,019
- Issue date Dec 30, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,910,853
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures for improving current carrying capability of interconnec...
- Patent number 8,803,317
- Issue date Aug 12, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,749,059
- Issue date Jun 10, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,741,769
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,674,506
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-anode system for uniform plating of alloys
- Patent number 8,623,194
- Issue date Jan 7, 2014
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,610,283
- Issue date Dec 17, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underbump metallurgy employing an electrolytic Cu / electorlytic Ni...
- Patent number 8,587,112
- Issue date Nov 19, 2013
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-anode system for uniform plating of alloys
- Patent number 8,551,303
- Issue date Oct 8, 2013
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,493,746
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,446,006
- Issue date May 21, 2013
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset solder vias, methods of manufacturing and design structures
- Patent number 8,298,929
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 8,293,587
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Virendra R Jadhav
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Creation of lead-free solder joint with intermetallics
- Patent number 8,268,716
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni...
- Patent number 8,232,655
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-anode system for uniform plating of alloys
- Patent number 8,177,945
- Issue date May 15, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Selective etch of TiW for capture pad formation
- Patent number 8,025,812
- Issue date Sep 27, 2011
- International Business Machines Corporation
- Carla A. Bailey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326242
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326243
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190157230
- Publication date May 23, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20170170135
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20170133338
- Publication date May 11, 2017
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20150054152
- Publication date Feb 26, 2015
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION
- Publication number 20140339699
- Publication date Nov 20, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION
- Publication number 20140262458
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- Publication number 20140054778
- Publication date Feb 27, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20130284495
- Publication date Oct 31, 2013
- Charles L. Arvin
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130249066
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130252418
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20130234329
- Publication date Sep 12, 2013
- Intetnational Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- Publication number 20130157458
- Publication date Jun 20, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS
- Publication number 20120325667
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL-GRAPHITE FOAM COMPOSITE AND A COOLING APPARATUS FOR USING THE...
- Publication number 20120328789
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Minhua Lu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20120312447
- Publication date Dec 13, 2012
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERBUMP METALLURGY EMPLOYING AN ELECTROLYTIC Cu / ELECTORLYTIC Ni...
- Publication number 20120198692
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...
- Publication number 20120187558
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20120181071
- Publication date Jul 19, 2012
- International Business Machines Corporation
- VIRENDRA R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- Publication number 20120168952
- Publication date Jul 5, 2012
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS
- Publication number 20120152750
- Publication date Jun 21, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES
- Publication number 20120139123
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS
- Publication number 20120083113
- Publication date Apr 5, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20110147922
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- Publication number 20110079907
- Publication date Apr 7, 2011
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...
- Publication number 20100258335
- Publication date Oct 14, 2010
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20100200271
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump Pad Metallurgy Employing An Electrolytic Cu / Electorlytic Ni...
- Publication number 20090174045
- Publication date Jul 9, 2009
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH TIN SOLDER ETCHING SOLUTION
- Publication number 20090120999
- Publication date May 14, 2009
- International Business Machines Corporation
- Richard F. Indyk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Krystyna W. Semkow

Person

Patents Grantslast 30 patents

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Electromigration-resistant lead-free solder interconnect structures

Under ball metallurgy (UBM) for improved electromigration

Multilayer pillar for reduced stress interconnect and method of mak...

Under ball metallurgy (UBM) for improved electromigration

Structures for improving current carrying capability of interconnec...

Semiconductor device having a copper plug

Additives for grain fragmentation in Pb-free Sn-based solder

Structures for improving current carrying capability of interconnec...

Semiconductor device having a copper plug

Semiconductor device having a copper plug

Structures and methods to reduce maximum current density in a solde...

Multi-anode system for uniform plating of alloys

Semiconductor device having a copper plug

Underbump metallurgy employing an electrolytic Cu / electorlytic Ni...

Multi-anode system for uniform plating of alloys

Additives for grain fragmentation in Pb-free Sn-based solder

Structures and methods to reduce maximum current density in a solde...

Offset solder vias, methods of manufacturing and design structures

Multilayer pillar for reduced stress interconnect and method of mak...

Creation of lead-free solder joint with intermetallics

Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni...

Multi-anode system for uniform plating of alloys

Selective etch of TiW for capture pad formation

Patents Applicationslast 30 patents

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION

UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION

SEMICONDUCTOR DEVICE HAVING A COPPER PLUG

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

SEMICONDUCTOR DEVICE HAVING A COPPER PLUG

MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS

METAL-GRAPHITE FOAM COMPOSITE AND A COOLING APPARATUS FOR USING THE...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

UNDERBUMP METALLURGY EMPLOYING AN ELECTROLYTIC Cu / ELECTORLYTIC Ni...

STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

SEMICONDUCTOR DEVICE HAVING A COPPER PLUG

MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS

OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES

CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

SEMICONDUCTOR DEVICE HAVING A COPPER PLUG

STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

Bump Pad Metallurgy Employing An Electrolytic Cu / Electorlytic Ni...

HIGH TIN SOLDER ETCHING SOLUTION